8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16
8通道, SGL 终端多路复用器, CDFP16
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最大工作温度 | 125 Cel |
| 最小工作温度 | -55 Cel |
| 额定供电电压 | 15 V |
| 加工封装描述 | CERAMIC, DFP-16 |
| 无铅 | Yes |
| 欧盟RoHS规范 | Yes |
| 状态 | ACTIVE |
| 工艺 | CMOS |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | FLATPACK |
| 表面贴装 | Yes |
| 端子形式 | FLAT |
| 端子间距 | 1.27 mm |
| 端子涂层 | NOT SPECIFIED |
| 端子位置 | DUAL |
| 包装材料 | CERAMIC, METAL-SEALED COFIRED |
| 温度等级 | MILITARY |
| 输入数 | 8 |
| 最大接通时间 | 3000 ns |
| 最大关断时间 | 3000 ns |
| 模拟IC其它类型 | SGL ENDED MULTIPLEXER |
| 关闭状态下的隔离额定值 | 45 dB |
| 最大限制模拟输入电压 | 15 V |
| 额定负供电电压 | -15 V |
| 最大通态电阻 | 1800 ohm |

| HS1-508BRH/PROTO | HS-508BRH | HS-508BRH_01 | HS1-508BRH-8 | HS9-508BRH-8 | HS9-508BRH-Q | HS9-508BRH/PROTO | HS1-508BRH-Q | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最大工作温度 | 125 Cel | 125 Cel | 125 Cel | 125 Cel | 125 Cel | 125 Cel | 125 Cel | 125 Cel |
| 最小工作温度 | -55 Cel | -55 Cel | -55 Cel | -55 Cel | -55 Cel | -55 Cel | -55 Cel | -55 Cel |
| 额定供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 加工封装描述 | CERAMIC, DFP-16 | CERAMIC, DFP-16 | CERAMIC, DFP-16 | CERAMIC, DFP-16 | CERAMIC, DFP-16 | CERAMIC, DFP-16 | CERAMIC, DFP-16 | CERAMIC, DFP-16 |
| 无铅 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| 欧盟RoHS规范 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| 状态 | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| 工艺 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 包装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 包装尺寸 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 表面贴装 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| 端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
| 端子间距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子涂层 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 输入数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大接通时间 | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns |
| 最大关断时间 | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns |
| 模拟IC其它类型 | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER | SGL ENDED MULTIPLEXER |
| 关闭状态下的隔离额定值 | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB |
| 最大限制模拟输入电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 额定负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 最大通态电阻 | 1800 ohm | 1800 ohm | 1800 ohm | 1800 ohm | 1800 ohm | 1800 ohm | 1800 ohm | 1800 ohm |
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