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89HPES24N3YDBXG

产品描述PCI Interface IC PCIE 24-LANE 3-PORT NTS
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小262KB,共30页
制造商IDT (Integrated Device Technology)
标准
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89HPES24N3YDBXG概述

PCI Interface IC PCIE 24-LANE 3-PORT NTS

89HPES24N3YDBXG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码SBGA
包装说明27 X 27 MM, 1 MM PITCH, GREEN, BGA-420
针数420
制造商包装代码BXG420
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性ALSO REQUIRES 3.3V SUPPLY
最大时钟频率125 MHz
JESD-30 代码S-PBGA-B420
JESD-609代码e1
长度27 mm
湿度敏感等级3
端子数量420
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA420,26X26,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)260
电源1,3.3 V
认证状态Not Qualified
座面最大高度1.7 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度27 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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24-Lane 3-Port PCI Express®
Switch
89HPES24N3
Data Sheet
Device Overview
The 89HPES24N3 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions offering the next-generation I/O intercon-
nect standard. The PES24N3 is a 24-lane, 3-port peripheral chip that
performs PCI Express Base switching with a feature set optimized for
high performance applications such as servers, storage, and communi-
cations/networking. It provides high-performance I/O connectivity and
switching functions between a PCIe® upstream port and two down-
stream ports or peer-to-peer switching between downstream ports.
Features
High Performance PCI Express Switch
– 24 PCI Express lanes (2.5Gbps), 3 switch ports
– Delivers 12 GBps (96 Gbps) aggregate switching capacity
– Low latency cut-through switch architecture
– Supports 128 to 2048 byte maximum payload size
– Supports one virtual channel
– PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
– Port arbitration schemes utilizing round robin or weighted
round robin algorithms
– Supports automatic per port link with negotiation (x8, x4, x2, or
x1)
– Supports static lane reversal on all ports
– Supports polarity inversion
– Supports locked transactions, allowing use with legacy soft-
ware
– Ability to load device configuration from serial EEPROM
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates 24 2.5 Gbps embedded SerDes, 8B/10B encoder/
decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC passed through
– Supports PCI Express Native Hot-Plug
• Compatible with Hot-Plug I/O expanders used on PC moth-
erboards
– Supports Hot-Swap
Power Management
– Supports PCI Express Power Management Interface specifi-
cation, Revision 1.1 (PCI-PM)
– Unused SerDes are disabled
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in SerDes Pseudo-Random Bit Stream (PRBS) generator
– Ability to read and write any internal register via the SMBus
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
24 PCI Express Lanes
x8 Upstream Port and Two x8 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
1 of 30
©
2006 Integrated Device Technology, Inc.
July 18, 2006
DSC 6802

89HPES24N3YDBXG相似产品对比

89HPES24N3YDBXG 89HPES24N3YDBX 89HPES24N3YCBX 89HPES24N3YCBXG
描述 PCI Interface IC PCIE 24-LANE 3-PORT NTS PCI Interface IC PCIE 24-LANE 3-PORT NTS PCI Interface IC PCIE 24-LANE 3-PORT NTS PCI Interface IC PCIE 24-LANE 3-PORT NTS
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 含铅 含铅 不含铅
是否Rohs认证 符合 不符合 不符合 符合
零件包装代码 SBGA SBGA SBGA SBGA
包装说明 27 X 27 MM, 1 MM PITCH, GREEN, BGA-420 27 X 27 MM, 1 MM PITCH, BGA-420 BGA-420 BGA-420
针数 420 420 420 420
制造商包装代码 BXG420 BX420 BX420 BXG420
Reach Compliance Code compliant not_compliant not_compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
其他特性 ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
最大时钟频率 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B420 S-PBGA-B420 S-PBGA-B420 S-PBGA-B420
JESD-609代码 e1 e0 e0 e1
长度 27 mm 27 mm 27 mm 27 mm
湿度敏感等级 3 3 3 3
端子数量 420 420 420 420
最高工作温度 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LBGA LBGA
封装等效代码 BGA420,26X26,40 BGA420,26X26,40 BGA420,26X26,40 BGA420,26X26,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度) 260 225 225 260
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.7 mm 1.7 mm 1.7 mm 1.7 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 20 20 30
宽度 27 mm 27 mm 27 mm 27 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
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