电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MV1N5935CUR-1

产品描述Zener Diode
产品类别分立半导体    二极管   
文件大小293KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

MV1N5935CUR-1概述

Zener Diode

MV1N5935CUR-1规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码DO-213AB
包装说明O-LELF-R2
针数2
Reach Compliance Codecompli
ECCN代码EAR99
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e0
元件数量1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
参考标准MIL-19500
标称参考电压27 V
表面贴装YES
技术ZENER
端子面层Tin/Lead (Sn/Pb)
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差2%
工作测试电流13.9 mA
Base Number Matches1

文档预览

下载PDF文档
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
Available
Metallurgically Bonded Glass Surface Mount
1.5 Watt Zener Diodes
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar
in electrical features to the JEDEC registered 1N5913B through 1N5956B axial-leaded
package for 3.3 to 200 V. It is an ideal selection for applications of high density and low
parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced
internal contacts, it may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in
Features below.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-213AB MELF
Package
Also available in:
DO-41 package
(glass axial-leaded)
1N5913BG – 1N5956BG
FEATURES
Surface mount equivalent of JEDEC registered 1N5913B TO 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Voltage tolerances of 10%, 5%, 2% and 1% are available.
Screening in reference to MIL-PRF-19500 is available.
(See
part nomenclature
for all available options.)
RoHS compliant versions are available.
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
APPLICATIONS / BENEFITS
Regulates voltage over a broad ranges of operation current and temperature.
Leadless package ideal for high-density surface mounting.
Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance.
Hermetically sealed glass package.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Specified capacitance (see
figure 2).
Inherently radiation hard as described in Microsemi
MicroNote 050.
o
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
MAXIMUM RATINGS
@ T
A
= 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
(1)
Thermal Resistance Junction-to-Ambient
Steady State Power Dissipation
@ T
EC
≤ 115 ºC
(1)
@ T
A
= 25 ºC
Rated Average Power Dissipation (also see
figure 1)
Forward Voltage
@ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
& T
STG
R
ӨJEC
R
ӨJA
P
D
P
M(AV)
V
F
T
SP
Value
-65 to +175
40
120
1.5
1.25
1.5
1.2
260
Unit
o
C
o
C/W
o
C/W
W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 1 of 5
EVC有gridctrl这个控件吗?哪能下载到啊?
VC不自带这个控件,要下载.不知道EVC是否支持这个控件?...
yy230 嵌入式系统
中断系统
有关中断的概念 什么是中断,我们从一个生活中的例子引入。你正在家中看书,突然电话铃响了,你放下书本,去接电话,和来电话的人交谈,然后放下电话,回来继续看你的书。这就是生活中的“中 ......
rain 单片机
请问"禁能中断"的确切含义"
如果我禁能了一个中断源, 不论什么平台吧, ARM或51都无所谓. 那么当这个中断到来时, 中断标志位会被置上吗? "禁能"的意思究竟是中断标志位不会被置上, 还是说标志位会被置上, 但不会跳转到相 ......
tenglin606 嵌入式系统
“约会春天”+门前春色
“约会春天”+门前春色 春天的季节琵琶黄了,熟透的早已经被鸟儿吃几口了!剩下的挂在树梢上 475263 杨梅还是青的 ,估计1个月鸟儿又有的吃了 475264475265 月季花开 ......
蓝雨夜 聊聊、笑笑、闹闹
发现了这个Fireduino
本帖最后由 飞鸿浩劫 于 2016-12-9 14:33 编辑 芯片是RKNanoD,双核CM3,平台好像是ARDUINO,不明觉厉 270943 270944 270946 270947 270948RKnanoD芯片特性: 双核Cortex-M3,集成1MB ......
飞鸿浩劫 ARM技术
摄像头保存录像问题
我现在是可以录像,把单个帧存成图片,我现在想保存录像存放在SD卡中,以后还要回调查阅的,有什么好的方法没?...
chphphp 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2159  770  345  2419  516  54  2  57  4  30 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved