8-bit Microcontrollers - MCU 96KB Flash 12KB RAM
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | QFP |
| 包装说明 | 14 X 14 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 |
| 针数 | 100 |
| Reach Compliance Code | compliant |
| 具有ADC | YES |
| 其他特性 | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ |
| 地址总线宽度 | 20 |
| 位大小 | 16 |
| CPU系列 | PIC |
| 最大时钟频率 | 25 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-PQFP-G100 |
| JESD-609代码 | e3 |
| 长度 | 14 mm |
| 湿度敏感等级 | 1 |
| I/O 线路数量 | 70 |
| 端子数量 | 100 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFQFP |
| 封装等效代码 | TQFP100,.55SQ,16 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5,2.5/3.3 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 3808 |
| ROM（单词） | 98304 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 1.2 mm |
| 速度 | 41.67 MHz |
| 最大压摆率 | 21.6 mA |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| PIC18F96J65T-I/PT | PIC18F96J60T-I-PF | PIC18F96J60-I-PT | PIC18F97J60-I-PF | PIC18F86J60-I/PT | PIC18F96J65T-I/PF | PIC18F86J65T-I/PT | PIC18F96J60T-I/PT | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 8-bit Microcontrollers - MCU 96KB Flash 12KB RAM | 8-bit Microcontrollers - MCU 64KB FLSH 12KB RAM | 8-bit Microcontrollers - MCU 64KB Flash 10BASE-T Enet | 8-bit Microcontrollers - MCU 128KB FLASH 10BASE-T Enet | 8-bit Microcontrollers - MCU 64KB FL 12KB RAM 10BASE-T | 8-bit Microcontrollers - MCU 96KB FLSH 12KB RAM | 8位微控制器 -MCU 96KB FL 12KB RAM 10BASE-T | 8位微控制器 -MCU 64KB FLSH 12KB RAM |
| 是否无铅 | 不含铅 | - | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFP | - | - | - | QFP | QFP | QFP | QFP |
| 包装说明 | 14 X 14 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 | - | - | - | 12 X 12 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-80 | TFQFP, TQFP100,.63SQ | TFQFP, TQFP80,.55SQ | 14 X 14 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 |
| 针数 | 100 | - | - | - | 80 | 100 | 80 | 100 |
| Reach Compliance Code | compliant | - | - | - | compliant | compliant | compliant | compliant |
| 具有ADC | YES | - | - | - | YES | YES | YES | YES |
| 其他特性 | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ | - | - | - | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ |
| 位大小 | 16 | - | - | - | 16 | 16 | 16 | 16 |
| CPU系列 | PIC | - | - | - | PIC | PIC | PIC | PIC |
| 最大时钟频率 | 25 MHz | - | - | - | 41.6667 MHz | 41.67 MHz | 41.67 MHz | 25 MHz |
| DAC 通道 | NO | - | - | - | NO | NO | NO | NO |
| DMA 通道 | NO | - | - | - | NO | NO | NO | NO |
| JESD-30 代码 | S-PQFP-G100 | - | - | - | S-PQFP-G80 | S-PQFP-G100 | S-PQFP-G80 | S-PQFP-G100 |
| JESD-609代码 | e3 | - | - | - | e3 | e3 | e3 | e3 |
| 长度 | 14 mm | - | - | - | 12 mm | 14 mm | 12 mm | 14 mm |
| 湿度敏感等级 | 1 | - | - | - | 3 | 3 | 3 | 1 |
| I/O 线路数量 | 70 | - | - | - | 55 | 70 | 55 | 70 |
| 端子数量 | 100 | - | - | - | 80 | 100 | 80 | 100 |
| 最高工作温度 | 85 °C | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | - | - | - | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | - | - | - | TFQFP | TFQFP | TFQFP | TFQFP |
| 封装等效代码 | TQFP100,.55SQ,16 | - | - | - | TQFP80,.55SQ | TQFP100,.63SQ | TQFP80,.55SQ | TQFP100,.55SQ,16 |
| 封装形状 | SQUARE | - | - | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | - | - | - | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | - | - | - | 260 | 260 | 260 | 260 |
| 电源 | 2.5,2.5/3.3 V | - | - | - | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 3808 | - | - | - | 3808 | 3808 | 3808 | 3808 |
| ROM（单词） | 98304 | - | - | - | 65536 | 98304 | 98304 | 65536 |
| ROM可编程性 | FLASH | - | - | - | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1.2 mm | - | - | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 速度 | 41.67 MHz | - | - | - | 41.6667 MHz | 41.67 MHz | 41.67 MHz | 41.67 MHz |
| 最大压摆率 | 21.6 mA | - | - | - | 21.6 mA | 21.6 mA | 21.6 mA | 21.6 mA |
| 最大供电电压 | 3.6 V | - | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 2.7 V | - | - | - | 2.35 V | 2.35 V | 2.35 V | 2.7 V |
| 标称供电电压 | 3 V | - | - | - | 2.5 V | 2.5 V | 2.5 V | 3 V |
| 表面贴装 | YES | - | - | - | YES | YES | YES | YES |
| 技术 | CMOS | - | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | - | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | - | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | - | - | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | - | - | - | 40 | 40 | 40 | 40 |
| 宽度 | 14 mm | - | - | - | 12 mm | 14 mm | 12 mm | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | - | - | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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