Open Circuit Inductance Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc
+/-20% except for LD1-330-R to LD1-331-R and LD2-470-R to LD2-471-R which is +/-10%
2)
RMS current for an approximate
∆T
of 40°C. It is recommended that the temperature of the
part not exceed
+125
°C
3)
Peak current for an approximate 10% rolloff at
+20
°C
4)
DCR limits @
+20
°C
5)
Part number definition: LDx-yyy-R
LDx = product code and size, -yyy = inductance value in µH,
R = decimal point. If no R is present, third character = # of zeros
-R suffix = RoHS compliant
2
www.eaton.com/electronics
LD
Metalized drum core power inductors
Dimensions- mm
Top View
A
Technical Data
4310
Effective
July
2017
Recommended Pad Layout
Front View
B
Bottom View
H
Schematic
1
C
xxx
Marking
I
G
I
2
Component Side
Marking:
xxx=inductance value per family chart
Do not route traces or vias underneath the inductor
Dimensions
LD1
LD2
A
+/-0.3
4.5
7.8
B
+/-0.3
4.0
7.0
C
+/-0.3
3.2
5.0
G
ref
1.5
2.0
H
ref
4.5
7.5
I
ref
1.75
3.0
Packaging information- mm
Packaging Information
LD1 Series
Supplied in tape and reel packaging,
2000 parts per reel, 13" diameter reel.
8.0
12.0
ACTUAL SIZE
LD1
xxx
xxx
User Direction Feed
xxx
xxx
LD2 Series
Supplied in tape and reel packaging,
1000 parts per reel, 13" diameter reel.
12.0
16.0
ACTUAL SIZE
LD2
xxx
xxx
User Direction Feed
xxx
xxx
Inductance characteristics
OCL vs Isat
LD1
100
90
80
70
100
90
80
70
OCL vs Isat
LD2
OCL (%)
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
110
120
OCL (%)
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
110
120
% of Isat
% of Isat
www.eaton.com/electronics
3
Technical Data
4310
Effective
July
2017
LD
Metalized drum core power inductors
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
