Terms and Conditions
TERMS AND CONDITIONS
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes,
without notice, in the products, including circuits, standard cells, and/or software, described or contained
herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or
liability for the use of any of these products, conveys no license or title under any patent, copyright, or most
work right to these products, and makes no representations or warranties that these products are free from
patent, copyright, or most work right infringement, unless otherwise specified. Applications that are described
herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation products are not designed for use
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Electronics North America Corporation product can reasonably be expected to result in a personal injury.
Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
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so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America
Corporation for any damages resulting from improper use or sale.
Philips Semiconductors and Philips Electronics North America Corporation register eligible circuits under the
Semiconductor Chips Protection Act.
DEFINITIONS
Data Sheet
Identification
Objective
Specification
Preliminary
Specification
Product Status
Formative or in
Design
Preproduction
Product
Definition
This data sheet contains the design target or goal specifications for product
development. Specifications may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be pub-
lished at a later date. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the
best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves
the right to make changes at any time without notice, in order to improve the
design and supply the best possible product.
Product
Specification
Full
Production
©
2000 Philips Electronics North America Corporation, 2000
All rights reserved.
Printed in U.S.A.
TriMedia Product Segment, 811 E. Arques Avenue, Sunnyvale, CA 94088
Foreword
The TriMedia™ TM-1300 is a higher speed, functionally
enhanced version of the TM-1000 media processor.
TM-1300 contains an ultra-high performance Very Long
Instruction Word processor, as well as a complete intelli-
gent video and audio input/output subsystem. The pro-
cessor has an instruction set that is optimized for pro-
cessing audio, video and graphics. It includes powerful
SIMD multimedia operators for eight- and 16-bit signal
datatypes as well as a full complement of 32-bit IEEE
compatible floating point operations.
TM-1300 is intended as a multi-standard programmable
video, audio and graphics processor. It can either be
used standalone, or as an accelerator to a general pur-
pose processor.
The architecture of the TriMedia family came about as
the result of many years of effort of many dedicated indi-
viduals. Going back in history, the origin of TriMedia was
laid by the LIFE-1 VLIW processor, designed by Junien
Labrousse and myself in 1987. Work continued after-
wards in Philips Research Labs, Palo Alto. My special
thanks go to the entire Palo Alto research team: Mike
Ang, Uzi Bar-Gadda, Peter Donovan, Martin Freeman,
Eino Jacobs, Beomsup Kim, Bob Law, Yen Lee, Vijay
Mehra, Pieter van der Meulen, Ross Morley, Mariette
Parekh, Bill Sommer, Artur Sorkin and Pierre Uszynski.
The Palo Alto period matured the architecture—we port-
ed all video and audio algorithms that we could find to the
compiler/simulator and refined the operation set. In addi-
tion, we learned how to give the architecture a market di-
rection. In May 1994, Philips management—in particular
Cees-Jan Koomen, Eddy Odijk, Theo Claasen and Doug
Dunn—decided to develop TriMedia into a major Philips
Semiconductors product line.
Under the guidance of Keith Flagler, the TriMedia team
was built. All of them contributed to take this from a set
of interesting ideas to a reliable and competitive product
in a short period of time. The initial TriMedia team includ-
ed Fuad Abu Nofal, Karel Allen, Mike Ang, Robert Aqui-
no, Manju Asthana, Patrick de Bakker, Shiv Balakrish-
nan, Jai Bannur, Marc Berger, Sunil Bhandari, Rusty
Biesele, Ahmet Bindal, David Blakely, Hans Bouw-
meester, Steve Bowden, Robert Bradfield, Nancy
Breede, Shawn Brown, Sujay Chari, Catherine Chen,
Howen Chen, Yan-ming Chen, Yong Cho, Scott Clapper,
Matthew Clayson, Paul Coelho, Richard Dodds, Marc
Duranton, Darcia Eding, Aaron Emigh, Li Chi Feng, Keith
Flagler, Jean Gobert, Sergio Golombek, Mike Grim-
wood, Yudi Halim, Hari Hampapuram, Carl Hartshorn,
Judy Heider, Laura Hrenko, Jim Hsu, Eino Jacobs, Mar-
cel Janssens, Patricia Jones, Hann-Hwan Ju, Jayne Kei-
th, Bhushan Kerur, Ayub Khan, Keith Knowles, Mike
Kong, Ashok Krishnamurti, Yen Lee, Patrick Leong, Bill
Lin, Laura Ling, Chialun Lu, Naeem Maan, Nahid Man-
sipur, Mike Maynard, Vijay Mehra, Jun Mejia, Derek
Meyer, Prabir Mohanty, Saed Muhssin, Chris Nelson,
Stephen Ness, Keith Ngo, Francis Nguyen, Kathleen
Nguyen, Derek Noonburg, Ciaran O’Donnel, Sang-Ju
Park, Charles Peplinski, Gene Pinkston, Maryam Piray-
ou, Pardha Potana, Bill Price, Victor Ramamoorthy,
Babu Rao Kandamilla, Ehsan Rashid, Selliah Rathnam,
Margaret Redmond, Donna Richardson, Alan Rodgers,
Tilakray Roychoudhury, Hani Salloum, Chris Salzmann,
Bob Seltzer, Ravi Selvaraj, Jim Shimandle, Deepak
Singh, Bill Sommer, Juul van der Spek, Manoj Srivasta-
va, Renga Sundararajan, Ken-Sue Tan, Ray Ton, Steve
Tran, Cynthia Tripp, Ching-Yih Tseng, Allan Tzeng, Bar-
bara Vendelin, John Vivit, Rudy Wang, Rogier Wester,
Wayne Wonchoba, Anthony Wong, Sara Wu, David Wy-
land, Ken Xie, Vincent Xie, Bettina Yeung, Robert Yin,
Charles Young, Grace Yun, Elena Zelayeta and Vivian
Zhu.
Expert help and feedback was received from many. In
particular, I’d like to mention Kees van Zon of Philips
Eindhoven for the help with filtering-related issues, and
Craig Clapp of PictureTel for excellent feedback on all
aspects of the architecture.
My special thanks go to Joe Kostelec. He made me un-
derstand that my ambitions could better be realized in
California than in Europe. Furthermore, his vision and his
wisdom are credited with keeping this project alive and
growing until the ‘investment decision.’
The vision of a universal media accelerator is credited to
Jaap de Hoog. Jaap, I wish you were here to see it come
to fruition.
–Gerrit Slavenburg
PRODUCT SPECIFICATION
i
Table of Contents
Foreword
1 Pin List
1.1 TM1300 versus TM1100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 Boundary Scan Notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.3 I/O Circuit Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.4 Signal Pin List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.5 Power Pin List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
1.6 Pin Reference Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
1.7 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1.8 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1.9 Parametric Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1.9.1 Operating Range and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1.9.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1.9.3 Power Supply Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1.9.4 DC/AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1.9.4.1 TM-1300 and DSPCPU Core Current and Power Consumption Details . . . . . . . . . . . . 1-12
1.9.4.2 TM-1300 Peripheral Current Consumption Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13
1.9.4.3 STRG3, STRG5 type I/O circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.9.4.4 NORM3 type I/O circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.9.4.5 WEAK5 type I/O circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.9.4.6 IICOD (I2c) type I/O circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.9.4.7 SDRAM interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15
1.9.4.8 PCI Bus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15
1.9.4.9 JTAG I/O timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.9.4.10 I2C I/O timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.9.4.11 Video In I/O Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.9.4.12 Video Out I/O Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.9.4.13 AudioIn I/O timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
1.9.4.14 Audio Out I/O timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
1.9.4.15 SSI I/O timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
2 Overview
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 TM1300 Fundamentals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.3 TM1300 Chip Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.4 Brief Examples of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
PRODUCT SPECIFICATION
iii
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