Buffers & Line Drivers 2.5/3.3V SIGE DF/RCV BBG
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 |
| 制造商包装代码 | 485G-01 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
| 差分输出 | YES |
| 驱动器位数 | 1 |
| 高电平输入电流最大值 | 0.0001 A |
| 输入特性 | DIFFERENTIAL |
| 接口集成电路类型 | LINE TRANSCEIVER |
| 接口标准 | GENERAL PURPOSE |
| JESD-30 代码 | S-XQCC-N16 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | +-2.5/+-3.3 V |
| 认证状态 | Not Qualified |
| 最大接收延迟 | 0.145 ns |
| 接收器位数 | 1 |
| 座面最大高度 | 1 mm |
| 最大压摆率 | 29 mA |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 2.375 V |
| 标称供电电压 | 2.5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Gold/Palladium (Ni/Au/Pd) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 最大传输延迟 | 0.145 ns |
| 宽度 | 3 mm |
| NBSG16MNHTBG | NBSG16MNR2G | NBSG16MNG | |
|---|---|---|---|
| 描述 | Buffers & Line Drivers 2.5/3.3V SIGE DF/RCV BBG | Buffers & Line Drivers 2.5V/3.3V SiGe Diff Receiver w/RSECL | Buffers & Line Drivers 2.5V/3.3V SiGe Diff Receiver w/RSECL |
| Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 零件包装代码 | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 | HVQCCN, LCC16,.12SQ,20 |
| 针数 | 16 | 16 | 16 |
| 制造商包装代码 | 485G-01 | 485G-01 | 485G-01 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
| 差分输出 | YES | YES | YES |
| 驱动器位数 | 1 | 1 | 1 |
| 输入特性 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
| 接口集成电路类型 | LINE TRANSCEIVER | LINE TRANSCEIVER | LINE TRANSCEIVER |
| 接口标准 | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
| JESD-30 代码 | S-XQCC-N16 | S-XQCC-N16 | S-XQCC-N16 |
| 长度 | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 | LCC16,.12SQ,20 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 |
| 电源 | +-2.5/+-3.3 V | +-2.5/+-3.3 V | +-2.5/+-3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 最大接收延迟 | 0.145 ns | 0.145 ns | 0.145 ns |
| 接收器位数 | 1 | 1 | 1 |
| 座面最大高度 | 1 mm | 1 mm | 1 mm |
| 最大供电电压 | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 2.375 V | 2.375 V | 2.375 V |
| 标称供电电压 | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Gold/Palladium (Ni/Au/Pd) | Nickel/Gold/Palladium (Ni/Au/Pd) | Nickel/Gold/Palladium (Ni/Au/Pd) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 |
| 最大传输延迟 | 0.145 ns | 0.145 ns | 0.145 ns |
| 宽度 | 3 mm | 3 mm | 3 mm |
| 是否Rohs认证 | 符合 | 符合 | - |
| Is Samacsys | - | N | N |
| 技术 | - | ECL | ECL |
| Base Number Matches | - | 1 | 1 |
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