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NSV60100DMTWTBG

产品描述Bipolar Transistors - BJT DUAL 60V 1A LOWVCESA
产品类别分立半导体    晶体管   
文件大小110KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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NSV60100DMTWTBG概述

Bipolar Transistors - BJT DUAL 60V 1A LOWVCESA

NSV60100DMTWTBG规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
厂商名称ON Semiconductor(安森美)
包装说明WDFN-6
制造商包装代码506AN
Reach Compliance Codecompliant
Factory Lead Time6 weeks
外壳连接COLLECTOR
最大集电极电流 (IC)1 A
基于收集器的最大容量18 pF
集电极-发射极最大电压60 V
配置SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE)40
JESD-30 代码S-PDSO-N6
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量6
最高工作温度150 °C
最低工作温度-55 °C
封装主体材料PLASTIC/EPOXY
封装形状SQUARE
封装形式SMALL OUTLINE
极性/信道类型PNP
最大功率耗散 (Abs)1.8 W
参考标准AEC-Q101
表面贴装YES
端子面层Tin (Sn)
端子形式NO LEAD
端子位置DUAL
晶体管应用SWITCHING
晶体管元件材料SILICON
标称过渡频率 (fT)155 MHz
VCEsat-Max0.3 V

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NSS60100DMT
60 V, 1 A, Low V
CE(sat)
PNP
Transistors
ON Semiconductor’s e
2
PowerEdge family of low V
CE(sat)
transistors are miniature surface mount devices featuring ultra low
saturation voltage (V
CE(sat)
) and high current gain capability. These
are designed for use in low voltage, high speed switching applications
where affordable efficient energy control is important.
Typical applications are DC−DC converters and LED lightning,
power management…etc. In the automotive industry they can be used
in air bag deployment and in the instrument cluster. The high current
gain allows e
2
PowerEdge devices to be driven directly from PMU’s
control outputs, and the Linear Gain (Beta) makes them ideal
components in analog amplifiers.
Features
www.onsemi.com
60 Volt, 1 Amp
PNP Low V
CE(sat)
Transistors
MARKING
DIAGRAM
WDFN6
CASE 506AN
1
1
2 AP MG
G
3
6
5
4
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
NSV60100DMTWTBG − Wettable Flanks Device
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T
A
= 25°C)
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current − Continuous
Collector Current − Peak
Symbol
V
CEO
V
CBO
V
EBO
I
C
I
CM
Max
60
60
6
1
2
Unit
Vdc
Vdc
Vdc
A
A
AP = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction−to−Ambient
(Notes 1 and 2)
Total Power Dissipation per Package @
T
A
= 25°C (Note 2)
Thermal Resistance Junction−to−Ambient
(Note 3)
Power Dissipation per Transistor @ T
A
= 25°C
(Note 3)
Junction and Storage Temperature Range
Symbol
R
qJA
P
D
R
qJA
P
D
T
J
, T
stg
Max
55
2.27
69
1.8
−55 to
+150
Unit
°C/W
W
°C/W
W
°C
ORDERING INFORMATION
Device
NSS60100DMTTBG
NSV60100DMTWTBG
Package
WDFN6
(Pb−Free)
WDFN6
(Pb−Free)
Shipping
3000/Tape &
Reel
3000/Tape &
Reel
1. Per JESD51−7 with 100 mm
2
pad area and 2 oz. Cu (Dual Operation).
2. P
D
per Transistor when both are turned on is one half of Total P
D
or 1.13 Watts.
3. Per JESD51−7 with 100 mm
2
pad area and 2 oz. Cu (Single−Operation).
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2014
1
November, 2014 − Rev. 1
Publication Order Number:
NSS60100DMT/D

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