NXP Semiconductors
Data Sheet: Advance Information
Document Number: MC12XS6D3
Rev. 4.0, 4/2018
Penta 40 mOhm high-side switch
The 12XS6 is the latest SMARTMOS achievement in automotive lighting
drivers. It belongs to an expanding family that helps to control and diagnose
incandescent lamps and light-emitting diodes (LEDs) with enhanced precision.
It combines flexibility through daisy-chainable SPI 5.0 MHz, extended digital
and analog feedbacks, safety and robustness.
Output edge shaping helps to improve electromagnetic performance. To avoid
shutting off the device upon inrush current, while still being able to closely track
the load current, a dynamic overcurrent threshold profile is featured. Current of
each channel can be sensed with a programmable sensing ratio. Whenever
communication with the external microcontroller is lost, the device enters a fail
operation mode, but remains operational, controllable, and protected.
This new generation of high-side switch products family facilitates ECU design
thanks to compatible MCU software and PCB foot print for each device variant.
This family is in an end of life vehicles directive compliant package.
Features
• Penta 40 mΩ high-side switches with high transient current capability
• 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control
including PWM duty cycles, output-on and -off open load detections,
thermal shutdown and prewarning, and fault reporting
• Output current monitoring with programmable synchronization signal and
battery voltage feedback
• Limp home mode
• External smart power switch control
• Operating voltage is 7.0 V to 18 V with sleep current < 5.0 µA, extended
mode from 6.0 V to 28 V
• -16 V reverse polarity and ground disconnect protections
• Compatible PCB foot print and SPI software driver among the family
V
BAT
VBAT
VCC
MC40XS6500BEK; MC40XS6500CEK
ENHANCED PENTA HIGH-SIDE SWITCH
BEK SUFFIX (PB-FREE)
98ASA00368D
32-PIN SOICEP
CEK SUFFIX (PB-FREE)
98ASA00894D
32-PIN SOICEP
Applications
• Low-voltage exterior lighting
• Incandescent bulbs (21 W)
• Light-emitting diodes (LEDs)
V
BAT
5.0 V
Regulator
GND
VCC
SO
CSB
SCLK
SI
RSTB
CLK
A\D1
TRG1
PORT
PORT
PORT
PORT
PORT
A\D2
40XS6500
VBAT
VCC
SI
CP
CSB
OUT1
SCLK
SO
OUT2
RSTB
CLK
OUT3
CSNS
SYNCB
OUT4
LIMP
IN1
OUT5
IN2
IN3
IN4
GND OUT6
Main
MCU
GND
VBAT OUT
Smart Power
CSNS GND
Figure 1. Penta 40 mΩ high-side simplified application diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© 2018 NXP B.V.
1
Orderable parts
This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided
on the web. To determine the orderable part numbers for this device, go to
http://www.nxp.com
and perform a part number search for the
following device numbers.
Table 1. Orderable part variations
Part number
MC40XS6500BEK
MC40XS6500CEK
Notes
(1)
Temperature (T
A
)
-40 °C to 125 °C
Package
SOIC 32 pins
exposed pad
OUT1
R
DS(on)
40 mΩ
OUT2
R
DS(on)
40 mΩ
OUT3
R
DS(on)
40 mΩ
OUT4
R
DS(on)
40 mΩ
OUT5
R
DS(on)
40 mΩ
OUT6
Yes
Notes
1. To order parts in tape and reel, add the R2 suffix to the part number.
12XS6D3
2
NXP Semiconductors
Table of Contents
1
2
3
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Relationship between ratings and operating requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.4 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.5 Supply currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
General IC functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.6 SPI interface and configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Functional block requirements and behaviors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1 Self-protected high-side switches description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.2 Power supply functional block description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
6.3 Communication interface and device control functional block description and application information . . . . . . . . . . . . . . . . . 52
Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
7.2 EMC and EMI considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.3 PCB Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.3 PCB Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.4 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
8.1 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
8.2 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
4
5
6
7
8
9
12XS6D3
NXP Semiconductors
3
2
Internal block diagram
VCC
Power
Supply
V
S
UVF
VBAT_PROTECTED
CP
VBAT
Reverse
Battery
Protection
Charge
Pump
Oscillator
Power-on
Reset
Undervoltage
Detection
OVF
Battery
Clamp
CPF
SO
SPI Control
CSB
SCLK
SI
RSTB
SPIF
OTW1
OTW2
OTS1
Thermal
Prewarning
Temperature
Shutdown
SPI
Selectable
Slope Control
OC1
OLON1
OLOFF1
Selectable Overcurrent
Protection
Selectable OpenLoad
Detection
Selectable
Current Sensing
Fault
Management
Limp Home Control
LIMP
IN1
IN2
IN4
Logic
V
CC
CLKF
WAKEB OR
RSTB
OUT1
Output Voltage
Monitoring
OUT1 Channel
OUT1
OUT2 Channel
OUT2
OUT3
OUT4
Reference
PWM Clock
OUT3 Channel
OUT4 Channel
OUT4 Channel
CLK
Clock Failure
Detection
OUT5 Channel
V
CC
VBAT_PROTECTED
OUT5
Smart Power
Switch Drive
A to D Convertion
CSNS
SYNCB
Selectable
Delay
Selectable
Analog
Feedback
OUT6
CSNS
VBAT_PROTECTED
Control die
Temperature
Monitoring
Battery
Voltage
Monitoring
GND
Figure 2. 12XS6 simplified internal block diagram (penta version)
12XS6D3
4
NXP Semiconductors
Power channels
IN3
PWM Module
3
3.1
Pin connections
Pinout diagram
Transparent Top View
CP
RSTB
CSB
SCLK
SI
VCC
SO
OUT6
GND
OUT2
OUT2
OUT4
OUT4
OUT4
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VBAT
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Figure 3. 12XS6 pinout diagram
CLK
LIMP
IN4
IN3
IN2
IN1
CSNS SYNCB
CSNS
GND
OUT1
OUT1
OUT3
OUT3
OUT3
OUT5
OUT5
3.2
Pin definitions
Table 2. 12XS6 pin definitions
Pin number
1
2
Pin name
CP
RSTB
Pin function
Internal
supply
SPI
Formal name
Charge Pump
Reset
Definition
This pin is the connection for an external capacitor for charge pump use only.
This input pin is used to initialize the device configuration and fault registers,
as well as place the device in a low-current sleep mode. This pin has a
passive internal pull-down.
This input pin is connected to a chip select output of a master microcontroller
(MCU). When this digital signal is high, SPI signals are ignored. Asserting
this pin low starts the SPI transaction. The transaction is indicated as
completed when this signal returns to a high level. This pin has a passive
internal pull-up to V
CC
through a diode.
This input pin is connected to the MCU providing the required bit shift clock
for SPI communication. This pin has a passive internal pull-down.
This pin is the data input of the SPI communication interface. The data at the
input is sampled on the positive edge of the SCLK. This pin has a passive
internal pull-down.
This pin is a power supply pin is for internal logic, the SPI I/Os, and the OUT6
driver.
This output pin is connected to the SPI serial data input pin of the MCU, or to
the SI pin of the next device of a daisy chain of devices. The SPI changes on
the negative edge of SCLK. When CSB is high, this pin is high-impedance.
3
CSB
SPI
Chip Select
4
5
6
7
SCLK
SI
VCC
SO
SPI
SPI
Power
Supply
SPI
Serial Clock
Serial input
MCU Power Supply
Serial Output
12XS6D3
NXP Semiconductors
5
微控制器 MCU
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