电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HSMS-270B-TR2

产品描述UNIDIRECTIONAL, SILICON, TVS DIODE
产品类别分立半导体    二极管   
文件大小105KB,共8页
制造商HP(Keysight)
官网地址http://www.semiconductor.agilent.com/
下载文档 详细参数 全文预览

HSMS-270B-TR2概述

UNIDIRECTIONAL, SILICON, TVS DIODE

HSMS-270B-TR2规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称HP(Keysight)
零件包装代码SC-70
包装说明R-PDSO-G3
针数3
Reach Compliance Codeunknow
ECCN代码EAR99
其他特性LOW CAPACITANCE
最小击穿电压15 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
最大正向电压 (VF)0.55 V
JESD-30 代码R-PDSO-G3
JESD-609代码e0
最大非重复峰值正向电流1 A
元件数量1
端子数量3
最高工作温度150 °C
最大输出电流0.75 A
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散0.825 W
认证状态Not Qualified
最大重复峰值反向电压15 V
表面贴装YES
技术SCHOTTKY
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

HSMS-270B-TR2文档预览

High Performance Schottky
Diode for Transient Suppression
Technical Data
HSMS-2700/-2702
-270B/-270C
Features
• Ultra-low Series Resistance
for Higher Current Handling
• Picosecond Switching
• Low Capacitance
• Lead-free Option Available
Package Lead Code
Identification
(Top View)
SINGLE
3
SERIES
3
Description
The HSMS-2700 series of Schottky
diodes, commonly referred to as
clipping /clamping diodes, are
optimal for circuit and waveshape
preservation applications with
high speed switching. Ultra-low
series resistance, R
S
, makes them
ideal for protecting sensitive
circuit elements against higher
current transients carried on data
lines. With picosecond switching,
the HSMS-270x can respond to
noise spikes with rise times as fast
as 1 ns. Low capacitance mini-
mizes waveshape loss that causes
signal degradation.
Applications
RF and computer designs that
require circuit protection, high-
speed switching, and voltage
clamping.
1
0, B
2
1
2, C
2
HSMS-270x DC Electrical Specifications, T
A
= +25°C
[1]
Part
Package
Number Marking Lead
HSMS- Code
[2]
Code Configuration
-2700
J0
-270B
-2702
J2
-270C
C
B
2
Series
0
Single
Maximum Minimum
Typical
Maximum
Forward Breakdown
Typical
Series
Eff. Carrier
Voltage
Voltage Capacitance Resistance Lifetime
V
F
(mV)
V
BR
(V)
C
T
(pF)
R
S
(Ω)
τ
(ps)
Package
SOT-23
SOT-323
(3-lead SC-70)
SOT-23
SOT-323
(3-lead SC-70)
550
[3]
15
[4]
6.7
[5]
0.65
100
[6]
Notes:
1. T
A
= +25°C, where T
A
is defined to be the temperature at the package pins where contact is made to the circuit board.
2. Package marking code is laser marked.
3. I
F
= 100 mA; 100% tested
4. I
F
= 100
µA;
100% tested
5. V
F
= 0; f =1 MHz
6. Measured with Karkauer method at 20 mA; guaranteed by design.
2
Absolute Maximum Ratings, T
A
= 25ºC
Symbol
I
F
I
F-peak
P
T
P
INV
T
J
T
STG
θ
JC
Parameter
DC Forward Current
Peak Surge Current (1µs pulse)
Total Power Dissipation
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance, junction to lead
Unit
mA
A
mW
V
°C
°C
°C/W
Absolute Maximum
[1]
HSMS-2700/-2702
350
1.0
250
15
150
-65 to 150
500
HSMS-270B/-270C
750
1.0
825
15
150
-65 to 150
150
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
Linear and Non-linear SPICE Model
0.08 pF
SPICE Parameters
Parameter
BV
CJO
EG
IBV
IS
N
RS
PB
PT
M
Unit
V
pF
eV
A
A
V
Value
25
6.7
0.55
10E-4
1.4E-7
1.04
0.65
0.6
2
0.5
2 nH
R
S
SPICE model
3
Typical Performance
I
F
– FORWARD CURRENT (mA)
I
F
– FORWARD CURRENT (mA)
100
T
J
– JUNCTION TEMPERATURE (°C)
300
500
100
160
Max. safe junction temp.
140 T
A
= +75°C
T
A
= +25°C
120 T
A
= –25°C
100
80
60
40
20
0
0
50
