It is recommeded that the temperature of the component does not exceed +125°C under worst
case conditions
Ambient Temperature
(refering to I
R
)
Operating Temperature
Storage Temperature (in
original packaging)
-40 °C up to +85 °C
-40 °C up to +125 °C
-20 °C up to +40 °C
4,1 ±0,2
Test conditions of Electrical Properties: 20°C, 33% RH if not specified differently
Product Marking:
Marking
R68 (Inductance Code)
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
SSt
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-MAPI SMD Shielded Power
Inductor
SIZE
REVISION
STATUS
ORDER CODE
744383560068
DATE
BUSINESS UNIT
PAGE
4020
001.000
Valid
2015-11-10
eiSos
1/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Inductance vs. Current Characteristics:
0.8
Typical Temperature Rise vs. Current Characteristics:
120.0
0.7
100.0
0.6
80.0
0.5
0.4
Temperature Rise [K]
0.0
2.0
4.0
6.0
8.0
Current [A]
10.0
12.0
14.0
Inductance [µH]
60.0
0.3
40.0
0.2
20.0
0.1
0.0
0.0
0.0
2.0
4.0
6.0
8.0
Current [A]
10.0
12.0
14.0
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
SSt
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-MAPI SMD Shielded Power
Inductor
SIZE
REVISION
STATUS
ORDER CODE
744383560068
DATE
BUSINESS UNIT
PAGE
4020
001.000
Valid
2015-11-10
eiSos
2/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Impedance Characteristics:
10000
Impedance [Ω]
1000
100
10
1
0.01
0.1
1
10
100
Frequency [MHz]
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
SSt
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-MAPI SMD Shielded Power
Inductor
SIZE
REVISION
STATUS
ORDER CODE
744383560068
DATE
BUSINESS UNIT
PAGE
4020
001.000
Valid
2015-11-10
eiSos
3/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Packaging Specification - Tape and Reel: [mm]
P0
D0
P2
E1
T
W3
F
B
W**
close to center
D
W
B0
E2
top cover
tape
A0
P1
K0
T2
T1
C
W2
End
Feeding direction
Carrier tape
Start
Cover tape
No Component
min. 160 mm
Components
No Component
min. 100 mm
Cover Tape
min. 400 mm
E1
±0,1
1,75
E2
min.
10,25
F
±0,05
5,50
P0
±0,1
4,00
P2
±0,05
2,00
Tape Type
Polystyrene
VPE / packaging unit
pcs.
1000
tolerance
Tape width
12 mm
A
±2,0
178,00
B
min.
1,50
C
±0,8
13,00
D
min.
20,20
N
±2,0
50,00
W1
+2,0
12,40
W2
max.
18,40
W3
min.
11,90
W3
max.
15,40
Packaging is referred to the international standard
IEC 60286 -3:2013
tolerance
size
A0
typ.
4,60
B0
typ.
4,60
W
±0,1
12,00
P1
±0,1
8,00
T
±0,1
0,30
T1
max.
0,10
T2
typ.
2,40
D0
+0,1/ -0,0
1,50
4020
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
CREATED
CHECKED
GENERAL TOLERANCE
SSt
DESCRIPTION
DDe
DIN ISO 2768-1m
165° - 180°
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
WE-MAPI SMD Shielded Power
Inductor
SIZE
REVISION
STATUS
ORDER CODE
744383560068
DATE
BUSINESS UNIT
PAGE
Pull-of force
Tape width
12 mm
0,1 N - 1,3 N
4020
001.000
Valid
2015-11-10
N
PROJECTION
METHOD
A
eiSos
4/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Preheat Temperature Min
Preheat Temperature Max
Value
T
s min
T
s max
t
s
T
L
t
L
T
p
t
p
150 °C
200 °C
60 - 120 seconds
3 °C/ second max.
217 °C
60 - 150 seconds
see table below
20 - 30 seconds
6 °C/ second max.
8 minutes max.
T
p
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
T
s max
t
L
t
p
T
C
–5°C
Preheat Time t
s
from T
s min
to T
s max
Ramp-up Rate (T
L
to T
P
)
Liquidous Temperature
Time t
L
maintained above T
L
Peak package body temperature
Time within 5°C of actual peak temperaure
Ramp-down Rate (T
L
to T
P
)
Temperature
Preheat Area
T
s min
t
S
Time 25°C to peak temperature
refer to IPC/ JEDEC J-STD-020E
Package Classification Reflow Temperature:
Properties
PB-Free Assembly | Package Thickness < 1.6 mm
Volume mm³
<350
260 °C
260 °C
250 °C
Volume mm³
350-2000
260 °C
250 °C
245 °C
Volume mm³
>2000
260 °C
245 °C
245 °C
25
Time 25°C to Peak
PB-Free Assembly | Package Thickness 1.6 mm - 2.5 mm
Time
PB-Free Assembly | Package Thickness ≥ 2.5 mm
refer to IPC/ JEDEC J-STD-020E
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
SSt
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-MAPI SMD Shielded Power
Inductor
SIZE
REVISION
STATUS
ORDER CODE
744383560068
DATE
BUSINESS UNIT
PAGE
4020
001.000
Valid
2015-11-10
eiSos
5/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
语音作为自然的人机接口，可以使车载导航系统实现更安全、更人性化的操作。通过国内外车载导航系统的功能对比可知，支持语音交互是车载导航系统的一个发展趋势。另外，市场信息服务公司J.D Power and Associates的调研数据也表明，56％的消费者更倾向于选择声控的导航系统。因此，开发车载语音导航系统是很有意义的。目前，国内已经具备开发车载语音导航系统的技术基础，特别是文语转换TTS技术...[详细]
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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