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HSMP-386B

产品描述SILICON, PIN DIODE
产品类别半导体    分立半导体   
文件大小81KB,共12页
制造商HP(Keysight)
官网地址http://www.semiconductor.agilent.com/
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HSMP-386B概述

SILICON, PIN DIODE

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Surface Mount PIN Diodes
in SOT-323 (SC-70 3-Lead)
Technical Data
HSMP-381B/C/E/F
HSMP-386B/C/E/F
HSMP-389B/C/E/F
HSMP-481B, -482B, -489B
Features
• Diodes Optimized for:
Low Current Switching
Low Distortion Attenuating
Ultra-Low Distortion Switching
Microwave Frequency
Operation
• Surface Mount SOT-323
(SC-70)Package
Single and Pair Versions
Tape and Reel Options
Available
• Low Failure in Time (FIT)
Rate*
* For more information see the
Surface Mount PIN Reliability
Data Sheet.
Package Lead Code
Identification
(Top View)
SINGLE
SERIES
Description/Applications
The HSMP-381B/C/E/F series is
specifically designed for low
distortion attenuator applications.
The HSMP-386B/C/E/F series is a
general purpose PIN diode
designed for low current attenua-
tors and low cost switches. The
HSMP-389B/C/E/ F series is
optimized for switching applica-
tions where low resistance at low
current, and low capacitance are
required.
The HSMP-48XB series is special
products featuring ultra low
parasitic inductance in the SOT-
323 package, specifically designed
for use at frequencies which are
much higher than the upper limit
for conventional SOT-323 PIN
diodes. The HSMP-481B diode is a
low distortion attenuating PIN
designed for operation to 3 GHz.
The HSMP-482B diode is ideal for
limiting and low inductance
switching applications up to
1.5 GHz. The HSMP-489B is
optimized for low current switch-
ing applications up to 3 GHz.
B
COMMON
ANODE
C
COMMON
CATHODE
E
DUAL ANODE
F
DUAL CATHODE
482B / 489B
481B
Absolute Maximum Ratings
[1]
, T
C
= + 25°C
Symbol Parameter
I
f
P
iv
T
J
T
STG
θ
jc
Unit Absolute Maximum
1
Same as V
BR
150
-65 to 150
300
Forward Current (1
µs
Pulse) Amp
Peak Inverse Voltage
V
Junction Temperature
°C
Storage Temperature
°C
Thermal Resistance
[2]
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. T
C
= 25°C, where T
C
is defined to be the temperature at the package
pins where contact is made to the circuit board.

 
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