IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer
| 参数名称 | 属性值 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | ACT |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 传播延迟（tpd） | 12 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 54ACT258LM | 54ACT258FM | 54ACT258DM | |
|---|---|---|---|
| 描述 | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16, Multiplexer/Demultiplexer |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | QCCN, | DFP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown |
| 系列 | ACT | ACT | ACT |
| JESD-30 代码 | S-CQCC-N20 | R-GDFP-F16 | R-GDIP-T16 |
| 长度 | 8.89 mm | 9.6645 mm | 19.43 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 |
| 输出次数 | 1 | 1 | 1 |
| 端子数量 | 20 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DFP | DIP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | IN-LINE |
| 传播延迟（tpd） | 12 ns | 12 ns | 12 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.905 mm | 2.032 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL |
| 宽度 | 8.89 mm | 6.604 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 |
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