203589B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 18, 2016
1
DATA SHEET • SMP1331-087LF: 45 W SURFACE MOUNT SERIES CONNECTED PIN DIODE
Electrical and Mechanical Specifications
The absolute maximum ratings of the SMP1331-087LF are
provided in Table 1. Electrical specifications are provided in
Table 2. Typical DC performance characteristics of the
SMP1331-087LF are illustrated in Figures 2, 3, and 4.
The SMP1331-087LF Evaluation Board is used to test the
performance of the SMP1331-087LF PIN Diode. Figure 5 shows a
Table 1. SMP1331-087LF Absolute Maximum Ratings
1
Parameter
Forward current
Reverse voltage
Dissipated power @ 85
°C
Peak pulse power dissipation @ 85
°C
(10% duty cycle)
Operating temperature
Storage temperature
Junction temperature
Electrostatic discharge:
Charged-Device Model (CDM), Class 4
Human Body Model (HBM), Class 3A
Machine Model (MM), Class C
T
A
T
STG
T
J
ESD
I
F
V
R
P
D
bias schematic, and Table 3 lists the Evaluation Board Bill of
Materials. Typical RF performance of the SMP1331-087LF using
the schematic shown in Figure 5 is summarized in Table 4 and
illustrated in Figures 6, 7, and 8.
An assembly drawing for the Evaluation Board is shown in
Figure 9. The layer detail physical characteristics are provided in
Figure 10.
Symbol
Minimum
Maximum
200
200
0.75
7.5
Units
mA
V
W
W
C
C
C
–55
–55
–55
+85
+200
+175
1100
5000
400
V
V
V
1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set
at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
ESD HANDLING:
Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device.
This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection.
Industry-standard ESD handling precautions should be used at all times.
Table 2. SMP1331-087LF Electrical Specifications
1
(T
A
= +25
C,
Unless Otherwise Noted)
Parameter
Forward voltage
Reverse leakage current
Series resistance
V
F
I
R
R
S
1
R
S
10
R
S
100
C
T
30
L
S
t
L
W
I
F
= 10 mA
Symbol
Test Condition
I
F
= 10 mA
V
R
= 200 V
I
F
= 1 mA, f = 100 MHz
I
F
= 10 mA, f = 100 MHz
I
F
= 100 mA, f = 100 MHz
V
R
= 30 V, f = 1 MHz
9.0
1.7
0.50
0.26
0.37
600
30
Junction-to-case
Single, 1
μs
pulse width,
junction-to-case (10% duty cycle)
26
2.6
Min
Typical
0.80
10
14.5
Max
Units
V
μA
Ω
Ω
Ω
pF
nH
ns
μm
°C/W
°C/W
Total capacitance
Series inductance
Minority carrier lifetime
I region width
Thermal resistance (Note 2)
Peak thermal resistance
0.35
JC
P
1 Performance is guaranteed only under the conditions listed in this table.
2 Assume a thermal resistance of 90 °C/W for the junction-to-bottom of the circuit board.
烧写完成后出现：
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SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
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