电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

71V65803S150PFG8

产品描述SRAM 512Kx18 ZBT SYNC 3.3V PIPELINED SRAM
产品类别存储    存储   
文件大小394KB,共26页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 全文预览

71V65803S150PFG8在线购买

供应商 器件名称 价格 最低购买 库存  
71V65803S150PFG8 - - 点击查看 点击购买

71V65803S150PFG8概述

SRAM 512Kx18 ZBT SYNC 3.3V PIPELINED SRAM

71V65803S150PFG8规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码TQFP
包装说明LQFP, QFP100,.63X.87
针数100
制造商包装代码PKG100
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
Samacsys DescriptionTQFP 14.0 X 20.0 X 1.4 MM
最长访问时间3.8 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)150 MHz
I/O 类型COMMON
JESD-30 代码R-PQFP-G100
JESD-609代码e3
长度20 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量100
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP100,.63X.87
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.04 A
最小待机电流3.14 V
最大压摆率0.325 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
ZBT™ Feature
3.3V I/O, Burst Counter
Pipelined Outputs
Features
IDT71V65603/Z
IDT71V65803/Z
Description
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
Positive clock-edge triggered address, data, and control signal
registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array(fBGA).
The IDT71V65603/5803 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or writes and
reads. Thus, they have been given the name ZBT
TM
, or Zero Bus Turn-
around.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65603/5803 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65603/5803
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE1, CE2,
CE2)
that allow the user
to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be
initiated. However, any pending data transfers (reads or writes) will be
completed. The data bus will tri-state two cycles after chip is deselected
or a write is initiated.
The IDT71V65603/5803 have an on-chip burst counter. In the burst
mode, the IDT71V65603/5803 can provide four cycles of data for a
single address presented to the SRAM. The order of the burst
sequence is defined by the
LBO
input pin. The
LBO
pin selects
between linear and interleaved burst sequence. The ADV/LD signal is
used to load a new external address (ADV/LD = LOW) or increment
the internal burst counter (ADV/LD = HIGH).
The IDT71V65603/5803 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA) .
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5304 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2008
DSC-5304/08
1
©2008 Integrated Device Technology, Inc.
uPyCraft ----- micropython 专用IDE
https://dfrobot.gitbooks.io/upycraft_cn/content/assets/uPyCraft.png uPyCraft软件简介 此内容由EEWORLD论坛网友秦皇岛岛主原创,如需转载或用于商业用途需征得作者同意并注明出 ......
秦皇岛岛主 MicroPython开源版块
富士通FM3板子JP2啥意思啊?
今天,看了下原理图发现,JP2写的是5V或3.3V,不明白啥意思。请大家讲讲。 附部分原理图及说明截图。 91294 91295...
ddllxxrr DIY/开源硬件专区
步步惊芯--软核处理器内部设计分析 光盘
步步惊芯--软核处理器内部设计分析 随书光盘 221908 ...
白丁 FPGA/CPLD
有关电源的资料 很全的
本帖最后由 paulhyde 于 2014-9-15 09:39 编辑 这里面是我最近搜到的不少电源的资料 感觉有用的来看看吧 ...
蝴蝶好小子 电子竞赛
这里有人画过4层板的吗?趁着这国庆期间··我想练习下画4层板啊
漫漫长假不知道干嘛好··哪位大侠有画4层板的电路图呢··给我共享一份吧··小女子在次谢过啦··:kiss:...
jasminebilin PCB设计
社区活动的礼品怎么领
领礼品时还需要在帖子下回复说知道了么,管理员会给通知么,比如手机或QQ什么的。谢谢 ...
Solo_M 为我们提建议&公告

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2655  692  2642  1549  2701  46  6  21  1  8 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved