• Ultra-reliable start up and greater immunity from interfer-
ence
• 50% + board saving space
• More cost effective than quartz oscillators, quartz crystals
and clock ICs.
• Completely quartz-free
Applications
•
•
•
•
•
•
•
•
•
•
•
Communications and Networking Applications
Consumer Electronics Applications
Automotive Applications
Industrial Applications
Gigabit Ethernet
10 Gigabit Ethernet
Fiber Channel
Ethernet
SATA/SAS
USB 2.0
PCI-Express
Block Diagram
VDD
OUT
Pinout
ST/OE
M EM S
R eson ator
H igh
P erform ance
S ynthesizer
1
4
VDD
GND
2
3
OUT
S T/O E
GND
Pin Description
Pin No. Name
1
2
3
4
ST/OE
GND
OUT
VDD
Pin Description
Standby/ Output Enable
Connect to Ground
1 to 200 MHz Programmed Clock
output
Connect to 1.8V / 2.5V / 2.8V / 3.3V
Pin1
Pin #1 Functionality
OE
H or Open; specified frequency output
L: output is high impedance
ST
H or Open; specified frequency output
L: output is low level (weak pull down) oscillation stops
SiTime Corporation
Rev. 1.08
990 Almanor Avenue, Suite 200
Sunnyvale, CA 94085
(408) 328-4400
www.sitime.com
Revised December 08, 2008
SiT8102
Description
The SiT8102 is the next generation of the SiT8002 program-
mable oscillator with lower phase noise, lower jitter, and a
higher frequency range. SiTime oscillators are the smallest,
high-performance programmable oscillator available and are
suitable for use in high speed serial communications,
consumer, portable, industrial, automotive and computation.
This oscillator is packaged in standard low-cost plastic and
chip-scale IC packages.
System reliability is also increased with the SiT8102 by elimi-
nating the quartz crystal and improved immunity to the
environmental effects of vibration, shock, strain, and humidity.
To order samples, go to www.sitime.com and click on Request
Sample” link.
Absolute Maximum Ratings
Attempted operation outside the absolute maximum ratings of the part may cause permanent damage to the part. Actual
performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Ab
solute Maximum Table
Parameter
Storage Temperature
VDD
Electrostatic Discharge
Theta JA ( with copper plane on VDD and GND)
Theta JC (with PCB traces of 0.010 inch to all pins)
Soldering Temperature (follow standard Pb free soldering guidelines)
Number of Program Writes
Program Retention over -40 to 125 °C, Process, VDD (0 to 3.65V)
Min.
-65
-0.5
–
–
–
–
–
–
Max.
150
+3.65
6000
75
24
260
1
1,000+
Unit
°C
V
V
°C/W
°C/W
°C
NA
years
Operating Conditions
Parameter
Supply Voltages,
VDD
[1]
Min.
2.97
2.25
2.52
1.7
Extended Commercial OperatingTemperature
Industrial Operating Temperature
Maximum Load Capacitance
[2]
-20
-40
–
Typ.
3.3
2.5
2.8
1.8
–
–
–
Max.
3.63
2.75
3.08
1.9
70
85
15
Unit
V
V
V
V
°C
°C
pF
Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Moisture Sensibility Level
Condition/Test Method
MIL-STD-883F, Method 2002
MIL-STD-883F, Method 2007
JESD22, Method A104
MIL-STD-883F, Method 2003
MSL1 @ 260°C
Notes:
1. The 2.5V device can operate from 2.25V to 3.63V with higher output drive, however, the data sheet specifications cannot be guaranteed. Please contact factory
for this option.
2. The output driver strength can be programmed to drive up to 30pF load. Please contact factory for this option.
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NXP MCU
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