Chip Monolithic Ceramic Capacitor meet AEC-Q200 for Infotainment
GRT32EC81H475ME01_ (1210, X6S:EIA, 4.7uF, DC50V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to Chip Monolithic Ceramic Capacitor used for Car Multimedia, Car Interior, Car Comfort application and General Electronic
equipment.
Please contact us when using this product for any other applications than described in the above.
Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.).
2.MURATA Part NO. System
(Ex.)
GRT
32
(1)L/W
Dimensions
E
(2)T
Dimensions
C8
(3)Temperature
Characteristics
1H
(4)Rated
Voltage
475
(5)Nominal
Capacitance
M
(6)Capacitance
Tolerance
E01
(7)Murata’s Control
Code
L
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
3.2±0.3
(1)-2 W
2.5±0.2
(2) T
2.5±0.2
e
0.3 min.
(Unit:mm)
g
1.0 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X6S(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-22 to 22 %
-55 to 105 °C
(25 °C)
DC 50 V
4.7 uF
±20 %
-55 to 105 °C
5.Package
mark
L
K
(8) Packaging
f180mm
Reel
EMBOSSED W8P4
f330mm
Reel
EMBOSSED W8P4
Packaging Unit
1000 pcs./Reel
4000 pcs./Reel
Product specifications in this catalog are as of May.10,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRT32EC81H475ME01-01
1
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
1 Pre-and Post-Stress
Electrical Test
2 High Temperature
Exposure (Storage)
Appearance
Capacitance
Change
Dissipation
Factor
Insulation
Resistance
3 Temperature Cycling
Appearance
Capacitance
Change
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
R6, C8: Within ±7.5%
More than 500MΩ or 25Ω
∙
F (Whichever is smaller)
R6, C8: 0.2 max.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
R6, C8: Within ±12.5%
-
Solder the capacitor on the test substrate(glass epoxy board).
Set the capacitor for 1000±12h at maximum operating temperature ±3℃.
Set for 24±2h at room temperature, then measure.
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 1000 cycles test according to the four heat treatments
in the following table.
Set for 24±2h at room temperature, then measure.
Step
Temp.
(C)
1
-55+0/-3
2
Room
Temp.
1
3
85 +3/-0 (For R6)
105+3/-0 (For C8)
153
4
Room
Temp.
1
Dissipation
Factor
R6, C8: 0.2 max.
Time
(min.)
153
・Initial
measurement
Insulation
Resistance
Within the specified initial value.
Perform a heat treatment at 150+0/-10
℃
for 1h and then set
for 24±2h at room temperature.
Perform the initial measurement.
4 Destructive
Physical Analysis
5 Biased Humidity
Appearance
Capacitance
Change
Dissipation
Factor
Insulation
Resistance
More than 100MΩ or 5Ω
∙
F (Whichever is smaller)
R6,C8: 0.2 max
・Measurement
after test
Perform a heat treatment at 150+0/–10°C for 1h and then let
sit for 24±2h at room temperature, then measure.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
R6,C8: Within ±12.5%
Solder the capacitor on the test substrate(glass epoxy board).
Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)
at 85±3℃ and 80 to 85% humidity for 1000±12h.
Remove and set for 24±2h at room temperature, then measure.
The charge/discharge current is less than 50mA.
No defects or abnormalities
Per EIA-469
JEMCGS-01744M
2
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
The measured and observed characteristics should satisfy the
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Apply 100% of the rated voltage for 1000±12h at maximum operating
temperature ±3℃. Set for 24±2h at room temperature, then measure.
The charge/discharge current is less than 50mA.
6 Operational Life
Appearance
Capacitance
Change
Dissipation
Factor
specifications in the following table.
No marking defects
R6,C8: Within ±12.5%
・Initial
measurement
R6,C8: 0.2max
Perform a heat treatment at 150+0/-10℃ for 1h and then set
for 24±2h at room temperature.
Perform the initial measurement.
・Measurement
after test
Insulation
Resistance
7 External Visual
More than 100MΩ or 5Ω
∙
F (Whichever is smaller)
Perform a heat treatment at 150+0/–10°C for 1h and then let
sit for 24±2h at room temperature, then measure.
No defects or abnormalities
Visual inspection
8 Physical Dimension
Within the specified dimensions
Using Measuring instrument of dimension.
9 Resistance to
Solvents
Appearance
No marking defects
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance
Within the specified tolerance
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water
Dissipation
Factor
Within the specified initial value.
1
part (by volume) of propylene glycol monomethyl ether
1 part (by volume) of monoethanolamine
Insulation
Resistance
Within the specified initial value.
10 Mechanical
Shock
Appearance
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Three shocks in each direction should be applied along 3 mutually
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
Capacitance
Within the specified tolerance
Dissipation
Factor
Within the specified initial value.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Insulation
Resistance
11 Vibration
Appearance
Within the specified initial value.
No defects or abnormalities
Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
a total amplitude of 1.5mm, the frequency being varied uniformly between
the approximate limits of 10 and 2000Hz. The frequency range, from
Capacitance
Within the specified tolerance
Dissipation
Factor
Within the specified initial value.
10 to 2000Hz and return to 10Hz, should be traversed in
approximately 20min. This motion should be applied for 12
items in each 3 mutually perpendicular directions (total of 36 times).
Insulation
Resistance
Within the specified initial value.
12 Resistance to
Soldering Heat
Appearance
Capacitance
Dissipation
Factor
Insulation
Resistance
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within the specified tolerance
Within the specified initial value.
Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
solder solution at 260±5℃ for 10±1s.
Set at room temperature for 24±2h, then measure.
・Initial
measurement
Perform a heat treatment at 150+0/-10
℃
for 1h and then set
for 24±2h at room temperature.
Perform the initial measurement.
Within the specified initial value.
JEMCGS-01744M
3
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
The measured and observed characteristics shall satisfy the
specifications in the following table.
Appearance
Capacitance
Change
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 300 cycles according to the two heat treatments listed
in the following table(Maximum transfer time is 20s).
Set for 24+/-2h at room temperature, then measure.
13 Thermal Shock
No marking defects
R6,C8: Within ±10.0%
Step
Temp.
(℃)
1
-55+0/-3
15±3
2
105+3/-0 (For C8)
85+3/-0 (For R6)
15±3
Dissipation
Factor
Insulation
Resistance
Within the specified initial value.
Time
(min.)
Within the specified initial value.
・Initial
measurement
Perform a heat treatment at 150+0/-10 for 1h and then set
for 24±2h at room temperature.
Perform the initial measurement.
14 ESD
Appearance
Capacitance
Dissipation
Factor
No marking defects
Within the specified tolerance
Within the specified initial value.
Per AEC-Q200-002
Voltage setting level : 2kV
Insulation
Resistance
15 Solderability
Within the specified initial value.
95% of the terminations is to be soldered evenly and continuously.
(a) Preheat at 155℃ for 4h. After preheating, immerse the capacitor
in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-5902)
(25%
rosin in mass proportion).
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃ or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5s.
(b) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of ethanol
(JIS-K-8101)
and rosin (JIS-K-5902) (25% rosin in mass
proportion).
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5s.
(c) should be placed into steam aging for 8h+/-15min.
After
preheating, immerse the capacitor in a solution of ethanol
(JIS-K-8101)
and rosin (JIS-K-5902) (25% rosin in mass
proportion).
Immerse in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5s at 260+/-5℃.
16 Electrical
Chatacteri-
zation
Appearance
Capacitance
Dissipation
Factor
No defects or abnormalities
Within the specified tolerance
R6.C8 :0.125max
Visual inspection.
The capacitance/Q/D.F. should be measured at 25℃ at the
frequency and voltage shown in the table.
Char.
Item
Frequency
Voltage
R6,C8
6.3V max.
(C≦10F)
10.1kHz
0.50.1Vrms
R6,C8
10V min.
(C≦10F)
10.1kHz
10.2Vrms
R6,C8
(10F< C)
12024Hz
0.50.1Vrms
Insulation
Resistance
25℃
Insulation
Resistance
85℃(For R6)
105℃(For C8)
Dielectric
Strength
More than 1000MΩ or 50Ω ∙ F (Whichever is smaller)
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25℃ and maximum operating temperature
within 1min of charging.
※
More than 100MΩ or 5Ω ∙ F (Whichever is smaller)
※85+3/-0℃(For
R6), 105+3/-0℃(For C8)
No failure
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5s, provided the
charge/ discharge current is less than 50mA.
JEMCGS-01744M
4
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Appearance
No marking defects
Specifications.
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Capacitance
Within specified tolerance
Then apply a force in the direction shown in Fig 2 for 5±1s
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
such as heat shock.
Dissipation
Factor
Within the specified initial value.
Type
GRT03
GRT15
GRT18
GRT21
GRT31
GRT32
a
0.3
0.5
0.6
0.8
2.0
2.0
b
0.9
1.5
2.2
3.0
4.4
4.4
c
0.3
0.6
0.9
1.3
1.7
2.6
17 Board Flex
Insulation
Resistance
Within the specified initial value.
b
Pressurization
*1,2：2.0±0.05
4.0±0.1
20
50 min.
＊1
φ1.5
+0.1
-0
1.0mm/s
speed
＊2
C
Capacitor
40
R4
Ａ
Pressurize
3.5± 0.05
c
1.75±0.1
(in mm)
Ｂ
a
100
Fig.1
45
45
Support
Capacitance meter
45
45
t : 1.6mm
(GRT03,15:0.8mm)
18 Terminal
Strength
Capacitance
Dissipation
Factor
Within specified tolerance
Within the specified initial value.
Appearance
No marking defects
20 50
Fig.2
Flexure：≦2
0.05以下
(Chip thickness＞0.85mm rank
High Dielectric Type)
Flexure：≦1
(Chip thickness≦0.85mm rank
High Dielectric Type)
8.0±0.3
t
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig3.
Then apply 18N* force in parallel with the test jig for 60s.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*2N(GRT03,15)
Type
a
0.3
0.4
1.0
1.2
2.2
2.2
b
0.9
1.5
3.0
4.0
5.0
5.0
c
0.3
0.5
1.2
1.65
2.0
2.9
Insulation
Resistance
Within the specified initial value.
GRT03
GRT15
GRT18
GRT21
GRT31
GRT32
（in
mm）
c
b
a
ﾗﾝﾄﾞ
b
f4.5
t : 1.6mm
(GRT03,15:0.8mm)
Solder resist
Baked electrode
or copper foil
c
a
19 Beam Load Test
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
Chip thickness = 0.3mm rank : 5N
Chip thickness < 0.3mm rank : 2.5N
< Chip L dimension : 3.2mm min. >
Chip thickness < 1.25mm rank : 15N
Chip
thickness
≧1.25mm
rank : 54.5N
Apply a force.
Fig.3
Place the capacitor in the beam load fixture as Fig 4.
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