Analog to Digital Converters - ADC 12-Bit 100 kSPS Complete IC
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 |
| 针数 | 28 |
| 制造商包装代码 | D-28-2 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 16.5 V |
| 最小模拟输入电压 | -16.5 V |
| 最长转换时间 | 10 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-CDIP-T28 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.012% |
| 标称负供电电压 | -15 V |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5,+-12/+-15 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.111 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 5.72 mm |
| 最大压摆率 | 18 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| AD1674TD | AD1674JN | 302074-4P361K00SB | AD1674BR | CNS020-887KP | AD1674KR | |
|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC 12-Bit 100 kSPS Complete IC | Analog to Digital Converters - ADC 12-Bit 100 kSPS Complete IC | Fixed Resistor, Metal Foil, 1W, 361000ohm, 500V, 0.001% +/-Tol, -2,2ppm/Cel, | Analog to Digital Converters - ADC 12-Bit 100 kSPS Complete IC | Fixed Resistor, Thin Film, 0.5W, 887000ohm, 300V, 0.02% +/-Tol, 10ppm/Cel, Through Hole Mount, RADIAL LEADED | Analog to Digital Converters - ADC 12-Bit 100 kSPS Complete IC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | compliant | unknown | compliant | unknown |
| ECCN代码 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 端子数量 | 28 | 28 | 4 | 28 | 2 | 28 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 85 °C | 155 °C | 70 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -40 °C | -55 °C | - |
| 封装形式 | IN-LINE | IN-LINE | 4 Terminals | SMALL OUTLINE | Radial | SMALL OUTLINE |
| 技术 | BICMOS | BICMOS | METAL FOIL | BICMOS | THIN FILM | BICMOS |
| Brand Name | Analog Devices Inc | Analog Devices Inc | - | Analog Devices Inc | - | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | - | 含铅 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) |
| 零件包装代码 | DIP | DIP | - | SOIC | - | SOIC |
| 包装说明 | HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 | DIP, DIP28,.6 | - | PLASTIC, SOIC-28 | RADIAL LEADED | PLASTIC, SOIC-28 |
| 针数 | 28 | 28 | - | 28 | - | 28 |
| 制造商包装代码 | D-28-2 | N-28-2 | - | RW-28 | - | RW-28 |
| 最大模拟输入电压 | 16.5 V | 10 V | - | 20 V | - | 10 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION | - | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-CDIP-T28 | R-PDIP-T28 | - | R-PDSO-G28 | - | R-PDSO-G28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 |
| 最大线性误差 (EL) | 0.012% | 0.0244% | - | 0.012% | - | 0.0122% |
| 模拟输入通道数量 | 1 | 1 | - | 1 | - | 1 |
| 位数 | 12 | 12 | - | 12 | - | 12 |
| 功能数量 | 1 | 1 | - | 1 | - | 1 |
| 输出位码 | BINARY | BINARY | - | BINARY | - | BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | - | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | - | SOP | - | SOP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | - | SOP28,.4 | - | SOP28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT APPLICABLE | - | 220 | - | 240 |
| 电源 | 5,+-12/+-15 V | 5,+-12/+-15 V | - | 5,+-12/+-15 V | - | 5,+-12/+-15 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified |
| 采样速率 | 0.111 MHz | 0.111 MHz | - | 0.1 MHz | - | 0.111 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | - | SAMPLE | - | SAMPLE |
| 座面最大高度 | 5.72 mm | 6.35 mm | - | 2.65 mm | - | 2.65 mm |
| 表面贴装 | NO | NO | - | YES | NO | YES |
| 温度等级 | MILITARY | COMMERCIAL | - | INDUSTRIAL | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | - | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | - | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT APPLICABLE | - | 20 | - | 30 |
| 宽度 | 15.24 mm | 15.24 mm | - | 7.5 mm | - | 7.5 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
