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MCIMX6S5EVM10ACR

产品描述Processors - Application Specialized MCIMX6S5EVM10AC/LFBGA624///REEL 13 Q1/T1 *STANDAR
产品类别半导体    嵌入式处理器和控制器   
文件大小2MB,共169页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
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MCIMX6S5EVM10ACR概述

Processors - Application Specialized MCIMX6S5EVM10AC/LFBGA624///REEL 13 Q1/T1 *STANDAR

MCIMX6S5EVM10ACR规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
NXP(恩智浦)
产品种类
Product Category
Processors - Application Specialized
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
MAPBGA-624
应用
Application
Commercial Applications
CoreARM Cortex A9
Number of Cores1 Core
Data Bus Width32 bit
Maximum Clock Frequency1 GHz
L1 Cache Instruction Memory32 kB
L1 Cache Data Memory32 kB
工作电源电压
Operating Supply Voltage
1.175 V to 1.5 V
最小工作温度
Minimum Operating Temperature
- 20 C
最大工作温度
Maximum Operating Temperature
+ 105 C
系列
Packaging
Reel
Memory TypeL1/L2 Cache, ROM, SRAM
Data RAM Size128 kB
Data ROM Size96 kB
接口类型
Interface Type
Ethernet, I2C, PCIe, SPI, UART, USB
I/O Voltage1.8 V, 2.8 V, 3.3 V
L2 Cache Instruction / Data Memory512 kB
Number of Timers/Counters1 x 32 bit
Processor Seriesi.MX 6Solo
工厂包装数量
Factory Pack Quantity
500
看门狗计时器
Watchdog Timers
Watchdog Timer
单位重量
Unit Weight
0.044181 oz

文档预览

下载PDF文档
NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SDLAEC
Rev. 8, 09/2017
MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB
MCIMX6SxAxxxxxC MCIMX6UxAxxxxxC
MCIMX6SxAxxxxxD MCIMX6UxAxxxxxD
i.MX 6Solo/6DualLite
Automotive and
Infotainment
Applications Processors
Package Information
Plastic Package
BGA Case 2240 21 x 21 mm, 0.8 mm pitch
Ordering Information
See
Table 1 on page 3
1
Introduction
1
The i.MX 6Solo/6DualLite automotive and infotainment
processors represent the latest achievement in integrated
multimedia-focused products offering high-performance
processing with a high degree of functional integration.
These processors are designed considering the needs of
the growing automotive infotainment, telematics, HMI,
and display-based cluster markets.
The processors feature advanced implementation of
single/dual ARM
®
Cortex
®
-A9 core, which operates at
speeds of up to 1 GHz. They include 2D and 3D graphics
processors, 1080p video processing, and integrated
power management. Each processor provides a 32/64-bit
DDR3/DDR3L/LPDDR2-800 memory interface and a
number of other interfaces for connecting peripherals,
such as WLAN, Bluetooth
®
, GPS, hard drive, displays,
and camera sensors.
2
3
4
5
6
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.3 Updated Signal Naming Convention . . . . . . . . . . . .9
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.1 Special Signal Considerations . . . . . . . . . . . . . . . .21
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .23
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .23
4.2 Power Supplies Requirements and Restrictions. . .33
4.3 Integrated LDO Voltage Regulator Parameters . . .34
4.4 PLL’s Electrical Characteristics. . . . . . . . . . . . . . . .37
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .38
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .45
4.8 Output Buffer Impedance Parameters . . . . . . . . . .49
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . .52
4.10 General-Purpose Media Interface (GPMI) Timing .64
4.11 External Peripheral Interface Parameters. . . . . . . .72
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .134
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . .134
5.2 Boot Device Interface Allocation. . . . . . . . . . . . . .135
Package Information and Contact Assignments . . . . . .136
6.1 Updated Signal Naming Convention . . . . . . . . . .136
6.2 21x21 mm Package Information . . . . . . . . . . . . . .137
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163
© 2012-2017 NXP B.V.

 
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