It is recommended that the temperature of the component does not exceed +125°C under worst
case conditions
1,25 ±0,2
Operating Temperature
Storage Temperature (in original
packaging)
-40 °C up to +125 °C
-20 °C up to +40 °C
Test conditions of Electrical Properties: +20°C, 33% RH if not specified differently
Scale - 15:1
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479275222
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
0805
001.001
Valid
2017-03-09
eiSos
1/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Inductance vs. Frequency Characteristics:
100
Typical Inductance vs. Current Characteristics:
10,000
10
Inductance [µH]
Inductance [µH]
1
1,000
0,1
1
10
100
0,100
1
Frequency [MHz]
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
10
100
Current [mA]
1000
10000
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479275222
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
0805
001.001
Valid
2017-03-09
eiSos
2/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Temperature Rise vs. Current Characteristics:
60,0
50,0
40,0
Temperature Rise [K]
30,0
20,0
10,0
0,0
0
200
400
600
800
1.000
Current [A]
1.200
1.400
1.600
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479275222
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
0805
001.001
Valid
2017-03-09
eiSos
3/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Packaging Specification - Tape and Reel: [mm]
P0
K0
T
E1
W3
A
D0
P2
B
W1
close to center
D
F
W
B0
E2
C
Top Cover
Tape
A
D1
A0
P1
T2
T1
W2
End
Feeding direction
Start
Carrier Tape
Cover Tape
No Component
min.160mm
Components
No Component
min.100mm
Cover Tape
min. 400mm
tolerance
Tape width
A
±2,0
178,00
B
min.
1,50
C
±0,8
13
D
min.
20.2
N
±2,0
50
W1
+1,5
8.4
W2
max.
14.4
W3
min.
7.9
W3
max.
10.9
packaging is reffered to the international standard IEC 60286-3:2013
tolerance
size
A0
typ.
0805 1,5
B0 W
typ. +0,3/ -0,1
2,25 8
T
T1
T2
K0
max. max. typ. typ.
0,22 0,10 1,15 1,0
P0
P1
P2
±0,1 ±0,1 ±0,05
4,00 4
2,00
D0
+0,1/ -0,0
1,50
D1 E1
E2
F
min. ±0,1 min. ±0,05
0,3 1.75 6,25 3,5
Tape Type 2a
Polystyrene
VPE / packaging unit
pcs.
3000
8 mm
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
CREATED
CHECKED
GENERAL TOLERANCE
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
165° - 180°
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479275222
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
Pull-of force
Tape width
8 mm
0,1 N - 1,0 N
0805
001.001
Valid
2017-03-09
N
PROJECTION
METHOD
A
eiSos
4/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Preheat Temperature Min
Preheat Temperature Max
Value
T
s min
150 °C
T
s max
200 °C
t
s
T
L
t
L
T
p
t
p
60 - 120 seconds
3 °C/ second max.
217 °C
60 - 150 seconds
see table below
20 - 30 seconds
6 °C/ second max.
8 minutes max.
T
p
Max. Ramp Up Rate
Max. Ramp Down Rate
T
L
T
s max
t
L
t
p
T
C
–5°C
Preheat Time t
s
from T
s min
to T
s max
Ramp-up Rate (T
L
to T
P
)
Liquidous Temperature
Time t
L
maintained above T
L
Peak package body temperature
Time within 5°C of actual peak temperaure
Ramp-down Rate (T
L
to T
P
)
Time 25°C to peak temperature
refer to IPC/ JEDEC J-STD-020E
Temperature
Preheat Area
T
s min
t
S
Package Classification Reflow Temperature:
Properties
Volume mm³
<350
260 °C
250 °C
Volume mm³
350-2000
260 °C
250 °C
245 °C
Volume mm³
>2000
260 °C
245 °C
245 °C
25
Time 25°C to Peak
PB-Free Assembly | Package Thickness < 1.6 mm
PB-Free Assembly | Package Thickness ≥ 2.5 mm
refer to IPC/ JEDEC J-STD-020E
PB-Free Assembly | Package Thickness 1.6 mm - 2.5 mm
260 °C
Time
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
DDe
DIN ISO 2768-1m
WE-PMCI Power Molded Chip
Inductor
SIZE
REVISION
STATUS
ORDER CODE
74479275222
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
0805
001.001
Valid
2017-03-09
eiSos
5/7
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
据外媒报道，萨里大学（University of Surrey）的研究人员开发出一种无需依赖GPS即可在人口密集的城市地区精确定位设备位置的人工智能系统。该系统可将定位误差从734米缩小到22米以内，这对于自动驾驶汽车和救援车辆等技术的发展意义重大。 图片来源： 萨里大学 在发表于《IEEE Robotics and Automation Letters》的论文中，研究人员介绍了PEn...[详细]
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
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