Surface Mount Microwave
Schottky Mixer Diodes
Technical Data
HSMS-8101 Single
HSMS-8202 Series Pair
HSMS-8207 Ring Quad
HSMS-8209 Crossover Quad
Features
• Optimized for use at
10-14 GHz
• Low Capacitance
• Low Conversion Loss
• Low RD
• Low Cost Surface Mount
Plastic Package
• Lead-free Option Available
Plastic SOT-23 Package
Package Lead Code
Identification
(Top View)
SINGLE
3
SERIES
3
1
#1
2
1
#2
2
Plastic SOT-143 Package
Description/Applications
These low cost microwave
Schottky diodes are specifically
designed for use at X/Ku-bands
and are ideal for DBS and VSAT
downconverter applications. They
are available in SOT-23 and
SOT-143 standard package
configurations.
Note that Agilent's manufacturing
techniques assure that dice found in
pairs and quads are taken from
adjacent sites on the wafer, assur-
ing the highest degree of match.
RING
QUAD
3
4
CROSS-OVER
QUAD
3
4
1
#7
2
1
#9
2
Absolute Maximum Ratings
[1]
, T
A
= +25°C
Symbol Parameter
P
T
P
IV
T
J
T
STG
, T
op
Total Device Dissipation
[2]
Peak Inverse Voltage
Junction Temperature
Storage and Operating
Temperature
Unit
mW
V
°C
°C
Min.
—
—
—
-65
Max.
75
4
+150
+150
Notes:
1. Operation in excess of any one
of these conditions may result
in permanent damage to the
device.
2. Measured in an infinite heat
sink at T
CASE
= 25°C. Derate
linearly to zero at 150°C per
diode.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
2
DC Electrical Specifications, T
A
= 25°C
Symbol Parameters and Test Conditions
V
BR
C
T
∆C
T
R
D
∆R
D
V
F
∆V
F
Breakdown Voltage
I
R
= 10
µA
Total Capacitance
V
R
= 0 V, f = 1 MHz
Capacitance Difference
V
R
= 0 V, f = 1 MHz
Dynamic Resistance
I
F
= 5 mA
Dynamic Resistance Difference
I
F
= 5 mA
Forward Voltage
I
F
= 1 mA
Forward Voltage Difference
I
F
= 1 mA
Lead Code
Package Marking Code in White
where x is date code
HSMS-8101
Units Min. Max.
V
pF
pF
Ω
Ω
mV
mV
1
R1x
250
4
0.26
—
14
—
350
—
HSMS-8202
Min. Max.
4
0.26
0.04
14
2
250
350
20
2
2Rx
HSMS-8207
Min. Max.
4
0.26
0.04
14
2
250
350
20
7
R7x
HSMS-8209
Min. Max.
4
0.26
0.04
14
2
250
350
20
9
R9x
RF Electrical Parameters, T
A
= 25°C
Symbol
L
c
Z
IF
SWR
Parameter
Conversion Loss at 12 GHz
IF Impedance
SWR at 12 GHz
Units
dB
Ω
Typical
6.3
150
1.2
Note:
DC Load Resistance = 0
Ω;
LO Power = 1 mW.
SPICE Parameters
I
S
= 4.6 E-8
R
S
= 6
N = 1.09
B
V
= 7.3
I
BV
= 10E-5
E
G
= 0.69
C
JO
= 0.18 E-12
P
B
(V
J
) = 0.5
M = 0.5
FC = 0.5
TT = 0
Linear Equivalent Circuit
0.08 pF
1.0 nH
1.3 nH
6
Ω
0.17 pF
R
j
Self Bias
R
j
1 mA
263
2.5 mA
142
3
Typical Performance, T
C
= 25°C
∆V
F
- FORWARD VOLTAGE DIFFERENCE (mV)
100
I
F
- FORWARD CURRENT (mA)
FORWARD CURRENT (mA)
30
I
F
(Left Scale)
10
30
9
10
10
CONVERSION LOSS (dB)
8
1
0.1
T
A
= +125°C
T
A
= +25°C
T
A
= –55°C
∆V
F
(Right Scale)
1
1
7
0.01
0
0.2
0.4
0.6
0.8
0.3
0.3
0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55
V - FORWARD VOLTAGE (V)
6
–7 –5 –3 –1 1
3
5
7
9
11 13
FORWARD VOLTAGE (V)
LOCAL OSCILLATOR POWER (dBm)
Figure 1. Typical Forward Current
vs. Forward Voltage at Three
Temperatures.
Figure 2. Typical VF Match, HSMS-
820X Pairs and Quads.
Figure 3. Typical Conversion Loss
vs. Local Oscillator Power.
Ordering Information
Specify part number followed by option. For example:
HSMS - 8101 - XXX
Bulk or Tape and Reel Option
Part Number
Surface Mount Schottky
Profile Option
Descriptions
-BLK = Bulk
-TR1 = 3K pc. Tape and Reel,
Device Orientation
Figures 4, 5
-TR2 = 10K pc. Tape and Reel,
Device Orientation
Figures 4, 5
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
For lead-free option, the part
number will have the character "G"
at the end, eg. -TR2G for a 10K pc
lead-free reel.
Device Orientation
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIEW
8 mm
ABC
ABC
ABC
ABC
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
Figure 4. Option -TR1/-TR2 for SOT-23 Packages.
Figure 5. Option -TR1/-TR2 for SOT-143 Packages.
Package Characteristics
Lead Material ...................................................................................... Alloy 42
Lead Finish ............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Package Dimensions
Outline 23 (SOT-23)
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
0.37 (0.015)
3
1.40 (0.055)
1.20 (0.047)
2
2.04 (0.080)
1.78 (0.070)
TOP VIEW
0.152 (0.006)
0.066 (0.003)
1.02 (0.041)
0.85 (0.033)
2.65 (0.104)
2.10 (0.083)
DATE CODE (X)
PACKAGE
MARKING
CODE (XX)
XXX
1
0.60 (0.024)
0.45 (0.018)
3.06 (0.120)
2.80 (0.110)
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.69 (0.027)
0.45 (0.018)
END VIEW
Outline 143 (SOT-143)
0.92 (0.036)
0.78 (0.031)
DATE CODE (X)
2
PACKAGE
MARKING
CODE (XX)
1
XXX
1.40 (0.055)
1.20 (0.047)
3
2.65 (0.104)
2.10 (0.083)
4
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
0.54 (0.021)
0.37 (0.015)
0.15 (0.006)
0.09 (0.003)
1.04 (0.041)
0.85 (0.033)
0.10 (0.004)
0.013 (0.0005)
0.69 (0.027)
0.45 (0.018)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Tape Dimensions and Product Orientation
For Outline SOT-23
P
D
P
2
E
P
0
F
W
t1
D
1
9° MAX
Ko
8° MAX
13.5° MAX
A
0
B
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.15
±
0.10
2.77
±
0.10
1.22
±
0.10
4.00
±
0.10
1.00 + 0.05
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
8.00 +0.30 –0.10
0.229
±
0.013
3.50
±
0.05
2.00
±
0.05
SIZE (INCHES)
0.124
±
0.004
0.109
±
0.004
0.048
±
0.004
0.157
±
0.004
0.039
±
0.002
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315 +0.012 –0.004
0.009
±
0.0005
0.138
±
0.002
0.079
±
0.002
PERFORATION
CARRIER TAPE
DISTANCE
BETWEEN
CENTERLINE
For Outline SOT-143
P
P
0
D
P
2
E
F
W
D
1
t
1
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
9° MAX
9° MAX
K
0
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
A
0
DESCRIPTION
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
SYMBOL
A
0
B
0
K
0
P
D
1
D
P
0
E
W
t1
F
P
2
SIZE (mm)
3.19
±
0.10
2.80
±
0.10
1.31
±
0.10
4.00
±
0.10
1.00 + 0.25
1.50 + 0.10
4.00
±
0.10
1.75
±
0.10
B
0
SIZE (INCHES)
0.126
±
0.004
0.110
±
0.004
0.052
±
0.004
0.157
±
0.004
0.039 + 0.010
0.059 + 0.004
0.157
±
0.004
0.069
±
0.004
0.315+0.012 –0.004
0.0100
±
0.0005
0.138
±
0.002
0.079
±
0.002
China: 10800 650 0017
Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-3328EN
March 24,
2004
5989-0481EN
PERFORATION
CARRIER TAPE
DISTANCE
8.00 +0.30 –0.10
0.254
±
0.013
3.50
±
0.05
2.00
±
0.05
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