电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

GS816218D-150

产品描述1M x 18, 512K x 36, 256K x 72 18Mb Sync Burst SRAMs
产品类别存储    存储   
文件大小969KB,共41页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
下载文档 详细参数 全文预览

GS816218D-150概述

1M x 18, 512K x 36, 256K x 72 18Mb Sync Burst SRAMs

GS816218D-150规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称GSI Technology
零件包装代码BGA
包装说明LBGA,
针数165
Reach Compliance Codeunknow
ECCN代码3A991.B.2.B
最长访问时间7.5 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度18874368 bi
内存集成电路类型CACHE SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1MX18
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度1.4 mm
最大供电电压 (Vsup)2.7 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm

文档预览

下载PDF文档
GS816218(B/D)/GS816236(B/D)/GS816272(C)
119-, 165-, & 209-Bump BGA
Commercial Temp
Industrial Temp
Features
1M x 18, 512K x 36, 256K x 72
18Mb Sync Burst SRAMs
250 MHz–133 MHz
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
Functional Description
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
ica
ti o
n
sp
ec
if
x3
6
pa
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
rt
s
in
th
is
Parameter Synopsis
-250
t
KQ
tCycle
Curr (x18)
Curr (x36)
Curr (x72)
t
KQ
tCycle
Curr (x18)
Curr (x36)
Curr (x72)
2.5
4.0
280
330
n/a
5.5
5.5
175
200
n/a
ar
eN
ot
Applications
The GS816218(B/D)/GS816236(B/D)/GS816272(C) is an
18,874,368-bit high performance synchronous SRAM with a 2-bit
burst address counter. Although of a type originally developed for
Level 2 Cache applications supporting high performance CPUs,
the device now finds application in synchronous SRAM
applications, ranging from DSP main store to networking chip set
support.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
FLXDrive™
The ZQ pin allows selection between high drive strength (ZQ low)
for multi-drop bus applications and normal drive strength (ZQ
floating or high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High)
of the ZZ signal, or by stopping the clock (CK). Memory data is
retained during Sleep mode.
Core and Interface Voltages
The GS816218(B/D)/GS816236(B/D)/GS816272(C) operates on
a 2.5 V or 3.3 V power supply. All input are 3.3 V and 2.5 V
compatible. Separate output power (V
DDQ
) pins are used to
decouple output noise from the internal circuits and are 3.3 V and
2.5 V compatible.
x1
8a
nd
-225
2.7
4.4
255
300
n/a
6.0
6.0
165
190
n/a
Re
co
m
-200
3.0
5.0
230
270
350
6.5
6.5
160
180
225
m
-166
3.4
6.0
200
230
300
7.0
7.0
150
170
115
en
d
ed
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 2.5 V or 3.3 V +10%/–10% core power supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to SCD x18/x36 Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 119-, 165-, and 209-bump BGA package
SCD and DCD Pipelined Reads
The GS816218(B/D)/GS816236(B/D)/GS816272(C) is a SCD
(Single Cycle Deselect) and DCD (Dual Cycle Deselect)
pipelined synchronous SRAM. DCD SRAMs pipeline disable
commands to the same degree as read commands. SCD SRAMs
pipeline deselect commands one stage less than read commands.
SCD RAMs begin turning off their outputs immediately after the
deselect command has been captured in the input registers. DCD
RAMs hold the deselect command for one full cycle and then
begin turning off their outputs just after the second rising edge of
clock. The user may configure this SRAM for either mode of
operation using the SCD mode input.
-150
3.8
6.7
185
215
270
7.5
7.5
145
165
210
fo
rN
ew
-133
4.0
7.5
165
190
245
8.5
8.5
135
150
185
Pipeline
3-1-1-1
3.3 V
Th
e
Flow Through
2-1-1-1
3.3 V
Rev: 2.17 11/2004
1/41
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
De
sig
n
Unit
ns
ns
mA
mA
mA
ns
ns
mA
mA
mA
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
© 1999, GSI Technology
.
请教下关于STR731的工作频率的问题
看过STR731的资料,那本书,发现我现在用的是8M外部晶振,这样系统最高只能工作在8M下,而上电默认为4M,要想使系统工作在36M的频率下外部晶振得用6MHz,二分频后为3MHz,12倍频后为36MHz ......
yewuyi stm32/stm8
请较关于数字滤波器的问题
我刚接触DSP,我想知道,用DSP实现数字滤波器时,需用AD采集数据,如果是一个断续的输入信号,如附件所示,怎么样知道采集信号是一个周期的信号?谢谢!...
lgp0922lgp DSP 与 ARM 处理器
改模拟电路
寻求高手帮我改一下电路,费用可谈。 ...
xumin888 模拟电子
请教如何在wince下获取NandFlash的剩余存储空间
请教: 1)如何在wince下获取NandFlash的剩余空间? 2)如何在wince下获取U盘的剩余存储空间? 3)如何在wince下获取SD卡的剩余存储空间? 我是想在这上面的几种介质中保存文件,当剩余空 ......
Yonsen 嵌入式系统
TCP选项为5的格式
谁能帮忙给下TCP报文头选项为5的报文的格式,或帮忙解释下下面两个选项的作用 05 12 00 0b ef c4 00 0b f0 1a 00 0b ee 6b 00 0b ef 42 05 0a 00 0b eb 87 00 0b ec 33...
zhull1984 嵌入式系统
更薄更小封装体积功耗相比HT1621低15-30倍
超低功耗低工作电流低休眠电流LCD液晶驱动显示芯片 362501 362500 362499 ...
~小刺客 51单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1573  120  2839  1053  2083  32  3  58  22  42 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved