INTERCONNECTS
SERIES 310, 311, 315 • .100” GRID SOLDER TAIL •
SINGLE ROW STRIPS
•
SIP sockets accept .015 - .025” diameter pins
and standard IC leads
•
Various solder tails available: standard length,
.015-.025
.010 * .018
.095
.110
.146
long for multi-layer boards, very low and ultra
low pro le. See Mill-Max #1001, #0134, #0501
or #1534 pins. See pages 161, 162 and 165
for details
.165
•
Hi-Rel, 4- nger BeCu #12 and #30 contact are
rated at 3 amps. See pages 252 and 253 for
details
.020 DIA.
.125
•
Insulators are high temperature thermoplastic,
FIG. 1
.015-.025
.010
*
.018
suitable for all soldering operations
ORDERING INFORMATION
Series 310...001
Standard Solder Tail
310 XX 1_ _ 41 001000
Specify number of pins
01-64
.165
.103
.110
.150
FIG. 1
Series 311...001
.020 DIA.
.170
Long Solder Tail
311 XX 1_ _ 41 001000
FIG. 2
.015-.025
.010 * .018
FIG. 2
Series 315...001
.122
Specify number of pins
O
O
O
01-64
Very Low Pro le
315 XX 1_ _ 41 001000
.096
.110
.151
FIG. 3
Series 315...003
Specify number of pins
.108
01-64
Ultra Low Pro le
315 XX 1_ _ 41 003000
.030 DIA.
FIG. 4
FIG. 3
.015-.022
.010 * .018
Specify number of pins
01-64
.071
.071
.155
.095
2011/65/EU
RoHS - 2
.095
XX=Plating Code
See Below
13
91
10
µ”
Au
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.030 DIA.
SPECIFY PLATING CODE XX=
11
93
99
41
43
44
47
FIG. 4
Sleeve (Pin)
Contact (Clip)
10
µ”
Au 10
µ”
Au 200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn 200
µ”
Sn 200
µ”
Sn 200
µ”
Sn
10
µ”
Au 30
µ”
Au
30
µ”
Au 100
µ”
Sn/Pb 10
µ”
Au 30
µ”
Au 100
µ”
Sn Au Flash
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
O
41 & 91 Platings Non-Standard
PAGE 65 | INTERCONNECTS
FPGA/CPLD
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