Analog to Digital Converters - ADC 4-Channel, 10-Bit, System Monitor with Programmable Trip Window and SMBus Alert Response
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | MO-187C-BA, MICRO SOP-10 |
| 针数 | 10 |
| Reach Compliance Code | not_compliant |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3 mm |
| MAX1361EUB | MAX1361MEUB+ | MAX1362MEUB+T | MAX1362EUB-T | MAX1362EUB | MAX1361EUB-T | MAX1362LEUB+T | |
|---|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC 4-Channel, 10-Bit, System Monitor with Programmable Trip Window and SMBus Alert Response | IC system mon 10bit 4ch 10-umax | IC system mon 10bit 4ch 10-umax | Analog to Digital Converters - ADC 4-Channel, 10-Bit, System Monitor with Programmable Trip Window and SMBus Alert Response | Analog to Digital Converters - ADC 4-Channel, 10-Bit, System Monitor with Programmable Trip Window and SMBus Alert Response | Analog to Digital Converters - ADC 4-Channel, 10-Bit, System Monitor with Programmable Trip Window and SMBus Alert Response | IC SYSTEM MON 10BIT 4CH 10-UMAX |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | MO-187C-BA, MICRO SOP-10 | MO-187C-BA, MICRO SOP-10 | TSSOP, | MO-187C-BA, MICRO SOP-10 | MO-187C-BA, MICRO SOP-10 | MO-187C-BA, MICRO SOP-10 | TSSOP, |
| 针数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| Reach Compliance Code | not_compliant | unknow | compli | not_compliant | not_compliant | not_compliant | compliant |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e4 | e4 | e3 | e4 | e4 | e4 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | 260 | 260 | 245 | 240 | 245 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 5.5 V | 5.5 V | 5.5 V | 3.6 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 4.5 V | 4.5 V | 4.5 V | 2.7 V | 4.5 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 5 V | 5 V | 5 V | 3.3 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | 30 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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