REVISIONS
LTR
A
DESCRIPTION
Made changes to 3.3, 4.2, 4.3.1, and 4.3.2. Made changes to table I. Editorial
changes throughout.
DATE (YR-MO-DA)
90-03-08
APPROVED
M. A. Frye
B
Add device type 07. Add vendors CAGEs 1ES66 and 54186. Editorial changes
throughout.
93-01-22
M. A. Frye
C
D
Update boilerplate and make editorial changes throughout. - ro
Update drawing to current requirements. Editorial changes throughout. – drw
98-07-06
04-01-07
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
REV
SHEET
PREPARED BY
Marcia B. Kelleher
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles Reusing
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-01-28
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, CMOS, 12-BIT MULTIPLYING
DIGITAL TO ANALOG CONVERTER,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
17
5962-87702
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E557-03
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87702
01
R
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
Generic number
7545S
7545T
7545U
7545AU
7545B
7545A
7545S
Circuit function
CMOS 12-bit buffered DAC
CMOS 12-bit buffered DAC
CMOS 12-bit buffered DAC
CMOS 12-bit buffered DAC
CMOS 12-bit buffered DAC
CMOS 12-bit buffered DAC
CMOS 12-bit buffered DAC
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
R
2
Descriptive designator
GDIP1-T20 or CDIP2-T20
CQCC1-N20
Terminals
20
20
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (V
DD
) ..................................................................................
V
REF
to GND .........................................................................................................
Digital input voltage to DGND ..............................................................................
V
RFB
, V
REF
to DGND .............................................................................................
V pin 1 to DGND ..................................................................................................
AGND to DGND ...................................................................................................
Power dissipation (P
D
):
Up to +75°C ......................................................................................................
Derates above +75°C .......................................................................................
Storage temperature range ..................................................................................
Lead temperature (soldering, 10 seconds) ..........................................................
Thermal resistance junction-to-case (
JC
) ...........................................................
Thermal resistance junction-to-ambient (
JA
):
Case R ..............................................................................................................
Case 2 ...............................................................................................................
Junction temperature (T
J
) ....................................................................................
1.4 Recommended operating conditions.
Operating ambient temperature range (T
A
) ......................................................... -55°C to +125°C
+5 V dc to +15 V dc
-0.3 V dc to +17 V dc
-0.3 V dc to V
DD
±25 V dc
-0.3 V dc to V
DD
-0.3 V dc to V
DD
450 mW
6 mW/°C
-65°C to +150°C
+300°C
See MIL-STD-1835
+120°C/W
+120°C/W
+175°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
θ
θ
SIZE
A
REVISION LEVEL
5962-87702
SHEET
D
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is
required to identify when the QML flow option is used.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87702
SHEET
D
3
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Mode selection. The mode selection shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages
where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance
with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing
as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix
A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix
A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
Optional subgroup 12 is used for grading and part selection at +25°C. It is not included in PDA.
c.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87702
SHEET
D
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C T
A
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
Unit
Resolution
RES
V
DD
= +5 V
V
DD
= +15 V
Relative accuracy
RA
V
DD
= +5 V
V
DD
= +5 V, T
A
= +25°C
2/
V
DD
= +5 V
V
DD
= +5 V, T
A
= +25°C
2/
V
DD
= +15 V
V
DD
= +15 V, T
A
= +25°C
2/
V
DD
= +15 V
V
DD
= +15 V 2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
≤
≤
1, 2, 3
All
12
12
Bits
1, 2, 3
1
2, 3
12
1
01, 07
02
±2
±2
±1
LSB
02
03, 04
05, 06
±1
±2
±0.5
±0.5
±0.5
±2
±2
±1
2, 3
12
1, 2, 3
1
2, 3
12
1
03, 04,
05, 06
03, 04,
05, 06
01, 07
02
02
03, 04
05, 06
±1
±2
±0.5
±0.5
±0.5
2, 3
12
03, 04,
05, 06
SIZE
A
REVISION LEVEL
5962-87702
SHEET
D
5
FPGA/CPLD
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