8-bit Microcontrollers - MCU 7KB Flash, 512B RAM, 256B EE, 10b ADC2, DAC, Comp, PWM, CWG, SMT, HLT, WWDT, SCAN/CRC, ZCD, PPS, EUSART, 2xSPI/I2C, IDLE/DOZE/PMD
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | QFN-28 |
Reach Compliance Code | compliant |
Factory Lead Time | 18 weeks |
具有ADC | YES |
其他特性 | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY |
地址总线宽度 | |
位大小 | 8 |
最大时钟频率 | 32 MHz |
DAC 通道 | YES |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQCC-N28 |
长度 | 6 mm |
I/O 线路数量 | 25 |
端子数量 | 28 |
片上程序ROM宽度 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
ROM可编程性 | FLASH |
筛选级别 | TS 16949 |
座面最大高度 | 1 mm |
速度 | 32 MHz |
最大供电电压 | 3.6 V |
最小供电电压 | 2.5 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
PIC16LF18854-E/ML | PIC16F18854-E-ML | PIC16LF18854T-I/SO | PIC16LF18854-E/SP | PIC16LF18854T-I/MV | PIC16LF18854-I/MV | PIC16F18854-E/SO | |
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描述 | 8-bit Microcontrollers - MCU 7KB Flash, 512B RAM, 256B EE, 10b ADC2, DAC, Comp, PWM, CWG, SMT, HLT, WWDT, SCAN/CRC, ZCD, PPS, EUSART, 2xSPI/I2C, IDLE/DOZE/PMD | 8-bit Microcontrollers - MCU 7KB Flash, 512B RAM, 256B EE, 10b ADC2, DAC, Comp, PWM, CWG, SMT, HLT, WWDT, SCAN/CRC, ZCD, PPS, EUSART, 2xSPI/I2C, IDLE/DOZE/PMD | 8-bit Microcontrollers - MCU 256B EE 10b ADC2 PPS EUSART 2xSPI/I2C | 8位微控制器 -MCU 256B EE 10b ADC2 PPS EUSART 2xSPI/I2C | 8位微控制器 -MCU 256B EE 10b ADC2 PPS EUSART 2xSPI/I2C | 8位微控制器 -MCU 256B EE 10b ADC2 PPS EUSART 2xSPI/I2C | 8位微控制器 -MCU 256B EE 10b ADC 22xSPI/I2C |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | QFN-28 | - | SOP, | SDIP-28 | UQFN-28 | UQFN-28 | SOP, |
Reach Compliance Code | compliant | - | compliant | compliant | compliant | compliant | compliant |
Factory Lead Time | 18 weeks | - | 4 weeks | 4 weeks | 30 weeks | 30 weeks | 4 weeks |
具有ADC | YES | - | YES | YES | YES | YES | YES |
其他特性 | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY | - | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 1.8V MINIMUM SUPPLY | ALSO OPEARTES AT 16 MHZ AT 2.3V MINIMUM SUPPLY |
位大小 | 8 | - | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 | 32 MHz | - | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
DAC 通道 | YES | - | YES | YES | YES | YES | YES |
DMA 通道 | NO | - | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQCC-N28 | - | R-PDSO-G28 | R-PDIP-T28 | S-PQCC-N28 | S-PQCC-N28 | R-PDSO-G28 |
长度 | 6 mm | - | 17.9 mm | 34.67 mm | 4 mm | 4 mm | 17.9 mm |
I/O 线路数量 | 25 | - | 25 | 25 | 25 | 25 | 25 |
端子数量 | 28 | - | 28 | 28 | 28 | 28 | 28 |
片上程序ROM宽度 | 14 | - | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | - | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | - | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | - | SOP | DIP | HVQCCN | HVQCCN | SOP |
封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
ROM可编程性 | FLASH | - | FLASH | FLASH | FLASH | FLASH | FLASH |
筛选级别 | TS 16949 | - | TS 16949 | TS 16949 | TS 16949 | TS 16949 | TS 16949 |
座面最大高度 | 1 mm | - | 2.65 mm | 5.08 mm | 0.55 mm | 0.55 mm | 2.65 mm |
速度 | 32 MHz | - | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
最大供电电压 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 5.5 V |
最小供电电压 | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | - | YES | NO | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | - | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
端子形式 | NO LEAD | - | GULL WING | THROUGH-HOLE | NO LEAD | NO LEAD | GULL WING |
端子节距 | 0.65 mm | - | 1.27 mm | 2.54 mm | 0.4 mm | 0.4 mm | 1.27 mm |
端子位置 | QUAD | - | DUAL | DUAL | QUAD | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 6 mm | - | 7.5 mm | 7.62 mm | 4 mm | 4 mm | 7.5 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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