4 Pad Ceramic Package, 5 mm x 7 mm
Product Features:
Small SMD Package
AT Cut Perfomance
Compatible with Leadfree Processing
Supplied in Tape and Reel
ILCX04 Series
Applications:
Fibre Channel
Server & Storage
USB
802.11 / Wifi
PC’s
2
5.0
3
4
7.0
1
Frequency
6 MHz to 100 MHz
1.30 Max.
1.2
ESR (Equivalent Series Resistance)
1
2
6.0 MHz – 13.9 MHz
14 MHz – 40 MHz
rd
33 MHz – 39.9 MHz (3 O.T.)
rd
40.0 MHz – 100.0 MHz (3 O.T.)
60 Max.
40 Max.
100 Max.
80 Max.
4
2.54
5.08
3
1.0
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
7 pF Max.
30 ppm Standard (see Part Number Guide for more options)
Connection Diagram
2
1
50 ppm Standard (see Part Number Guide for more options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
100 uW Max.
5 ppm Max. / Year Standard
3
4
Recommended pad layout
2.2
1.4
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
2.54
6.4
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX04 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX04 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
18 pF Standard
Or Specify
- 20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package, 5 mm x 7 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX04 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Frequency, Date Code
e-mail@ilsiamerica.com
•
www.ilsiamerica.com
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 2
stm32/stm8
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