MAXQ613
16-Bit Microcontroller with Infrared Module
General Description
The MAXQ613 is a low-power, 16-bit MAXQ
®
microcon-
troller designed for low-power applications including uni-
versal remote controls, consumer electronics, and white
goods. The device combines a powerful 16-bit RISC
microcontroller and integrated peripherals including a
universal synchronous/asynchronous receiver-transmit-
ter (USART) and an SPI master/slave communications
port, along with an IR module with carrier frequency
generation and flexible port I/O capable of multiplexed
keypad control.
The device includes 48KB of flash program memory and
1.5KB of data SRAM. Intellectual property (IP) protec-
tion is provided by a secure MMU that supports multiple
application privilege levels and protects code against
copying and reverse engineering. Privilege levels enable
vendors to provide libraries and applications to execute
on the device, while limiting access to only data and
code allowed by their privilege level.
For the ultimate in low-power battery-operated perfor-
mance, the device includes an ultra-low-power stop
mode (0.2µA typ). In this mode, the minimum amount of
circuitry is powered. Wake-up sources include external
interrupts, the power-fail interrupt, and a timer interrupt.
The microcontroller runs from a wide 1.70V to 3.6V oper-
ating voltage.
S
1.70V to 3.6V Operating Voltage
S
33 Total Instructions for Simplified Programming
S
Three Independent Data Pointers Accelerate Data
S
S
S
S
S
Features
S
High-Performance, Low-Power, 16-Bit RISC Core
S
DC to 12MHz Operation Across Entire Operating Range
S
Applications
Remote Controls
Battery-Powered
Portable Equipment
Consumer Electronics
Home Appliances
White Goods
S
Movement with Automatic Increment/Decrement
Dedicated Pointer for Direct Read from Code Space
16-Bit Instruction Word, 16-Bit Data Bus
16 x 16-Bit General-Purpose Working Registers
Secure MMU for Application Partitioning and IP
Protection
Memory Features
48KB Program Flash Memory
512-Byte Sectors
20,000 Erase/Write Cycles per Sector
Masked ROM Available
1.5KB Data SRAM
Additional Peripherals
Power-Fail Warning
Power-On Reset (POR)/Brownout Reset
Automatic IR Carrier Frequency Generation and
Modulation
Two 16-Bit Programmable Timers/Counters with
Prescaler and Capture/Compare
One SPI and One USART Port
Programmable Watchdog Timer
8kHz Nanopower Ring Oscillator Wake-Up Timer
Up to 24 General-Purpose I/Os
Low Power Consumption
0.2µA (typ), 2.0µA (max) in Stop Mode,
T
A
= +25NC, Power-Fail Monitor Disabled
3.25mA (typ) at 12MHz in Active Mode
Ordering Information/Selector Guide
PART
MAXQ613A-0000+
MAXQ613J-0000+
MAXQ613X-0000+
TEMP RANGE
0NC to +70NC
0NC to +70NC
0NC to +70NC
OPERATING
VOLTAGE (V)
1.7 to 3.6
1.7 to 3.6
1.7 to 3.6
PROGRAM
MEMORY (KB)
48 Flash
48 Flash
48 Flash
DATA
MEMORY (KB)
1.5
1.5
1.5
GPIO
20
24
24
PIN-PACKAGE
32 TQFN-EP*
44 TQFN-EP*
Bare die
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
MAXQ is a registered trademark of Maxim Integrated Products, Inc.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, go to:
www.maximintegrated.com/errata.
For pricing, delivery, and ordering information, please contact Maxim Direct at
1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
19-5320; Rev 4; 7/12
MAXQ613
16-Bit Microcontroller with Infrared Module
TABLE OF CONTENTS
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SPI Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Microprocessor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Stack Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Utility ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
IR Carrier Generation and Modulation Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Carrier Generation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
IR Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
IR Transmit—Independent External Carrier and Modulator Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
IR Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Carrier Burst-Count Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16-Bit Timers/Counters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
General-Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
On-Chip Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
ROM Loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Loading Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
In-Application Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
In-Circuit Debug and JTAG Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Power-Fail Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Applications Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Grounds and Bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Deviations from the MAXQ610 User’s Guide for the MAXQ613 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Development and Technical Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2
Maxim Integrated
MAXQ613
16-Bit Microcontroller with Infrared Module
LIST OF FIGURES
