2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44
2 通道, 100K bps, 串行通信控制器, PQFP44
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Holt Integrated Circuits |
零件包装代码 | LCC |
包装说明 | QCCJ, |
针数 | 44 |
Reach Compliance Code | unknown |
ECCN代码 | 7A994 |
地址总线宽度 | |
边界扫描 | NO |
最大时钟频率 | 1 MHz |
通信协议 | SYNC, BYTE |
数据编码/解码方法 | NRZ |
最大数据传输速率 | 0.01220703125 MBps |
外部数据总线宽度 | 16 |
JESD-30 代码 | S-PQCC-J44 |
JESD-609代码 | e0 |
长度 | 16.586 mm |
低功率模式 | YES |
湿度敏感等级 | 3 |
串行 I/O 数 | 2 |
端子数量 | 44 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 225 |
认证状态 | Not Qualified |
座面最大高度 | 4.597 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 16.586 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
HI-3282PJI | HI-3282CDI | HI-3282 | HI-3282_06 | HI-3282PQT | HI-3282PQI | HI-3282PJT | HI-3282CDT | HI-3282CDM | |
---|---|---|---|---|---|---|---|---|---|
描述 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 | 2 CHANNEL(S), 100K bps, SERIAL COMM CONTROLLER, PQFP44 |
通信协议 | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE |
外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 44 | 40 | 44 | 44 | 44 | 44 | 44 | 40 | 40 |
表面贴装 | YES | NO | Yes | Yes | YES | YES | YES | NO | NO |
温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
端子形式 | J BEND | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL |
是否无铅 | 含铅 | 不含铅 | - | - | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | - | - | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
厂商名称 | Holt Integrated Circuits | Holt Integrated Circuits | - | - | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits |
零件包装代码 | LCC | DIP | - | - | QFP | QFP | LCC | DIP | DIP |
包装说明 | QCCJ, | DIP, | - | - | LQFP, | LQFP, | QCCJ, | DIP, | DIP, |
针数 | 44 | 40 | - | - | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | compli | - | - | unknow | unknow | unknown | compli | unknow |
ECCN代码 | 7A994 | 7A994 | - | - | 7A994 | 7A994 | 7A994 | 7A994 | 7A994 |
边界扫描 | NO | NO | - | - | NO | NO | NO | NO | NO |
最大时钟频率 | 1 MHz | 1 MHz | - | - | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
数据编码/解码方法 | NRZ | NRZ | - | - | NRZ | NRZ | NRZ | NRZ | NRZ |
最大数据传输速率 | 0.01220703125 MBps | 0.01220703125 MBps | - | - | 0.01220703125 MBps | 0.01220703125 MBps | 0.01220703125 MBps | 0.01220703125 MBps | 0.01220703125 MBps |
JESD-30 代码 | S-PQCC-J44 | R-CDIP-T40 | - | - | S-PQFP-G44 | S-PQFP-G44 | S-PQCC-J44 | R-CDIP-T40 | R-CDIP-T40 |
JESD-609代码 | e0 | e4 | - | - | e0 | e0 | e0 | e4 | e0 |
长度 | 16.586 mm | 51.308 mm | - | - | 10 mm | 10 mm | 16.586 mm | 51.308 mm | 51.308 mm |
低功率模式 | YES | YES | - | - | YES | YES | YES | YES | YES |
串行 I/O 数 | 2 | 2 | - | - | 2 | 2 | 2 | 2 | 2 |
最高工作温度 | 85 °C | 85 °C | - | - | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | - | - | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCJ | DIP | - | - | LQFP | LQFP | QCCJ | DIP | DIP |
封装形状 | SQUARE | RECTANGULAR | - | - | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | - | - | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | 225 | NOT SPECIFIED | - | - | 240 | 240 | 225 | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.597 mm | 5.715 mm | - | - | 1.6 mm | 1.6 mm | 4.597 mm | 5.715 mm | 5.715 mm |
最大供电电压 | 5.25 V | 5.25 V | - | - | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | - | - | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | Tin/Lead (Sn/Pb) | Gold (Au) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) | Tin/Lead (Sn/Pb) |
端子节距 | 1.27 mm | 2.54 mm | - | - | 0.8 mm | 0.8 mm | 1.27 mm | 2.54 mm | 2.54 mm |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | - | - | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 16.586 mm | 15.24 mm | - | - | 10 mm | 10 mm | 16.586 mm | 15.24 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
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