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MCIMX251AVM4: 产品描述Processors - Application Specialized SENNA IMX25 1.1 AUTO; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共140页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MCIMX251AVM4概述

Processors - Application Specialized SENNA IMX25 1.1 AUTO

MCIMX251AVM4规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	BGA
包装说明	17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
针数	400
Reach Compliance Code	unknown
ECCN代码	5A002
其他特性	UNAVAILABLE FOR IMPORT OR SALE IN US; ALSO REQUIRES 3.3 V I/O SUPPLY
地址总线宽度	26
位大小	32
边界扫描	YES
最大时钟频率	24 MHz
外部数据总线宽度	16
格式	FIXED POINT
集成缓存	YES
JESD-30 代码	S-PBGA-B400
长度	17 mm
低功率模式	YES
湿度敏感等级	3
端子数量	400
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	LFBGA
封装等效代码	BGA400,20X20,32
封装形状	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
电源	1.2/1.5,1.8/3.3 V
认证状态	Not Qualified
座面最大高度	1.6 mm
速度	400 MHz
最大供电电压	1.52 V
最小供电电压	1.38 V
标称供电电压	1.45 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Silver/Copper - with Nickel barrier
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	17 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX25AEC

Rev. 10, 06/2013

i.MX25 Applications

Processor for

Automotive Products

Silicon Version 1.2

MCIMX25

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

Introduction

Ordering Information

See

Table 1 on page 3

for ordering information.

The i.MX25 family of processors are designed to

meet the connectivity requirements of today’s

automobile infotainment systems. To meet these

requirements, the i.MX25 processors provide

high-end features, such as CAN, USB connectivity,

and audio connectivity at a price point that is

suitable for all vehicles.

At the core of the i.MX25 is Freescale's fast,

proven, power-efficient implementation of the

ARM® 926EJ-S™ core, with speeds of up to

400 MHz. The i.MX25 includes support for up to

133 MHz DDR2 memory, integrated 10/100

Ethernet MAC, and two on-chip USB PHYs. The

automotive versions of the i.MX25 offer

AEC-Q100 grade 3 qualification to meet stringent

automotive quality requirements. The device is

suitable for a wide range of applications, including

the following:

• USB Connectivity for media

storage/playback, personal media device

interface, and firmware updates

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9

3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11

3.2. Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18

3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20

3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20

3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24

3.7. Module Timing and Electrical Parameters . . . . . . 41

4. Package Information and Contact Assignment . . . . . . 124

4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124

4.2. Ground, Power, Sense, and Reference Contact

Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125

4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm

Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135

5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

•

Bluetooth™ connectivity for hands free phone calling and streaming audio from wireless devices

like phones or PND

Control of the infotainment system through basic speech recognition or touch screen

Smart toll and metering applications

Secure data black box applications

Features of the i.MX25 processor include the following:

• Advanced power management—The heart of the device is a level of power management

throughout the IC that enables the multimedia features and peripherals to achieve minimum system

power consumption in active and various low-power modes. Power management techniques allow

the designer to deliver a feature-rich product that requires levels of power far lower than typical

industry expectations.

• Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a

16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with

alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen

controller), and a programmable Smart DMA (SDMA) controller.

• 128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for

eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows

the designer to enable an ultra low power LCD refresh.

• Interface flexibility—The device interface supports connection to all common types of external

memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,

and managed NAND.

• Increased security—Because the need for advanced security for tethered and untethered devices

continues to increase, the i.MX25 processor delivers hardware-enabled security features that

enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust

tamper detection, secure boot, and secure software downloads.

• On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.

• Fast Ethernet—For rapid external communication, a Fast Ethernet Controller (FEC) is included.

• i.MX25 only supports Little Endian mode.

i.MX25 Applications Processor for Automotive Products, Rev. 10

Freescale Semiconductor

MCIMX251AVM4相似产品对比

	MCIMX251AVM4	MCIMX251AJM4
描述	Processors - Application Specialized SENNA IMX25 1.1 AUTO	Processors - Application Specialized IMX25 AUTOMOTIVE
是否无铅	不含铅	不含铅
是否Rohs认证	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	BGA	BGA
包装说明	17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400	LFBGA,
针数	400	400
Reach Compliance Code	unknown	compliant
ECCN代码	5A002	5A002
其他特性	UNAVAILABLE FOR IMPORT OR SALE IN US; ALSO REQUIRES 3.3 V I/O SUPPLY	ALSO REQUIRES 3.3 V I/O SUPPLY
地址总线宽度	26	26
位大小	32	32
边界扫描	YES	YES
最大时钟频率	24 MHz	24 MHz
外部数据总线宽度	16	16
格式	FIXED POINT	FIXED POINT
集成缓存	YES	YES
JESD-30 代码	S-PBGA-B400	S-PBGA-B400
长度	17 mm	17 mm
低功率模式	YES	YES
湿度敏感等级	3	3
端子数量	400	400
最高工作温度	85 °C	85 °C
最低工作温度	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	LFBGA
封装形状	SQUARE	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260
认证状态	Not Qualified	Not Qualified
座面最大高度	1.6 mm	1.6 mm
速度	400 MHz	400 MHz
最大供电电压	1.52 V	1.52 V
最小供电电压	1.38 V	1.38 V
标称供电电压	1.45 V	1.45 V
表面贴装	YES	YES
技术	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Silver/Copper - with Nickel barrier	Tin/Silver/Copper - with Nickel barrier
端子形式	BALL	BALL
端子节距	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	40	40
宽度	17 mm	17 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR	MICROPROCESSOR

MCIMX251AVM4

MCIMX251AVM4在线购买

MCIMX251AVM4概述

MCIMX251AVM4规格参数

文档预览

MCIMX251AVM4相似产品对比

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