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74AHC244PW-T

产品描述Buffers & Line Drivers OCTAL BUFFER 3-STATE
产品类别逻辑    逻辑   
文件大小89KB,共17页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74AHC244PW-T概述

Buffers & Line Drivers OCTAL BUFFER 3-STATE

74AHC244PW-T规格参数

参数名称属性值
Source Url Status Check Date2013-06-14 00:00:00
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码TSSOP
包装说明TSSOP, TSSOP20,.25
针数20
Reach Compliance Codeunknown
控制类型ENABLE LOW
系列AHC/VHC/H/U/V
JESD-30 代码R-PDSO-G20
JESD-609代码e4
长度6.5 mm
逻辑集成电路类型BUS DRIVER
最大I(ol)0.008 A
湿度敏感等级1
位数4
功能数量2
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP20,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源2/5.5 V
Prop。Delay @ Nom-Sup9.5 ns
传播延迟(tpd)15 ns
认证状态Not Qualified
座面最大高度1.1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层NICKEL PALLADIUM GOLD
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度4.4 mm
Base Number Matches1

文档预览

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74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
Rev. 05 — 20 December 2007
Product data sheet
1. General description
The 74AHC244; 74AHCT244 is a high-speed Si-gate CMOS device.
The 74AHC244; 74AHCT244 has octal non-inverting buffer/line drivers with 3-state
outputs. The 3-state outputs are controlled by the output enable inputs (nOE). A HIGH on
nOE causes the outputs to assume a high-impedance OFF-state.
2. Features
s
s
s
s
s
s
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than V
CC
For 74AHC244 only: operates with CMOS input levels
For 74AHCT244 only: operates with TTL input levels
ESD protection:
x
HBM JESD22-A114E exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
x
CDM JESD22-C101C exceeds 1000 V
s
Multiple package options
s
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC244D
74AHCT244D
74AHC244PW
74AHCT244PW
74AHC244BQ
74AHCT244BQ
−40 °C
to +125
°C
DHVQFN20
−40 °C
to +125
°C
TSSOP20
−40 °C
to +125
°C
Name
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT360-1
Type number
plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm

74AHC244PW-T相似产品对比

74AHC244PW-T 74AHC244D 74AHCT244PW-T 74AHC244BQ-G 74AHC244PW 74AHC244D-T 74AHCT244BQ-G 74AHCT244D-T
描述 Buffers & Line Drivers OCTAL BUFFER 3-STATE Buffers u0026 Line Drivers OCTAL BUFFER 3-STATE Buffers u0026 Line Drivers OCTAL BUFFER 3-STATE Buffers u0026 Line Drivers OCTAL BUFFER 3-STATE Buffers & Line Drivers OCTAL BUFFER 3-STATE Buffers & Line Drivers OCTAL BUFFER 3-STATE Buffers & Line Drivers OCTAL BUFFER 3-STATE Buffers & Line Drivers OCTAL BUFFER 3-STATE
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 TSSOP, TSSOP20,.25 SOP, SOP20,.4 TSSOP, TSSOP20,.25 QCCN, LCC20,.1X.18,20 TSSOP, TSSOP20,.25 SOP, SOP20,.4 QCCN, LCC20,.1X.18,20 SOP, SOP20,.4
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
控制类型 ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
位数 4 4 4 4 4 4 4 4
功能数量 2 2 2 2 2 2 2 2
端子数量 20 20 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SOP TSSOP QCCN TSSOP SOP QCCN SOP
封装等效代码 TSSOP20,.25 SOP20,.4 TSSOP20,.25 LCC20,.1X.18,20 TSSOP20,.25 SOP20,.4 LCC20,.1X.18,20 SOP20,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE CHIP CARRIER SMALL OUTLINE
电源 2/5.5 V 2/5.5 V 5 V 2/5.5 V 2/5.5 V 2/5.5 V 5 V 5 V
Prop。Delay @ Nom-Sup 9.5 ns 13.5 ns 10.5 ns 9.5 ns 13.5 ns 9.5 ns 10.5 ns 10.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING GULL WING NO LEAD GULL WING GULL WING NO LEAD GULL WING
端子节距 0.65 mm 1.27 mm 0.65 mm 0.5 mm 0.65 mm 1.27 mm 0.5 mm 1.27 mm
端子位置 DUAL DUAL DUAL QUAD DUAL DUAL QUAD DUAL
零件包装代码 TSSOP SOIC TSSOP - TSSOP SOIC - SOIC
针数 20 20 20 - 20 20 - 20
系列 AHC/VHC/H/U/V AHC/VHC/H/U/V AHCT/VHCT/VT - AHC/VHC/H/U/V AHC/VHC/H/U/V - AHCT/VHCT/VT
JESD-609代码 e4 e4 e4 - e4 e4 - e4
长度 6.5 mm 12.8 mm 6.5 mm - 6.5 mm 12.8 mm - 12.8 mm
湿度敏感等级 1 1 1 - 1 1 - 1
端口数量 2 2 2 - 2 2 - 2
包装方法 TAPE AND REEL - TAPE AND REEL TUBE - TAPE AND REEL TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 260 260 - 260 260 - 260
传播延迟(tpd) 15 ns 15 ns 10.5 ns - 15 ns 15 ns - 10.5 ns
座面最大高度 1.1 mm 2.65 mm 1.1 mm - 1.1 mm 2.65 mm - 2.65 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V - 5.5 V
最小供电电压 (Vsup) 2 V 2 V 4.5 V - 2 V 2 V - 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V - 5 V 5 V 5 V 5 V
端子面层 NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD
处于峰值回流温度下的最长时间 30 30 30 - 30 30 - 30
宽度 4.4 mm 7.5 mm 4.4 mm - 4.4 mm 7.5 mm - 7.5 mm

 
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