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71V65803S150BQI

产品描述CABGA-165, Tray
产品类别存储   
文件大小528KB,共27页
制造商IDT (Integrated Device Technology)
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71V65803S150BQI概述

CABGA-165, Tray

71V65803S150BQI规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明TBGA, BGA165,11X15,40
针数165
制造商包装代码BQ165
Reach Compliance Codenot_compliant
ECCN代码3A991.B.2.A
Samacsys Confidence4
Samacsys StatusReleased
Samacsys PartID11322087
Samacsys Pin Count165
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategoryBGA
Samacsys Footprint Name165f bga
Samacsys Released Date2020-01-24 13:37:09
Is SamacsysN
最长访问时间3.8 ns
I/O 类型COMMON
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源3.3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.06 A
最小待机电流3.14 V
最大压摆率0.345 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度13 mm
Base Number Matches1

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256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
ZBT™ Feature
3.3V I/O, Burst Counter
Pipelined Outputs
Features
IDT71V65603/Z
IDT71V65803/Z
The IDT71V65603/5803 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or writes and
reads. Thus, they have been given the name ZBT
TM
, or Zero Bus Turn-
around.
Description
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
Positive clock-edge triggered address, data, and control signal
registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array(fBGA).
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65603/5803 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65603/5803
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE1, CE2,
CE2)
that allow the user
to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be
initiated. However, any pending data transfers (reads or writes) will be
completed. The data bus will tri-state two cycles after chip is deselected
or a write is initiated.
The IDT71V65603/5803 have an on-chip burst counter. In the burst
mode, the IDT71V65603/5803 can provide four cycles of data for a
single address presented to the SRAM. The order of the burst
sequence is defined by the
LBO
input pin. The
LBO
pin selects
between linear and interleaved burst sequence. The ADV/LD signal is
used to load a new external address (ADV/LD = LOW) or increment
the internal burst counter (ADV/LD = HIGH).
The IDT71V65603/5803 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA) .
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5304 tbl 01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2008
DSC-5304/08
1
©2008 Integrated Device Technology, Inc.
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