Surface Mount Chip LEDs
Technical Data
HSMx-C110/C120/C150/
C170/C177/C190/C191/
C197/C265
Features
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature
Range of -30
°
C to +85
°
C
• Right Angle & Reverse
Mount Package Available
• Various Colors Available
• Available in 8 mm Tape on
7 in. (178 mm) Diameter
Reels
•
•
•
•
•
Description
These chip LEDs are designed
in an industry standard package
for ease of handling and use.
Various different LED colors are
available in nine compact, single
color packages.
The HSMx-C150 has the industry
standard 3.2 x 1.6 mm footprint
that is excellent for all around use.
The HSMx-C170 has the widely
used 2.0 x 1.25 mm footprint with
0.8 mm profile. The HSMx-C177
has the widely used 2.0 x 1.25 mm
footprint with 0.4 mm profile. The
HSMx-C19x series has the industry
standard 1.6 x 0.8 mm footprint
with varying profile to suit
designers needs, the HSMx-C190
has 0.8 mm profile, the HSMx-
C191 has a low profile of 0.6 mm,
and the HSMx-C197 has the ultra
low profile of 0.4 mm. This family
with its thin profile and wide
viewing angle makes this LED
exceptional for backlighting
applications.
The HSMx-C110 is a right angle
package with the universally
accepted dimensions of 3.2 x 1.0
x 1.5 mm. The HSMx-C120 is a
smaller right angle package with
industry standard 1.6 x 0.6 x 1.0
mm. HSMx-C265 is a reverse
Applications
•
•
•
•
•
Keypad Backlighting
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
mount package with dimensions
of 3.4 x 1.25 x 1.1 mm. These
devices are ideal for LCD
backlighting and sidelighting
applications.
In order to facilitate pick and
place operation, these chip LEDs
are shipped in tape and reel with
4000 units per reel for HSMx-
C120, C170, C177, C190, C191,
C197 packages, and 3000 units
per reel for HSMx-C110, C150,
C265 packages.
All packages are compatible with
IR reflow solder processes. The
small size and wide viewing angle
make these LEDs prime choices
for backlighting applications and
front panel illumination especially
where space is a premium.
2
Device Selectiion Guide
GaP
Green
HSMG-C110
HSMG-C120
HSMG-C150
HSMG-C170
HSMG-C177
HSMG-C190
HSMG-C191
HSMG-C197
HSMG-C265
As AlGaAs
Red
HSMH-C110
HSMH-C120
HSMH-C150
HSMH-C170
HSMH-C190
HSMH-C191
HSMH-C265
HER
HSMS-C110
HSMS-C120
HSMS-C150
HSMS-C170
HSMS-C177
HSMS-C190
HSMS-C191
HSMS-C197
–
Orange
HSMD-C110
HSMD-C120
HSMD-C150
HSMD-C170
HSMD-C177
HSMD-C190
HSMD-C191
HSMD-C197
–
Yellow
HSMY-C110
–
HSMY-C150
HSMY-C170
–
HSMY-C190
HSMY-C191
HSMY-C197
–
Description
Untinted, Non-Diffused
Untinted, Non-Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-Diffused
Description
Untinted, Non-Diffused
Untinted, Non-Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-Diffused
3
Package Dimensions
LED DIE
CATHODE (ANODE MARK FOR
HSMH-C150)
MARK
CATHODE (ANODE MARK FOR
MARK
HSMH-C170)
LED DIE
1.6 (0.063)
0.8 (0.031)
1.25 (0.049)
0.62 (0.024)
3.2 (0.126 )
2.0 (0.079 )
DIFFUSED
EPOXY
0.6 (0.024)
2.0 (0.079)
POLARITY
[3]
DIFFUSED
EPOXY
0.3 (0.012)
1.4
(0.055)
POLARITY
[3]
1.1 (0.043)
PC BOARD
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
PC BOARD
0.8 (0.031)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C150
CATHODE (ANODE MARK FOR
HSMH-C190)
MARK
HSMx-C170
LED DIE
CATHODE
LINE
(ANODE MARK
FOR HSMH-C110)
LED DIE
1.0 (0.039)
0.8 (0.031)
0.4 (0.016)
2.6 (0.102 )
3.2 (0.126 )
CLEAR
EPOXY
1.5 (0.059)
PC BOARD
0.5 (0.020)
POLARITY
1.6
(0.063 )
1.0
(0.039)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
POLARITY
[3]
0.8 (0.031)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
1.6 (0.063 )
3.2 (0.126 )
0.8 (0.031)
CATHODE LINE
1.0 (0.039)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C190
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
HSMx-C110
4
CATHODE MARK
LED DIE
CATHODE
MARK
LED DIE
0.8 (0.031)
0.4 (0.016)
0.62
(0.025)
1.25
(0.049)
1.6
(0.063 )
2.00 (0.079)
1.0
(0.039)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
POLARITY
DIFFUSED EPOXY
0.40 (0.016)
POLARITY
PC BOARD
0.16 (0.006)
0.8 (0.031)
0.26 (0.010)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
CATHODE LINE
0.40 ± 0.15
(0.016 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
1.10 (0.043) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C191
HSMx-C177
3.4 (0.134)
LED DIE
CATHODE
MARK (ETCHED)
[ANODE MARK FOR HSMH-C265]
CATHODE MARK
LED DIE
1.25 (0.049)
0.80
(0.031)
GREEN SOLDER MASK
POLARITY
UNDIFFUSED
EPOXY
1.1 (0.043)
PC BOARD
0.3 (0.012)
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
1.2
(0.047)
0.40 (0.016)
1.60
(0.063)
POLARITY
DIFFUSED
EPOXY
1.1 (0.043)
PC BOARD
0.40 (0.016)
0.16 (0.006)
CATHODE LINE
0.30 ± 0.15
(0.012 ± 0.006)
0.70 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C265
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
HSMx-C197
5
LED DIE
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
0.3 (0.012)
0.6 (0.024)
1.6 (0.063)
POLARITY
CLEAR EPOXY
1.2 (0.047)
1.0 (0.039)
PC BOARD
0.4 (0.016)
3 – 0.3 (0.012)
CATHODE LINE
SOLDERING
TERMINAL
HSMx-C120
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1x0 will be the opposite of what is shown on above drawings.
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
