SMT POWER INDUCTORS
Flat Coils - PG0426 Series
Height: 3.2mm Max
Footprint: 7.5mm x 7.0mm Max
Current Rating: 60Apk
Inductance Range: 0.1µH to 1.5µH
High temperature core material, no thermal aging below 150°C
Electrical Specifications @ 25°C - Operating Temperature -40°C to +130°C
Part
Number
PG0426.101NL
PG0426.151NL
PG0426.201NL
PG0426.221NL
PG0426.331NL
PG0426.471NL
PG0426.681NL
PG0426.821NL
PG0426.102NL
PG0426.152NL
Inductance
@ Irated
(μH
±20%)
0.10
0.15
0.20
0.22
0.33
0.47
0.68
0.82
1.00
1.50
DCR
(mΩ)
TYP
1.3
2.0
2.0
2.0
3.2
3.2
5.2
7.8
7.8
11.5
MAX
1.5
2.2
2.2
2.2
3.4
3.4
5.4
8.0
8.0
11.8
60
57
46
40
34
26
25
24
22
18
34.5
26.0
26.0
26.0
20.0
20.0
15.5
13.0
13.0
9.0
44.4
40.0
53.3
58.6
62.8
89.4
100.6
99.3
121.1
153.6
PG0426.XXXNL
.295
7,50
MAX
MECHANICAL
.055ā.012
1,40ā0,30
SCHEMATIC
.047ā.008
1,20ā0,20
.118
3.00
.071
1,80
1
.276
7,00
MAX
XXXNL
DATE CODE(IM/BOM/REV.)
.146
3,70
.102ā.012
2,60ā0,30
SUGGESTED LAND PATTERN
2
.126
3,20
MAX
.134
3,40
.472
12,00
.280
7,10
.630ā.012
16,00ā0,30
USER DIRECTION FEED
TAPE & REEL LAYOUT
55
power.pulseelectronics.com
SPM2007 (08/17)
http://www.power.pulseelectronics.com/contact
SMT POWER INDUCTORS
Flat Coils - PG0426 Series
Notes from Tables
1. The temperature of the component (ambient plus temperature rise) must be within
the specified operating temperature range.
2. The saturation current, I
SAT
, is the current at which the component inductance drops
by 30% (typical) at an ambient temperature of 25°C. This current is determined by
placing the component in the specified ambient environment and applying a short
duration pulse current (to eliminate self-heating effects) to the component.
3. The heating current, I
DC
, is the DC current required to raise the component temperature
by approximately 40°C. The heating current is determined by mounting the component
on a typical PCB and applying current for 30 minutes. The temperature is measured
by placing the thermocouple on top of the unit under test. Take note that the
component’s performance varies depending on the system condition. It is suggested
that the component be tested at the system level, to verify the temperature rise of the
component during system operation.
4. Core loss approximation is based on published core data:
Core Loss
= K1 * (f) * (K2ΔI)
Where: Core Loss
= in Watts
f
= switching frequency in kHz
K1 & K2
= core loss factors
ΔI
= delta I across the component in Ampere
K2ΔI
= one half of the peak to peak flux density
across the component in Gauss
5. Unless otherwise specified, all testing is made at 100kHz, 0.1V
AC
.
6. Optional Tape & Reel packaging can be ordered by adding a “T” suffix to the part
number (i.e. PG0426.101NL becomes PG0426.101NLT). Pulse complies to industry
standard tape and reel specification EIA481.
Inductance vs Current Characteristics
1.0
0.9
PG0426.102NL
1.40
1.20
Typical Core Loss vs Peak Flux Density
100kHz
200kHz
1.00
0.80
0.60
0.40
0.20
0.00
100
300kHz
400kHz
500kHz
1MHz
INDUCTANCE (µH)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1
4
PG0426.331NL
PG0426.201NL
PG0426.101NL
PG0426.681NL
7 10 13 16 19 22 25 28
3 34
3 40 43 46 49 52
CORE LOSS (W)
0.8
200
300
400
500
600
700
800
900
1000
DC BIAS (A)
Typical Component Temperature vs DC Bias Current
COMPONENT TEMP. RISE (ºC)
100
80
60
40
20
0
PG0426.101NL
PG0426.152NL
PG0426.102NL
PG0426.681NL
PG0426.331NL
PG0426.471NL
PG0426.151NL
PG0426.201NL
PG0426.221NL
DELTA B (GAUSS)
DELTA B = (K2 I)
0
6
12
18
24
30
36
42
48
54
DC BIAS
56
power.pulseelectronics.com
SPM2007 (08/17)
http://www.power.pulseelectronics.com/contact
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