100 150
200
250 300 350
I
F
– FORWARD CURRENT (mA)
10
10
1
1
0.1
0.01
0
0.1
0.2
0.3
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.4
0.5
0.6
V
F
– FORWARD VOLTAGE (V)
0.1
0.01
0
T
A
= +75°C
T
A
= +25°C
T
A
= –25°C
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
V
F
– FORWARD VOLTAGE (V)
Figure 1. Forward Current vs.
Forward Voltage at Temperature for
HSMS-2700 and HSMS-2702.
Figure 2. Forward Current vs.
Forward Voltage at Temperature for
HSMS-270B and HSMS-270C.
Figure 3. Junction Temperature vs.
Forward Current as a Function of
Heat Sink Temperature for the
HSMS-2700 and HSMS-2702.
Note: Data is calculated from SPICE
parameters.
T
J
– JUNCTION TEMPERATURE (°C)
160
Max. safe junction temp.
140 T
A
= +75°C
T
A
= +25°C
120 T = –25°C
A
100
80
60
40
20
0
0
150
300
450
600
750
I
F
– FORWARD CURRENT (mA)
7
C
T
– TOTAL CAPACITANCE (pF)
6
5
4
3
2
1
0
5
10
15
20
V
F
– REVERSE VOLTAGE (V)
Figure 4. Junction Temperature vs.
Current as a Function of Heat Sink
Temperature for HSMS-270B and
HSMS-270C.
Note: Data is calculated from SPICE
parameters.
Figure 5. Total Capacitance vs.
Reverse Voltage.
4
Package Dimensions
Outline SOT-23
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
0.37 (0.015)
3
1.40 (0.055)
1.20 (0.047)
2
2.04 (0.080)
1.78 (0.070)
TOP VIEW
2.65 (0.104)
2.10 (0.083)
Device Orientation
For Outlines SOT-23/323
REEL
DATE CODE (X)
PACKAGE
MARKING
CODE (XX)
XXX
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
1
0.60 (0.024)
0.45 (0.018)
TOP VIEW
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.152 (0.006)
0.066 (0.003)
END VIEW
4 mm
8 mm
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.69 (0.027)
0.45 (0.018)
END VIEW
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Tape Dimensions and Product Orientation
For Outline SOT-23
P
D
P
2
E
P
0
F
W
t1
D
1
9° MAX
Ko
8° MAX
13.5° MAX
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
8.00 +0.30 –0.10
0.229
±
0.013
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315 +0.012 –0.004
0.009
±
0.0005
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
5
Package Dimensions
Outline SOT-323 (SC-70 3 Lead)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
DATE CODE (X)
2.20 (0.087)
2.00 (0.079)
XXX
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.425 (0.017)
TYP.
0.30 REF.
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031)
10°
0.30 (0.012)
0.10 (0.004)
0.20 (0.008)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Tape Dimensions and Product Orientation
For Outline SOT-323 (SC-70 3 Lead)
P
P
0
D
P
2
E
F
W
C
D
1
t
1
(CARRIER TAPE THICKNESS)
T
t
(COVER TAPE THICKNESS)
8° MAX.
K
0
8° MAX.
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
WIDTH
TAPE THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t
1
C
T
t
F
P
2
SIZE (mm)
2.40
±
0.10
2.40
±
0.10
1.20
±
0.10
4.00
±
0.10
1.00 + 0.25
1.55
±
0.05
4.00
±
0.10
1.75
±
0.10
8.00
±
0.30
0.254
±
0.02
5.4
±
0.10
0.062
±
0.001
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.094
±
0.004
0.094
±
0.004
0.047
±
0.004
0.157
±
0.004
0.039 + 0.010
0.061
±
0.002
0.157
±
0.004
0.069
±
0.004
0.315
±
0.012
0.0100
±
0.0008
0.205
±
0.004
0.0025
±
0.00004
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
COVER TAPE
DISTANCE

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2606  1519  2870  489  1366  19  50  23  36  39 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved