Microprocessors - MPU V2CORE
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | LBGA, BGA196,14X14,40 |
| Reach Compliance Code | unknown |
| ECCN代码 | 5A992 |
| Is Samacsys | N |
| 地址总线宽度 | 24 |
| 位大小 | 32 |
| 边界扫描 | YES |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 集成缓存 | YES |
| JESD-30 代码 | S-PBGA-B196 |
| 长度 | 15 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 196 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LBGA |
| 封装等效代码 | BGA196,14X14,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.5,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 速度 | 150 MHz |
| 最大供电电压 | 1.6 V |
| 最小供电电压 | 1.4 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper - with Nickel barrier |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 15 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
| MCF5270CVM150J | MCF5271CVM150 | MCF5270VM100J | MCF5270AB100 | MCF5271CVM150J | M5271EVBE | MCF5270CVM150 | MCF5270VM100 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microprocessors - MPU V2CORE | Microprocessors - MPU MCF5235 V2CORE | Microprocessors - MPU V2CORE 64KSRAM | Microprocessors - MPU MCF5232 V2CORE 64KSRAM | Microprocessors - MPU MCF5270 V2CORE | Development Boards & Kits - Other Processors MCF5270/71 EVAL BO | Microprocessors - MPU MCF5235 V2CORE | Microprocessors - MPU MCF5270 V2CORE 64KSRAM |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | LBGA, BGA196,14X14,40 | ROHS COMPLIANT, MAPBGA-196 | LBGA, BGA196,14X14,40 | ROHS COMPLIANT, PLASTIC, QFP-160 | LBGA, BGA196,14X14,40 | - | ROHS COMPLIANT, MAPBGA-196 | ROHS COMPLIANT, MAPBGA-196 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | - | unknown | unknown |
| ECCN代码 | 5A992 | 5A002.A | 5A992 | 5A992 | 5A002.A | - | 5A992 | 5A992 |
| Is Samacsys | N | N | N | N | - | - | N | N |
| 地址总线宽度 | 24 | 24 | 24 | 24 | 24 | - | 24 | 24 |
| 位大小 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | - | YES | YES |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | - | FIXED POINT | FIXED POINT |
| 集成缓存 | YES | YES | YES | YES | YES | - | YES | YES |
| JESD-30 代码 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PQFP-G160 | S-PBGA-B196 | - | S-PBGA-B196 | S-PBGA-B196 |
| 长度 | 15 mm | 15 mm | 15 mm | 28 mm | 15 mm | - | 15 mm | 15 mm |
| 低功率模式 | YES | YES | YES | YES | YES | - | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | - | 3 | 3 |
| 端子数量 | 196 | 196 | 196 | 160 | 196 | - | 196 | 196 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | - | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | LBGA | QFP | LBGA | - | LBGA | LBGA |
| 封装等效代码 | BGA196,14X14,40 | BGA196,14X14,40 | BGA196,14X14,40 | QFP160,1.2SQ | BGA196,14X14,40 | - | BGA196,14X14,40 | BGA196,14X14,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK | GRID ARRAY, LOW PROFILE | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 245 | 260 | - | 260 | 260 |
| 电源 | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | - | 1.5,3.3 V | 1.5,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 3.85 mm | 1.6 mm | - | 1.6 mm | 1.6 mm |
| 速度 | 150 MHz | 150 MHz | 100 MHz | 100 MHz | 150 MHz | - | 150 MHz | 100 MHz |
| 最大供电电压 | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | - | 1.6 V | 1.6 V |
| 最小供电电压 | 1.4 V | 1.4 V | 1.4 V | 1.4 V | 1.4 V | - | 1.4 V | 1.4 V |
| 表面贴装 | YES | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper - with Nickel barrier | Tin/Silver/Copper - with Nickel barrier | Tin/Silver/Copper - with Nickel barrier | Matte Tin (Sn) | Tin/Silver/Copper - with Nickel barrier | - | Tin/Silver/Copper - with Nickel barrier | Tin/Silver/Copper - with Nickel barrier |
| 端子形式 | BALL | BALL | BALL | GULL WING | BALL | - | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 0.65 mm | 1 mm | - | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | QUAD | BOTTOM | - | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 30 | 40 | - | 40 | 40 |
| 宽度 | 15 mm | 15 mm | 15 mm | 28 mm | 15 mm | - | 15 mm | 15 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
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