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GS8640V18GT-200I

产品描述4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs
产品类别存储    存储   
文件大小441KB,共23页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
标准
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GS8640V18GT-200I概述

4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs

GS8640V18GT-200I规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称GSI Technology
零件包装代码QFP
包装说明LQFP,
针数100
Reach Compliance Codecompli
ECCN代码3A991.B.2.B
最长访问时间7.5 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码R-PQFP-G100
JESD-609代码e3
长度20 mm
内存密度75497472 bi
内存集成电路类型CACHE SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量100
字数4194304 words
字数代码4000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织4MX18
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)2 V
最小供电电压 (Vsup)1.6 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层PURE MATTE TIN
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm

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Product Preview
GS8640V18/32/36T-300/250/200/167
100-Pin TQFP
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipeline
operation
• Single Cycle Deselect (SCD) operation
• 1.8 V +10%/–10% core power supply
• 1.8 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP package
• Pb-Free 100-lead TQFP package available
4M x 18, 2M x 32, 2M x 36
72Mb Sync Burst SRAMs
300 MHz–167 MHz
1.8 V V
DD
1.8 V I/O
cycles can be initiated with either ADSP or ADSC inputs. In
Burst mode, subsequent burst addresses are generated
internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
Burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS8640V18/32/36T operates on a 1.8 V power supply. All
input are 1.8 V compatible. Separate output power (V
DDQ
)
pins are used to decouple output noise from the internal circuits
and are 1.8 V compatible.
Functional Description
Applications
The GS8640V18/32/36T is a 75,497,472-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enables (E1, E2, E3), address burst
control inputs (ADSP, ADSC, ADV), and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynchronous inputs. Burst
Parameter Synopsis
t
KQ
tCycle
Curr
(x18)
Curr
(x32/x36)
t
KQ
tCycle
Curr
(x18)
Curr
(x32/x36)
-300
2.3
3.3
400
480
5.5
5.5
285
330
-250
2.5
4.0
340
410
6.5
6.5
245
280
-200
3.0
5.0
290
350
7.5
7.5
220
250
-167
3.5
6.0
260
305
8.0
8.0
210
240
Unit
ns
ns
mA
mA
ns
ns
mA
mA
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
Rev: 1.00 9/2004
1/23
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

 
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