*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R06
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
Typical Turn-On Time vs. Temperature
(I
L
=100mA)
Turn-Off Time (ms)
CPC1009N
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
I
F
=5mA
I
F
=10mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Typical Turn-Off Time vs. Temperature
(I
L
=100mA)
12
On-Resistance ( )
10
8
Typical On-Resistance vs. Temperature
(I
L
=150mA)
I
F
=5mA
I
F
=10mA
Turn-On Time (ms)
Steady State
6
4
2
I
F
=10mA
I
F
=5mA
Instantaneous
I
F
=5mA
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
3.0
2.5
LED Current (mA)
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=100mA)
Load Current (mA)
150
100
50
0
-50
-100
Typical Load Current vs. Load Voltage
(I
F
=5mA)
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-150
-1.5
-1.0
-0.5
0
0.5
1.0
1.5
Load Voltage (V)
Typical Maximum Load Current
vs. Temperature
190
180
Load Current (mA)
170
160
150
140
130
120
110
100
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=10mA
I
F
=5mA
Blocking Voltage (V
P
)
122
121
Typical Blocking Voltage
vs. Temperature
1.6
1.4
Leakage (nA)
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(V
L
=100V
P
)
120
119
118
117
116
115
0
20
40
60
80
100
120
Temperature (ºC)
50
Output Capacitnace (pF)
40
30
20
10
0
Output Capacitance vs. Load Voltage
(I
F
=0mA, f=1MHz)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 s 100 s 1ms 10ms 100ms
Time
Load Current (A)
0
25
50
Load Voltage (V)
75
100
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
CPC1009N
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1009N
Moisture Sensitivity Level (MSL) Rating
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC1009N
Maximum Temperature x Time
260ºC for 30 seconds
Maximum Reflow Cycles
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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