
NOR Flash 2.7 to 3.6V 64Mbit Multi-Purpose Flash
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| Reach Compliance Code | compliant |
| Factory Lead Time | 5 weeks |
| 最长访问时间 | 70 ns |
| 启动块 | BOTTOM |
| 命令用户界面 | YES |
| 通用闪存接口 | YES |
| 数据轮询 | YES |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e3 |
| 内存密度 | 67108864 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 部门数/规模 | 2K |
| 端子数量 | 48 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP48,.8,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 电源 | 3/3.3 V |
| 认证状态 | Not Qualified |
| 部门规模 | 2K |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.035 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 切换位 | YES |
| 类型 | NOR TYPE |

| SST39VF6401B-70-4C-EKE-T | SST39VF6402B-70-4C-B1KE | SST39VF6402B-70-4I-B1KE | SST39VF6401B-70-4I-EKE-T | SST39VF6402B-70-4C-EKE | SST39VF6402B-70-4I-B1KE-T | |
|---|---|---|---|---|---|---|
| 描述 | NOR Flash 2.7 to 3.6V 64Mbit Multi-Purpose Flash | NOR Flash 64M (4Mx16) 70ns Commercial Temp | NOR Flash 64M (4Mx16) 70ns 2.7-3.6V Commercial | NOR Flash 2.7 to 3.6V 64Mbit Multi-Purpose Flash | NOR Flash 64M (4Mx16) 70ns Commercial Temp | NOR Flash 2.7 to 3.6V 64Mbit Multi-Purpose Flash |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| Factory Lead Time | 5 weeks | 6 weeks | 7 weeks | 11 weeks | 5 weeks | 9 weeks |
| 最长访问时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| 启动块 | BOTTOM | TOP | TOP | BOTTOM | TOP | TOP |
| 命令用户界面 | YES | YES | YES | YES | YES | YES |
| 通用闪存接口 | YES | YES | YES | YES | YES | YES |
| 数据轮询 | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-PDSO-G48 | R-PBGA-B48 | R-PBGA-B48 | R-PDSO-G48 | R-PDSO-G48 | R-PBGA-B48 |
| JESD-609代码 | e3 | e1 | e1 | e3 | e3 | e1 |
| 内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 部门数/规模 | 2K | 2K | 2K | 2K | 2K | 2K |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| 组织 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TFBGA | TFBGA | TSSOP | TSOP1 | FBGA |
| 封装等效代码 | TSSOP48,.8,20 | BGA48,6X8,32 | BGA48,6X8,32 | TSSOP48,.8,20 | TSSOP48,.8,20 | BGA48,6X8,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 部门规模 | 2K | 2K | 2K | 2K | 2K | 2K |
| 最大待机电流 | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| 最大压摆率 | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | GULL WING | BALL | BALL | GULL WING | GULL WING | BALL |
| 端子节距 | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm |
| 端子位置 | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | BOTTOM |
| 切换位 | YES | YES | YES | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 包装说明 | - | TFBGA, BGA48,6X8,32 | TFBGA, BGA48,6X8,32 | - | TSOP1, TSSOP48,.8,20 | FBGA, BGA48,6X8,32 |
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