NSR02F30MX
200 mA, 30 V Schottky
Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current that offers the most optimal
power dissipation in applications. They are housed in a spacing saving
x3DFN 0201 package ideal for space constraint applications.
Features
www.onsemi.com
•
•
•
•
X3DFN2
CASE 152AF
J
M
Typical Applications
•
•
•
•
•
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping and Protection
= Specific Device Code
=
(Rotated 180°)
= Month Code
ORDERING INFORMATION
Device
Package
X3DFN
(Pb−Free)
Shipping†
10000 / Tape &
Reel
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current (DC)
Forward Surge Current
(60 Hz @ 1 cycle)
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
ESD Rating: Human Body Model
Machine Model
Symbol
V
R
I
F
I
FSM
I
FRM
ESD
Value
30
200
2
1
2−4
>400
Unit
V
mA
A
A
kV
V
NSR02F30MXT5G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
©
Semiconductor Components Industries, LLC, 2016
1
April, 2016 − Rev. 1
Publication Order Number:
NSR02F30MX/D
J
Low Forward Voltage Drop − 500 mV (Typ.) @ I
F
= 200 mA
Low Reverse Current – 20
mA
(Typ.) @ V
R
= 30 V
200 mA of Continuous Forward Current
ESD Rating − Human Body Model: Class 2
− Machine Model: Class M3
− CDM: Class IV
•
High Switching Speed
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
Cathode
2
Anode
MARKING
DIAGRAM
PIN 1
M
NSR02F30MX
Table 1. THERMAL CHARACTERISTICS
Rating
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25_C
Storage Temperature Range
Junction Temperature
Symbol
R
θJA
P
D
T
stg
T
J
Max
695
180
−55 to +125
+125
Unit
°C/W
mW
°C
°C
1. Mounted onto a 4 in square FR−4 board 100 mm sq. 2 oz. Cu 0.06″ thick single sided. Operating to steady state.
Table 2. ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Parameter
Reverse Leakage
Reverse Leakage
Forward Voltage
Forward Voltage
Forward Voltage
Forward Voltage
Total Capacitance
Reverse Recovery Time
V
R
= 10 V
V
R
= 30 V
I
F
= 1 mA
I
F
= 10 mA
I
F
= 100 mA
I
F
= 200 mA
V
R
= 1.0 V, f = 1.0 MHz
I
F
= I
R
= 10 mA, I
R(REC)
= 1.0 mA, Figure 2
Test Conditions
Symbol
I
R
I
R
V
F
V
F
V
F
V
F
C
T
t
rr
Min
−
−
−
−
−
−
−
−
Typ
−
20
155
250
375
500
6
2.4
290
490
600
8
3
Max
15
50
Unit
mA
mA
mV
mV
mV
mV
pF
ns
Figure 1. Recovery Time Equivalent Test Circuit
Figure 2. Peak Forward Recover Voltage Definition
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2
NSR02F30MX
PACKAGE DIMENSIONS
X3DFN2, 0.62x0.32, 0.355P, (0201)
CASE 152AF
ISSUE A
D
PIN 1
INDICATOR
(OPTIONAL)
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
DIM
A
A1
b
D
E
e
L2
MILLIMETERS
MIN
MAX
0.25
0.33
−−−
0.05
0.22
0.28
0.58
0.66
0.28
0.36
0.355 BSC
0.17
0.23
TOP VIEW
E
0.05 C
A
2X
0.05 C
A1
SIDE VIEW
C
SEATING
PLANE
RECOMMENDED
MOUNTING FOOTPRINT*
0.74
1
2X
0.30
e
2X
1
2
b
2X
0.31
DIMENSIONS: MILLIMETERS
2X
L2
C A B
BOTTOM VIEW
0.05
M
C A B
See Application Note AND8398/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.05
M
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
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4
NSR02F30MX/D