Surface Mount PIN Diodes
Technical Data
HSMP-386x Series
Features
• Unique Configurations in
Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
• Switching
– Low Distortion Switching
– Low Capacitance
• Attenuating
– Low Current Attenuating for
Less Power Consumption
• Matched Diodes for
Consistent Performance
• Better Thermal
Conductivity for Higher
Power Dissipation
• Low Failure in Time (FIT)
Rate
[1]
• Lead-free Option Available
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
Pin Connections and
Package Marking, SOT-363
1
2
3
6
5
4
Description/Applications
The HSMP-386x series of general
purpose PIN diodes are designed
for two classes of applications.
The first is attenuators where
current consumption is the most
important design consideration.
The second application for this
series of diodes is in switches
where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total
Capacitance (C
T
) and Total
Resistance (R
T
) are typical specifi-
cations. For applications that
require guaranteed performance,
the general purpose HSMP-383x
series is recommended.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.
Notes:
1. Package marking provides
orientation, identification, and
date code.
2. See “Electrical Specifications” for
appropriate package marking.
LUx
2
Package Lead Code
Identification, SOT-23
(Top View)
SINGLE
SERIES
Package Lead Code
Identification, SOT-323
(Top View)
SINGLE
SERIES
Package Lead Code
Identification, SOT-363
(Top View)
UNCONNECTED
TRIO
6
5
4
#0
COMMON
ANODE
#2
COMMON
CATHODE
B
COMMON
ANODE
C
1
2
3
COMMON
CATHODE
L
#3
#4
E
F
Absolute Maximum Ratings
[1]
T
C
= +25°C
Symbol
I
f
P
IV
T
j
T
stg
θ
jc
Parameter
Forward Current (1
µs
Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
[2]
Unit
Amp
V
°C
°C
°C/W
SOT-23
1
50
150
-65 to 150
500
SOT-323
1
50
150
-65 to 150
150
ESD WARNING:
Handling Precautions Should Be
Taken To Avoid Static Discharge.
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2. T
C
= +25°C, where T
C
is defined to be the temperature at the package pins where
contact is made to the circuit board.
Electrical Specifications T
C
= 25°C, each diode
PIN General Purpose Diodes, Typical Specifications T
A
= 25°C
Part Number
HSMP-
3860
3862
3863
3864
386B
386C
386E
386F
386L
Test Conditions
Package
Marking
Code
L0
[1]
L2
[1]
L3
[1]
L4
[1]
L0
[2]
L2
[2]
L3
[2]
L4
[2]
LL
[2]
Lead
Code
0
2
3
4
B
C
E
F
L
Minimum
Typical
Typical
Breakdown
Series Resistance Total Capacitance
Voltage V
BR
(V)
R
S
(Ω)
C
T
(pF)
50
3.0/1.5*
0.20
Configuration
Single
Series
Common Anode
Common Cathode
Single
Series
Common Anode
Common Cathode
Unconnected Trio
V
R
= V
BR
Measure
I
R
≤
10
µA
I
F
= 10 mA
f = 100 MHz
I
F
= 100 mA*
V
R
= 50 V
f = 1 MHz
Notes:
1. Package marking code is laser marked.
3
HSMP-386x Typical Parameters at T
C
= 25°C
Part Number
HSMP-
386x
Test Conditions
Total Resistance
R
T
(Ω)
22
I
F
= 1 mA
f = 100 MHz
Carrier Lifetime
τ
(ns)
500
I
F
= 50 mA
T
R
= 250 mA
Reverse Recovery Time
T
rr
(ns)
80
V
R
= 10 V
I
F
= 20 mA
90% Recovery
Total Capacitance
C
T
(pF)
0.20
V
R
= 50 V
f = 1 MHz
Typical Performance, T
C
= 25°C, each diode
0.35
1000
INPUT INTERCEPT POINT (dBm)
T
A
= +85°C
T
A
= +25°C
T
A
= –55°C
120
TOTAL CAPACITANCE (pF)
0.30
1 MHz
0.25
100 MHz
0.20
1 GHz
RESISTANCE (OHMS)
100
Diode Mounted as a
Series Switch in a
115
50
Ω
Microstrip and
Tested at 123 MHz
110
105
100
95
90
85
10
0.15
0
2
4
6
8
10 12 14 16 18 20
1
0.01
0.1
1
10
100
1
10
30
REVERSE VOLTAGE (V)
BIAS CURRENT (mA)
I
F
– FORWARD BIAS CURRENT (mA)
Figure 1. RF Capacitance vs. Reverse
Bias.
Figure 2. Typical RF Resistance vs.
Forward Bias Current.
Figure 3. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current for Switch Diodes.
T
rr
– REVERSE RECOVERY TIME (ns)
1000
100
I
F
– FORWARD CURRENT (mA)
10
V
R
= 5 V
100
V
R
= 10 V
V
R
= 20 V
1
0.1
125°C 25°C –50°C
10
10
0.01
20
FORWARD CURRENT (mA)
30
0
0.2
0.4
0.6
0.8
1.0
1.2
V
F
– FORWARD VOLTAGE (mA)
Figure 4. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages.
Figure 5. Forward Current vs.
Forward Voltage.
Equivalent Circuit Model
HSMP-386x Chip*
R
s
R
j
1.5
Ω
C
j
0.12 pF
R
T
= 1.5 + R
j
C
T
= C
P
+ C
j
12
R
j
=
0.9
Ω
I
I = Forward Bias Current in mA
* See AN1124 for package models
4
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 1
RF 2
RF 1
RF 2
BIAS 1
BIAS 2
BIAS
BIAS
Figure 6. Simple SPDT Switch, Using Only Positive
Current.
Figure 7. High Isolation SPDT Switch, Dual Bias.
RF COMMON
BIAS
RF COMMON
RF 1
RF 2
RF 1
BIAS
RF 2
Figure 8. Switch Using Both Positive and Negative
Current.
Figure 9. Very High Isolation SPDT Switch, Dual Bias.
VARIABLE BIAS
INPUT
RF IN/OUT
FIXED
BIAS
VOLTAGE
Figure 10. Four Diode
π
Attenuator. See AN1048 for details.
5
Typical Applications for Multiple Diode Products
(continued)
BIAS
“ON”
“OFF”
1
6
5
4
1
1
+V
0
2
0
+V
1
RF in
2
3
RF out
2
Figure 11. High Isolation SPST Switch
(Repeat Cells as Required).
Figure 12. HSMP-386L Unconnected Trio used in a
Positive Voltage, High Isolation Switch.
1
2
3
3
2
1
2
“ON”
“OFF”
1
0
0
2
+V
–V
0
4
5
6
b1
b2
b3
1
3
2
1
1
4
RF in
5
6
RF out
Figure 13. HSMP-386L used in a SP3T Switch.
Figure 14. HSMP-386L Unconnected Trio used in a
Dual Voltage, High Isolation Switch.
Ordering Information
Specify part number followed by option. For example:
HSMP - 386x - XXX
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
Option Descriptions
-BLK = Bulk, 100 pcs. per antistatic bag
-TR1 = Tape and Reel, 3000 devices per 7" reel
-TR2 = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of
Surface Mounted Components for Automated Placement.”
For lead-free option, the part number will have the character "G" at the
end, eg. -TR2G for a 10K pc lead-free reel.
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