Figure 1. IR Transmit Frequency Shifting Example (IRCFME = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 2. IR Transmit Carrier Generation and Carrier Modulator Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 3. IR Transmission Waveform (IRCFME = 0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 4. External IRTXM (Modulator) Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 5. IR Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 6. Receive Burst-Count Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 7. SPI Master Communication Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 8. SPI Slave Communication Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 9. On-Chip Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 10. In-Circuit Debugger. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 11. Power-Fail Detection During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 12. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 13. Stop Mode Power-Fail Detection with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LIST OF TABLES
Table 1. Memory Areas and Associated Maximum Privilege Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 2. Watchdog Interrupt Timeout (Sysclk = 12MHz, CD[1:0] = 00). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. USART Mode Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 4. Power-Fail Detection States During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 5. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Maxim Integrated
3
MAXQ613
16-Bit Microcontroller with Infrared Module
ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
DD
with Respect to GND .....-0.3V to +3.6V
Voltage Range on Any Lead with
Respect to GND Except V
DD
............... -0.3V to (V
DD
+ 0.5V)
Continuous Power Dissipation (T
A
= +70NC)
32 TQFN (single-layer board)
(derate 21.3mW/NC above +70NC)..........................1702.1mW
32 TQFN (multilayer board)
(derate 34.5mW/NC above +70NC)..........................2758.6mW
44 TQFN (single-layer board)
(derate 27mW/NC above +70NC).............................2162.2mW
44 TQFN (multilayer board)
(derate 37mW/NC above +70NC)................................2963mW
Operating Temperature Range ............................. 0NC to +70NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (excluding dice; soldering, 10s) ......+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(V
DD
= V
RST
to 3.6V, T
A
= 0NC to +70NC, unless otherwise noted.) (Note 1)
PARAMETER
Supply Voltage
1.8V Internal Regulator
Power-Fail Warning Voltage for
Supply
Power-Fail Reset Voltage
POR Voltage
RAM Data-Retention Voltage
Active Current
SYMBOL
V
DD
V
REG18
V
PFW
V
RST
V
POR
V
DRV
I
DD_1
I
S1
Stop-Mode Current
I
S2
Current Consumption During
Power-Fail
Power Consumption During
POR
Stop-Mode Resume Time
Power-Fail Monitor Startup
Time
Power-Fail Warning Detection
Time
Input Low Voltage for IRTX,
IRRX,
RESET,
and All Port Pins
Input High Voltage for IRTX,
IRRX,
RESET,
and All Port Pins
Power-Fail On
Monitors V
DD
(Note 2)
Monitors V
DD
(Note 3)
Monitors V
DD
(Note 4)
Sysclk = 12MHz (Note 5)
Power-Fail Off
T
A
= +25NC
T
A
= 0°C to +70NC
T
A
= +25NC
T
A
= 0°C to +70NC
CONDITIONS
MIN
V
RST
1.62
1.75
1.64
1
1.0
3.25
0.2
0.2
22
27.6
[(3 x I
S2
) +
((PCI - 3) x (I
S1
+
I
NANO
))]/PCI
100
375 + (8192 x
t
HFXIN)
(Note 4)
(Note 8)
10
V
GND
0.7 x V
DD
0.3 x V
DD
V
DD
150
4
2.0
8
29.5
42
FA
FA
1.8
1.8
1.67
TYP
MAX
3.6
1.98
1.85
1.70
1.42
UNITS
V
V
V
V
V
V
mA
I
PFR
(Note 6)
I
POR
t
ON
t
PFM_ON
t
PFW
V
IL
V
IH
(Note 7)
nA
Fs
Fs
Fs
V
V
4
Maxim Integrated
MAXQ613
16-Bit Microcontroller with Infrared Module
RECOMMENDED OPERATING CONDITIONS (continued)
(V
DD
= V
RST
to 3.6V, T
A
= 0NC to +70NC, unless otherwise noted.) (Note 1)
PARAMETER
Input Hysteresis (Schmitt)
Input Low Voltage for HFXIN
Input High Voltage for HFXIN
IRRX Input Filter Pulse-Width
Reject
IRRX Input Filter Pulse-Width
Accept
Output Low Voltage for IRTX
SYMBOL
V
IHYS
V
IL_HFXIN
V
IH_HFXIN
t
IRRX_R
t
IRRX_A
V
DD
= 3.6V, I
OL
= 25mA (Note 3)
V
OL_IRTX
V
DD
= 2.35V, I
OL
= 10mA (Note 3)
V
DD
= 1.85V, I
OL
= 4.5mA
V
DD
= 3.6V, I
OL
= 11mA (Note 3)
V
DD
= 2.35V, I
OL
= 8mA (Note 3)
V
DD
= 1.85V, I
OL
= 4.5mA
V
OH
C
IO
I
L
R
PU
I
OH
= -2mA
(Note 4)
Internal pullup disabled
V
DD
= 3.0V, V
OL
= 0.4V (Note 4)
V
DD
= 2.0V, V
OL
= 0.4V
-100
16
17
1
1/f
HFXIN
From initial oscillation
(Note 4)
0.5
DC
1/f
XCLK
45
f
HFXIN
HFXOUT = GND
f
XCLK
1/f
CK
T
A
= +25NC
Nanopower Ring Frequency
Nanopower Ring Duty Cycle
Nanopower Ring Current
f
NANO
t
NANO
I
NANO
T
A
= +25NC, V
DD
= POR voltage
(Note 4)
(Note 4)
Typical at V
DD
= 1.64V,
T
A
= +25°C (Note 4)
3.0
1.7
40
40
8.0
2.4
60
400
20.0
kHz
%
nA
55
8192 x
t
HFXIN
1.0
1.5
12
28
30
V
DD
- 0.5
0.4
0.4
0.4
300
1.0
1.0
1.0
0.5
0.5
0.5
V
DD
15
+100
39
41
12
V
pF
nA
kW
MHz
ns
ms
MW
MHz
ns
%
MHz
ns
V
V
CONDITIONS
V
DD
= 3.3V, T
A
= +25NC
V
GND
0.7 x V
DD
MIN
TYP
300
0.3 x V
DD
V
DD
50
MAX
UNITS
mV
V
V
ns
ns
Output Low Voltage for
RESET
and All Port Pins (Note 9)
Output High Voltage for IRTX
and All Port Pins
Input/Output Pin Capacitance
for All Port Pins
Input Leakage Current
Input Pullup Resistor for
RESET,
IRTX, IRRX, P0, P1, P2
Crystal/Resonator
Crystal/Resonator Period
Crystal/Resonator Warmup
Time
Oscillator Feedback Resistor
EXTERNAL CLOCK INPUT
External Clock Frequency
External Clock Period
External Clock Duty Cycle
System Clock Frequency
System Clock Period
NANOPOWER RING
V
OL
EXTERNAL CRYSTAL/RESONATOR
f
HFXIN
t
HFXIN
t
XTAL_RDY
R
OSCF
f
XCLK
t
XCLK
t
XCLK_DUTY
(Note 4)
f
CK
t
CK
Maxim Integrated
5
PCB设计
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
