• Load Switch, PA Switch and Battery Switch for Portable
Devices
S
1
D
2
D
3
6
D
5
D
S
4
Ordering Information:
SiB411DK-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
1.60 mm
G
Part # code
BBX
XXX
Lot Traceability
and Date code
D
P-Channel MOSFET
Marking Code
G
1.60 mm
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
Limit
- 20
±8
- 9
a
- 8.9
a
- 4.8
b, c
- 3.8
b, c
- 15
- 9
a
- 2
b, c
13
8.4
2.4
b, c
1.6
b, c
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
A
Pulsed Drain Current
Continuous Source-Drain Diode Current
Maximum Power Dissipation
P
D
T
J
, T
stg
W
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
b, f
t
≤
5s
Steady State
Symbol
R
thJA
R
thJC
Typical
41
7.5
Maximum
51
9.5
Unit
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (
h
ttp://www.vishay.com/ppg?73257).
The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 74335
S-80515-Rev. C, 10-Mar-08
www.vishay.com
1
SiB411DK
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= - 3.8 A, di/dt = 100 A/µs, T
J
= 25 °C
I
S
= - 3.8 A, V
GS
= 0 V
- 0.85
20
10
15
5
T
C
= 25 °C
-9
15
- 1.2
40
20
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= - 10 V, R
L
= 2.1
Ω
I
D
≅
- 4.8 A, V
GEN
= - 8 V, R
g
= 1
Ω
V
DD
= - 10 V, R
L
= 2.1
Ω
I
D
≅
- 4.8 A, V
GEN
= - 4.5 V, R
g
= 1
Ω
f = 1 MHz
V
DS
= - 10 V, V
GS
= - 8 V, I
D
= - 4.5 A
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 4.5 A
V
DS
= - 10 V, V
GS
= 0 V, f = 1 MHz
470
95
65
10
6
0.9
1.4
7.5
10
40
45
75
5
10
25
10
15
60
70
115
10
15
40
15
ns
Ω
15
9
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= - 250 µA
I
D
= - 250 µA
V
DS
= V
GS
, I
D
= - 250 µA
V
DS
= 0 V, V
GS
= ± 8 V
V
DS
= - 20 V, V
GS
= 0 V
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≤
5 V, V
GS
= - 4.5 V
V
GS
= - 4.5 V, I
D
= - 3.3 A
V
GS
= - 2.5 V, I
D
= - 2.8 A
V
GS
= - 1.8 V, I
D
= - 0.77 A
V
DS
= - 10 V, I
D
= - 3.3 A
15
0.055
0.077
0.107
9.5
0.066
0.094
0.130
S
Ω
- 0.4
- 20
- 18
2.2
-1
± 100
-1
- 10
V
mV/°C
V
nA
µA
A
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 74335
S-80515-Rev. C, 10-Mar-08
SiB411DK
Vishay Siliconix
TYPICAL CHARACTERISTICS
15
2.5
V
V
GS
= 5 thru 3
V
12
I
D
- Drain C
u
rrent (A)
I
D
- Drain C
u
rrent (A)
1.6
25 °C, unless otherwise noted
2.0
9
2
V
6
1.2
0.8
25 °C
3
1.5
V
0
0.0
0.4
T
C
= 125 °C
- 55 °C
0.5
1.0
1.5
2.0
0.0
0.0
0.3
0.6
0.9
1.2
1.5
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.20
V
GS
= 1.8
V
R
DS(on)
- On-Resistance (Ω)
C - Capacitance (pF)
0.15
800
700
600
500
400
300
200
V
GS
= 4.5
V
100
C
rss
0.00
0
3
6
9
12
15
0
0
4
Transfer Characteristics
C
iss
0.10
V
GS
= 2.5
V
0.05
C
oss
8
12
16
20
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
8
V
GS
- Gate-to-So
u
rce
V
oltage (
V
)
I
D
= 4.8 A
R
DS(on)
- On-Resistance
6
V
DS
= 10
V
1.4
1.6
I
D
= 3.3 A
Capacitance
V
GS
= 4.5
V,
2.5
V,
1.8
V
(
N
ormalized)
1.2
4
V
GS
= 16
V
2
1.0
0.8
0
0
2
4
6
8
10
12
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
Document Number: 74335
S-80515-Rev. C, 10-Mar-08
On-Resistance vs. Junction Temperature
www.vishay.com
3
SiB411DK
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
R
DS(on)
- Drain-to-So
u
rce On-Resistance (Ω)
0.20
0.17
I
S
- So
u
rce C rrent (A)
u
10
0.14
T
J
= 150 °C
1
T
J
= 25 °C
0.11
T
J =
125 °C
0.08
T
J =
25 °C
0.1
0
0.2
0.4
0.6
0.8
1
1.2
V
SD
- Source-to-Drain
Voltage
(V)
0.05
0
1
2
3
4
5
V
GS
- Gate-to-Source
Voltage
(V)
Soure-Drain Diode Forward Voltage
0.9
I
D
= 250
µA
0.8
15
0.7
V
GS(th)
(
V
)
Power (W)
20
On-Resistance vs. Gate-to-Source Voltage
0.6
10
0.5
5
0.4
0.3
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
Pulse (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited by R
DS(on)*
10
I
D
- Drain Current (A)
Single Pulse Power, Junction-to-Ambient
100 µs
1
T
A
= 25 °C
Single Pulse
0.1
BVDSS limited
0.01
0.1
1
10
100
1 ms
10 ms
100 ms
1s
10 s
DC
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Case
www.vishay.com
4
Document Number: 74335
S-80515-Rev. C, 10-Mar-08
SiB411DK
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
14
12
12
10
I
D
- Drain C
u
rrent (A)
Po
w
er (W)
8
6
4
3
2
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Package Limited
9
15
6
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
As time goes by, people are increasingly concerned about their own and their families' health. However, existing monitoring devices for individual vital signs have struggled to gain market share du...[详细]
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
