Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 65MSPS
参数名称 | 属性值 |
Brand Name | Integrated Device Technology |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | VFQFPN |
包装说明 | 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 |
针数 | 32 |
制造商包装代码 | NDG32 |
Reach Compliance Code | compliant |
最大模拟输入电压 | 2 V |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N32 |
JESD-609代码 | e1 |
最大线性误差 (EL) | 0.12% |
位数 | 12 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | OFFSET BINARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCN |
封装等效代码 | LCC32,.27SQ,25 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 |
电源 | 1.8,3 V |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN SILVER COPPER |
端子形式 | NO LEAD |
端子节距 | 0.635 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
ADC1213S065HN-C1 | ADC1213S080HN-C1 | ADC1213S125HN-C1 | ADC1213S065HN-C18 | |
---|---|---|---|---|
描述 | Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 65MSPS | Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 80MSPS | Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 125MSPS | Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 65MSPS |
Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | VFQFPN | VFQFPN | VFQFPN | VFQFPN |
包装说明 | 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 | 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 | 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 | , |
针数 | 32 | 32 | 32 | 32 |
制造商包装代码 | NDG32 | NDG32 | NDG32 | NDG32 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-609代码 | e1 | e1 | e1 | e1 |
输出位码 | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
端子面层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | Tin/Silver/Copper (Sn/Ag/Cu) |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
最大模拟输入电压 | 2 V | 2 V | 2 V | - |
JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | - |
最大线性误差 (EL) | 0.12% | 0.12% | 0.12% | - |
位数 | 12 | 12 | 12 | - |
功能数量 | 1 | 1 | 1 | - |
端子数量 | 32 | 32 | 32 | - |
最高工作温度 | 85 °C | 85 °C | 85 °C | - |
最低工作温度 | -40 °C | -40 °C | -40 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | QCCN | QCCN | QCCN | - |
封装等效代码 | LCC32,.27SQ,25 | LCC32,.27SQ,25 | LCC32,.27SQ,25 | - |
封装形状 | SQUARE | SQUARE | SQUARE | - |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | - |
电源 | 1.8,3 V | 1.8,3 V | 1.8,3 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - |
表面贴装 | YES | YES | YES | - |
技术 | CMOS | CMOS | CMOS | - |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
端子形式 | NO LEAD | NO LEAD | NO LEAD | - |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | - |
端子位置 | QUAD | QUAD | QUAD | - |
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