Interface Development Tools SAEJ2602-2 Dual LIN Physical Layer
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | NXP(恩智浦) |
| 产品种类 Product Category | Interface Development Tools |
| 单位重量 Unit Weight | 8 oz |
| KIT33663LEFEVB | MC33663AJEFR2 | MC33663ASEFR2 | MC33663ASEF | MC33663ALEF | MC33663ALEFR2 | |
|---|---|---|---|---|---|---|
| 描述 | Interface Development Tools SAEJ2602-2 Dual LIN Physical Layer | LIN Transceivers dual LINcell | LIN Transceivers dual LINcell | LIN Transceivers dual LINcell | LIN Transceivers dual LINcell | LIN Transceivers dual LINcell |
| Brand Name | - | Freescale | Freescale | Freescale | Freescale | Freescale |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | - | 1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14 | 1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14 | 1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14 | 1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14 | 1.27 MM PITCH, ROHS COMPLIANT, MS-012AB, SOIC-14 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | - | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | - | e3 | e3 | e3 | e3 | e3 |
| 长度 | - | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm |
| 湿度敏感等级 | - | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | SOP | SOP | SOP | SOP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 |
| 座面最大高度 | - | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 标称供电电压 | - | 13.5 V | 13.5 V | 13.5 V | 13.5 V | 13.5 V |
| 表面贴装 | - | YES | YES | YES | YES | YES |
| 电信集成电路类型 | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | 40 | 40 |
| 宽度 | - | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
工作这点儿事
嵌入式系统
PCB设计
求职招聘
单片机
stm32/stm8
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
