75 A, 40 V, 0.002 ohm, N-CHANNEL, Si, POWER, MOSFET
参数名称 | 属性值 |
端子数量 | 2 |
最小击穿电压 | 40 V |
加工封装描述 | LEAD FREE, PLASTIC, D2PAK-3 |
无铅 | Yes |
欧盟RoHS规范 | Yes |
状态 | ACTIVE |
包装形状 | RECTANGULAR |
包装尺寸 | SMALL OUTLINE |
表面贴装 | Yes |
端子形式 | GULL WING |
端子涂层 | MATTE TIN OVER NICKEL |
端子位置 | DUAL |
包装材料 | PLASTIC/EPOXY |
结构 | SINGLE WITH BUILT-IN DIODE |
壳体连接 | DRAIN |
元件数量 | 1 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
通道类型 | N-CHANNEL |
场效应晶体管技术 | METAL-OXIDE SEMICONDUCTOR |
操作模式 | ENHANCEMENT |
晶体管类型 | GENERAL PURPOSE POWER |
最大漏电流 | 75 A |
额定雪崩能量 | 540 mJ |
最大漏极导通电阻 | 0.0020 ohm |
最大漏电流脉冲 | 1080 A |
IRF2084PBF | IRF2804LPBF | IRF2804SPBF | IRF2804PBF | |
---|---|---|---|---|
描述 | 75 A, 40 V, 0.002 ohm, N-CHANNEL, Si, POWER, MOSFET | 75 A, 40 V, 0.002 ohm, N-CHANNEL, Si, POWER, MOSFET | 75 A, 40 V, 0.002 ohm, N-CHANNEL, Si, POWER, MOSFET | 75 A, 40 V, 0.002 ohm, N-CHANNEL, Si, POWER, MOSFET |
端子数量 | 2 | 3 | 2 | 3 |
表面贴装 | Yes | NO | YES | NO |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子位置 | DUAL | SINGLE | DUAL | SINGLE |
元件数量 | 1 | 1 | 1 | 1 |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 |
厂商名称 | - | International Rectifier ( Infineon ) | International Rectifier ( Infineon ) | International Rectifier ( Infineon ) |
包装说明 | - | IN-LINE, R-PSIP-T3 | LEAD FREE, PLASTIC, D2PAK-3 | LEAD FREE, PLASTIC PACKAGE-3 |
针数 | - | 3 | 3 | 3 |
Reach Compliance Code | - | not_compliant | not_compliant | unknown |
ECCN代码 | - | EAR99 | EAR99 | EAR99 |
其他特性 | - | AVALANCHE RATED, ULTRA LOW RESISTANCE | AVALANCHE RATED, ULTRA LOW RESISTANCE | AVALANCHE RATED, ULTRA LOW RESISTANCE |
雪崩能效等级(Eas) | - | 540 mJ | 540 mJ | 540 mJ |
外壳连接 | - | DRAIN | DRAIN | DRAIN |
配置 | - | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | - | 40 V | 40 V | 40 V |
最大漏极电流 (Abs) (ID) | - | 75 A | 75 A | 75 A |
最大漏极电流 (ID) | - | 75 A | 75 A | 75 A |
最大漏源导通电阻 | - | 0.0023 Ω | 0.002 Ω | 0.0023 Ω |
FET 技术 | - | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | - | R-PSIP-T3 | R-PDSO-G2 | R-PSFM-T3 |
JESD-609代码 | - | e3 | e3 | e3 |
工作模式 | - | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | - | 175 °C | 175 °C | 175 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | SMALL OUTLINE | FLANGE MOUNT |
峰值回流温度(摄氏度) | - | 260 | 260 | 250 |
极性/信道类型 | - | N-CHANNEL | N-CHANNEL | N-CHANNEL |
最大功率耗散 (Abs) | - | 300 W | 300 W | 330 W |
最大脉冲漏极电流 (IDM) | - | 1080 A | 1080 A | 1080 A |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
端子面层 | - | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier |
处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 |
Base Number Matches | - | 1 | 1 | 1 |
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