Analog Switch ICs 4Ohm SPDT CMOS Analog Switch
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QFN |
| 包装说明 | HVSON, SOLCC10,.12,20 |
| 针数 | 10 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 模拟集成电路 - 其他类型 | SPDT |
| JESD-30 代码 | S-XDSO-N10 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 2 |
| 端子数量 | 10 |
| 标称断态隔离度 | 52 dB |
| 通态电阻匹配规范 | 0.1 Ω |
| 最大通态电阻 (Ron) | 5.5 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC10,.12,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 最长断开时间 | 8 ns |
| 最长接通时间 | 18 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| MAX4636ETB+T | MAX4636EUB | MAX4635EUB | MAX4635EUB+T | MAX4635EUB/GG8-T | MAX4635EUB+ | MAX4636EUB+ | |
|---|---|---|---|---|---|---|---|
| 描述 | Analog Switch ICs 4Ohm SPDT CMOS Analog Switch | Analog Switch ICs Fast, Low-Voltage, Dual 4Ohm SPDT CMOS Analog Switches | Analog Switch ICs Fast, Low-Voltage, Dual 4Ohm SPDT CMOS Analog Switches | Analog Switch ICs 4Ohm SPDT CMOS Analog Switch | Analog Switch ICs Fast, Low-Voltage, Dual 4? SPDT CMOS Analog Switch | Analog Switch ICs 4Ohm SPDT CMOS Analog Switch | Analog Switch ICs 4Ohm SPDT CMOS Analog Switch |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
| 包装说明 | HVSON, SOLCC10,.12,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | , | UMAX-10 | TSSOP, TSSOP10,.19,20 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT |
| 峰值回流温度（摄氏度） | 260 | 240 | 240 | 260 | NOT SPECIFIED | 260 | 260 |
| 处于峰值回流温度下的最长时间 | 30 | 20 | 20 | 30 | NOT SPECIFIED | 30 | 30 |
| 零件包装代码 | QFN | SOIC | SOIC | SOIC | - | SOIC | SOIC |
| 针数 | 10 | 10 | 10 | 10 | - | 10 | 10 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | - | 6 weeks | - | 6 weeks | 6 weeks |
| JESD-30 代码 | S-XDSO-N10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | - | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e3 | e0 | e0 | e3 | - | e3 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | - | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 10 | 10 | 10 | 10 | - | 10 | 10 |
| 标称断态隔离度 | 52 dB | 52 dB | 52 dB | 52 dB | - | 52 dB | 52 dB |
| 通态电阻匹配规范 | 0.1 Ω | 0.1 Ω | 0.1 Ω | 0.1 Ω | - | 0.1 Ω | 0.1 Ω |
| 最大通态电阻 (Ron) | 5.5 Ω | 5.5 Ω | 5.5 Ω | 5.5 Ω | - | 5.5 Ω | 5.5 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | TSSOP | TSSOP | - | TSSOP | TSSOP |
| 封装等效代码 | SOLCC10,.12,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | - | TSSOP10,.19,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.1 mm | 1.1 mm | 1.1 mm | - | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | - | YES | YES |
| 最长断开时间 | 8 ns | 8 ns | 8 ns | 8 ns | - | 8 ns | 8 ns |
| 最长接通时间 | 18 ns | 18 ns | 18 ns | 18 ns | - | 18 ns | 18 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | - | 3 mm | 3 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |
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