电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

NLAS4717FCT1G

产品描述Analog Switch ICs Dual SPDT Analog Sw. Low R(on) Ind. Temp
产品类别模拟混合信号IC    信号电路   
文件大小116KB,共10页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 全文预览

NLAS4717FCT1G在线购买

供应商 器件名称 价格 最低购买 库存  
NLAS4717FCT1G - - 点击查看 点击购买

NLAS4717FCT1G概述

Analog Switch ICs Dual SPDT Analog Sw. Low R(on) Ind. Temp

NLAS4717FCT1G规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
零件包装代码BGA
包装说明VFBGA, BGA10,3X4,20
针数10
制造商包装代码489AA
Reach Compliance Codecompliant
Factory Lead Time1 week
模拟集成电路 - 其他类型SPDT
JESD-30 代码R-PBGA-B10
JESD-609代码e1
长度1.965 mm
湿度敏感等级1
正常位置NC
信道数量1
功能数量2
端子数量10
标称断态隔离度75 dB
通态电阻匹配规范0.1 Ω
最大通态电阻 (Ron)4.5 Ω
最高工作温度85 °C
最低工作温度-40 °C
输出SEPARATE OUTPUT
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA10,3X4,20
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
电源2/5 V
认证状态Not Qualified
座面最大高度0.65 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)3 V
表面贴装YES
最长断开时间40 ns
最长接通时间30 ns
切换BREAK-BEFORE-MAKE
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
宽度1.465 mm
Base Number Matches1

文档预览

下载PDF文档
NLAS4717
4.5
W
High Bandwidth, Dual
SPDT Analog Switch
The NLAS4717 is an advanced CMOS analog switch fabricated in
sub-micron silicon gate CMOS technology. The device is a dual
independent Single Pole Double Throw (SPDT) switch featuring two
low R
DS(on)
of 4.5
W
at 3.0 V.
The device also features guaranteed Break-Before-Make (BBM)
switching, assuring the switches never short the driver.
The NLAS4717 is available in two small size packages:
Micro10:
3.0 x 5.0 mm
Flip-Chip-10:
2.0 x 1.5 mm
Features
http://onsemi.com
MARKING
DIAGRAMS
Low R
DS(on)
: 4.5
W
@ 3.0 V
Matching Between the Switches
±0.5
W
Wide Low Voltage Range: 1.8 V to 5.5 V
High Bandwidth > 40 MHz
1.65 V to 5.5 V Operating Range
Low Threshold Voltages on Pins 4 and 8 (CTRL Pins)
Ultra-Low Charge Injection
6.0 pC
Low Standby Current – I
CC
= 1.0 nA (Max) @ T
A
= 25°C
OVT* on Pins 4 and 8 (CTRL Logic Pins)
Pb-Free Packages are Available
A1
FLIP-CHIP-10
CASE 489AA
A1
10
4717
AYWW
G
G
Micro10
CASE 846B
A
Y
W, WW
G
4717
AYW
G
G
1
= Assembly Location
= Year
= Work Week
= Pb-Free Package
Typical Applications
Cell Phones
PDAs
MP3s
Digital Still Cameras
FUNCTION TABLE
IN_
0
1
NO_
OFF
ON
NC_
ON
OFF
Important Information
ESD Protection:
HBM = 2000 V, MM = 200 V
Latchup Max Rating: 200 mA (Per JEDEC EIA/JESD78)
Pin-to-Pin Compatible with MAX4717
*OVT
ORDERING INFORMATION
Device
NLAS4717FCT1
Package
Flip-Chip-10
Shipping
3000 /
Tape & Reel
3000 /
Tape & Reel
4000 /
Tape & Reel
4000 /
Tape & Reel
Overvoltage Tolerance (OVT) specific pins to operate higher than
normal supply voltages, with no damage to the devices or to signal
integrity.
NLAS4717FCT1G Flip-Chip-10
(Pb-Free)
NLAS4717MR2
Micro10
NLAS4717MR2G
Micro10
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2007
1
May, 2007 - Rev. 9
Publication Order Number:
NLAS4717/D

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 890  1030  217  497  1219  28  23  20  49  4 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved