Product Number: 803-93-032-10-001000
Description:
Interconnect Socket
Standard Solder Tail Socket
Accepts .025"- .037" (0,635 - 0,94
mm)dia leads
Double Row
Through Hole
Plating Code:
93
Shell Plating:
200 μ" Tin/Lead(93/7) over 100 μ"
Nickel
Inner Contact Plating:
30 μ" Gold over 50 μ" Nickel
#
Of
Pins
32
Mill-Max
Part
Number
803-93-032-10-001000
RoHS
Compliant
CONTACT:
Contact Used: #47, Standard 6 Finger Contact
Current Rating =
4.5 Amps
BERYLLIUM COPPER ALLOY
172 (UNS C17200) per ASTM B 194
Properties of BERYLLIUM COPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Hardness: 36-43 Rockwell C
Mechanical Life: 1000 Cycles Min.
Density: .298 lbs/in3
Electrical Conductivity: 22% IACS*
Resistance: 10 miliohms Max
Operating Temperature: -55°C/+125°C
Melting point: 980°C/865°C (liquidus/solidus)
Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 °C; 70% of stress remains after 1,000 hours
@ 200 °C
*International Annealed Copper Standard, i.e. as a % of pure copper.
†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For
applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.
Mill-Max Mfg. Corp. Datasheet — Last Modified 1/26/2018
Page 1 of 3
LOOSE PIN:
Pin Used: 1304 (Brass Alloy)
BRASS ALLOY
360 per ASTM B 16, or 385 per ASTM B455
Properties of BRASS ALLOY 360 ASTM B 16:
Chemical composition: Cu 63% (max), Pb 3.7% (max)†, Fe .35% (max), Zn remainder
Temper as machined: H02/H04
Yield Strength: 25-45 ksi
Tensile strength: 57-80 ksi
Hardness as machined: 80-90 Rockwell B
Electrical conductivity: 26% IACS*
Melting point: 1000°C/840°C (liquidus/solidus)
Properties of BRASS ALLOY 385 ASTM B 455:
Chemical composition: Cu 60% (max), Pb 3.5% (max)†, Fe .35% (max), Zn remainder
Temper as machined: H02/H04
Yield Strength: 16 ksi(min)
Tensile strength: 48 ksi(min)
Hardness as machined: 80-90 Rockwell B
Electrical conductivity: 28% IACS*
Melting point: 1000°C/840°C (liquidus/solidus)
After machining, brass parts are often annealed (softened) for subsequent bending, swaging or crimping. A partial anneal
down to 60±10 RB is recommended for 90° bends, a full anneal down to 35±15 RB is recommended for pins or terminals
that are swaged (riveted) to a circuit board or crimped to a wire.
†RoHS-2 directive 2011/65/EU, exemption 6c allows up to 4% lead as an alloy agent in copper.
*International Annealed Copper Standard, i.e. as a % of pure copper.
INSULATOR INFORMATION:
PCT
Polyester, (Thermx CG933, black)
High Temperature
Properties of PCT Polyester:
Brand: Thermx
Grade: CG-933
Rated voltage: 100 VRMS/150 VDC
Insulation resistance: 10,000 Megaohms min.
Material Heat Deflection Temp (per ASTM D 648): 529°F (276°C) @ 66 psi
Dielectric strength: 1000 VRMS min. (700 VRMS min. for series 117 Shrink DIP)
Note: Materials above 446°F (230°C) are considered suitable for "eutectic" reflow soldering, above 500°F (260°C) for
"lead-free" reflow soldering.
Certificate of Compliance:
This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all
applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship.
This Certificate of Compliance covers the following requirements:
Dimensional (all features verified to be within tolerances described on the applicable drawing).
Raw Material (materials and properties verified to be as described on the applicable drawing).
Plating (platings as required, thickness verified, and performance including solderability per mil-standard).
Performance (insertion extraction or other force requirements as described on the applicable drawing).
Mill-Max Mfg. Corp. Datasheet — Last Modified 1/26/2018
Page 2 of 3
Compliance Statement for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)
Reference:
1. Regulation EC No 1907/2006 of the European Parliament and of the Council of 18 December 2006, concerning the
Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)
2. ECHA, Candidate list of Substances of Very High Concern (SVHC)
http://echa.europa.eu/reach_en.asp
Mill-Max is aware of the regulation and the SVHC list the EU published (referenced above). Mill-Max does not produce or
sell any of the listed substances in their homogeneous form. These substances are not intentionally added during the
manufacturing of any Mill-Max products. To our knowledge, our products do not contain the substances described on the
ECHA SVHC list. Testing is not performed for materials and substances that were not intentionally added. No warranty,
liability of indemnification is expressed or implied with this information. Mill-Max maintains surveillance of the ECHA website
to obtain the latest information and periodically reviews the SVHC list for changes and additions.
Compliance Statement for DRC Conflict Free products.
Reference:
Dodd-Frank Wall Street Reform and Consumer Protection Act, Section 1502, reporting requirements for users of conflict
minerals.
“Conflict minerals,” are Columbite-tantalite (coltan), cassiterite, gold, wolframite, or their derivatives; or any other mineral
or its derivatives determined by the Secretary of State to be financing conflict in the Democratic Republic of the Congo
(DRC) or an adjoining country. Metals derived from these minerals are tin, tantalum, tungsten, and gold. By this definition,
the only minerals of concern that may be found in Mill-Max products are tin and gold.
Mill-Max Mfg.Corp. hereby certifies that its products are manufactured with tin and gold that is derived from material that
is considered DRC Conflict Free. Mill-Max provides this assurance as a result of a due diligence process that includes
traceability to the source and in some cases the identification of recycled and scrap materials included in the subject
material.
Mill-Max Mfg. Corp. Datasheet — Last Modified 1/26/2018
Page 3 of 3
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
