HSMB-Cxxx
Surface Mount Chip LEDs
Data Sheet
HSMB-C190, HSMB-C170, HSMB-C110,
HSMB-C150, HSMB-C191
Description
These Blue chip LEDs are designed in an industry standard
package for ease of handling and use. Blue color chip
LED is a new product that offers color differentiation for
backlighting applications.
The HSMB-C150 has the industry standard 3.2 x 1.6 mm
footprint that is excellent for all around use. The HSMB-
C170 has the widely used 2.0 x 1.25 mm footprint. The
HSMB-C190 and HSMB-C191 have the industry standard
1.6 x 0.8 mm footprint, and their low profiles (0.8 mm for
HSMB-C190 and 0.6 mm for HSMB-C191) and wide view-
ing angles make these LEDs exceptional for backlighting
applications.
The HSMB-C110 is a right-angle package with the univer-
sally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is
ideal for LCD backlighting and sidelighting applications.
All packages are compatible with IR reflow solder pro-
cesses. The small size and wide viewing angle make these
LEDs prime choices for backlighting applications and front
panel illumination especially where space is a premium.
Features
•
•
•
•
•
•
•
•
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature Range of –30°C to +85°C
Right Angle Package Available
SiC Blue Color
Available in 8 mm Tape on 7" (178 mm) Diameter
Reels
Applications
•
•
•
•
•
Keypad Backlighting
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
Device Selection Guide
Footprint (mm)
2.00 x 1.25
1.60 x 0.80
3.20 x 1.00
[1]
3.20 x 1.60
Note:
SiC Blue
HSMB-C170
HSMB-C190/C191
HSMB-C110
HSMB-C150
Parts Per Reel
4000
4000
3000
3000
1.
Right-angle package.
CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions
during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIE
CATHODE
MARK
LED DIE
CATHODE
MARK
0.8 (0.031)
1.6
(0.063 )
0.4 (0.016)
1.25 (0.049)
2.0 (0.079 )
0.62 (0.024)
1.0
(0.039)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
POLARITY
DIFFUSED
EPOXY
0.3 (0.012)
PC BOARD
1.4
(0.055)
POLARITY
0.8 (0.031)
0.8 (0.031)
0.3 (0.012)
0.3 (0.012)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMB-C190
HSMB-C190 Pkg Dimen - a (C190)
CATHODE
HSMB-C170
HSMB-C190 Pkg Dimen - b (C170)
LED DIE
LINE
1.0 (0.039)
LED DIE
CATHODE
MARK
2.6 (0.102 )
3.2 (0.126 )
CLEAR
EPOXY
1.5 (0.059)
PC BOARD
1.6 (0.063 )
3.2 (0.126 )
0.8 (0.031)
CATHODE LINE
0.5 (0.020)
DIFFUSED
EPOXY
0.6 (0.024)
1.6 (0.063)
0.8 (0.031)
POLARITY
3.2 (0.126 )
2.0 (0.079)
POLARITY
1.1 (0.043)
PC BOARD
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMB-C110
2
HSMB-C110
HSMx-C190 Pkg Dimen - a (C150)
HSMB-C150
LED DIE
CATHODE
MARK
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
POLARITY
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.6 (0.023)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMB-C191
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C191
Absolute Maximum Ratings at T
A
=25°C
N
otes:
Parameter
HSMB-C190/C170/C110/C150/C191
DC Forward Current
[1]
20
Peak Pulsing Current
[2]
100
Power Dissipation
92
Reverse Voltage (I
R
= 100 µA)
5
Maximum LED Junction Temperature
95
Operating Temperature Range
-30 to +85
Storage Temperature Range
-40 to +85
Soldering Temperature
See reflow soldering profile (Figure 7 & 8)
Units
mA
mA
mW
V
°C
°C
°C
1.
Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
3
Optical Characteristics at T
A
=25°C
Part No.
HSMB-
C190/C170/
C150/C191
HSMB-C110
N
otes:
Color
SiC Blue
SiC Blue
Luminous
Intensity
[1]
I
v
(mcd) @ 20 mA
Min.
Typ.
1.80
6.0
1.80
6.5
Peak
Wavelength
λ
peak
(nm)
Typ.
428
428
Dominant
Wavelength
λ
d
(nm)
Typ.
466
466
Viewing
Angle 2θ
1/2
(degrees)
[2]
Typ.
170
130
1.
The luminous intensity, I
v
, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the
lamp package.
2. u
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at T
A
=25°C
Forward Voltage
V
F
(Volts)
@ I
F
= 20 mA
Typ.
Max.
3.8
4.6
3.8
4.6
Reverse
Breakdown
V
R
(Volts)
@ I
R
= 100 µA
Min.
5
5
Thermal
Resistance
Rθ
J-P
(°C/W)
Typ.
300
300
Capacitance C
(pF) @ V
F
= 0 V,
f = 1 MHz
Typ.
67
67
Part No.
HSMB-C190/C170/C150/C191
HSMB-C110
V
F
Tolerance: ±0.1 V
Light Intensity (Iv) Bin Limits
[1]
Blue Color Bins
[1]
Dom. Wavelength (nm)
Min.
Max.
460.0
465.0
465.0
470.0
470.0
475.0
475.0
480.0
Intensity
(mcd)
Bin ID
Min.
Max.
A
0.11
0.18
B
0.18
0.29
C
0.29
0.45
D
0.45
0.72
E
0.72
1.10
F
1.10
1.80
G
1.80
2.80
H
2.80
4.50
J
4.50
7.20
K
7.20
11.20
L
11.20
18.00
M
18.00
28.50
Tolerance: ±15%
Intensity (mcd)
Bin ID
Min.
N
28.50
P
45.00
Q
71.50
R
112.50
S
180.00
T
285.00
U
450.00
V
715.00
W
1125.00
X
1800.00
Y
2850.00
Max.
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Bin ID
A
B
C
D
Tolerance: ±1 nm
Note:
1. Bin categories are established for class-
ification of products. Products may not be
available in all categories. Please contact
your Avago representative for information
on currently available bins.
Note:
1. Bin categories are established for classification of products. Products may not be available in
all categories. Please contact your Avago representative for information on currently avail-
able bins.
4
100
I
F
– FORWARD CURRENT – mA
RELATIVE INTENSITY – %
80
60
40
20
0
380
100
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.2
1.0
0.8
0.6
0.4
0.2
0
10
1
480
580
680
0.1
3.0
3.2
3.4
3.6
3.8
4.0
0
5
10
15
20
25
WAVELENGTH – nm
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
Figure 1. Relative Intensity vs. Wavelength.
HSMB-C190 fig 1
Figure 2. Forward Current vs. Forward Voltage.
HSMB-C190 fig 2
Figure 3. Relative Luminous Intensity vs. Forward
Current.
HSMB-C190 fig 3
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
25
20
15
10
5
0
100
90
RELATIVE INTENSITY – %
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
20
40
60
80
100
0
10 20 30 40 50 60 70 80 90
T
A
– AMBIENT TEMPERATURE – °C
ANGLE
Figure 4. Maximum Forward Current vs. Ambient
Temperature.
HSMB-C190 fig 4
RELATIVE INTENSITY – %
100
90
80
70
60
50
40
30
20
10
HSMB-C190 fig 5a
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative Intensity vs. Angle for HSMB-C110.
fig 5b
HSMB-C190
5
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
