Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
0°
Symbol
I
E
I
inH
I
inL
V
OH
V
OL
V
IH
V
IL
Characteristic
Power Supply Current
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Pin 9
All Other Inputs
Min
−
−
−
0.5
−1.02
−1.95
−1.17
−1.95
Max
29
900
500
−
−0.84
−1.63
−0.84
−1.48
Min
−
−
−
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
26
560
310
−
−0.81
−1.63
−0.81
−1.48
Min
−
−
−
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
29
560
310
−
−0.735
−1.60
−0.735
−1.45
Unit
mA
mA
mA
Vdc
Vdc
Vdc
Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50
W
resistor to
−2.0
V.
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2
MC10H100
Table 3. AC CHARACTERISTICS
0°
Symbol
t
pd
t
r
t
f
Propagation Delay
Rise Time
Fall Time
Characteristic
Pin 9 Only
Exclude Pin 9
Min
0.65
0.4
0.5
0.5
Max
1.6
1.3
2.0
2.0
Min
0.7
0.45
0.5
0.5
25°
Max
1.7
1.35
2.1
2.1
Min
0.7
0.5
0.5
0.5
75°
Max
1.8
1.5
2.2
2.2
Unit
ns
ns
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
Device
MC10H100M
MC10H100MG
MC10H100MEL
MC10H100MELG
MC10H100L
MC10H100P
MC10H100PG
Package
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
CDIP−16
PDIP−16
PDIP−16
(Pb−Free)
Shipping
†
50 Unit / Rail
50 Unit / Rail
2000 / Tape & Reel
2000 / Tape & Reel
25 Unit / Rail
25 Unit / Rail
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H100
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
16
9
L
E
Q
1
E H
E
M
_
L
DETAIL P
1
8
Z
D
A
VIEW P
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A
1
b
c
D
E
e
H
E
L
L
E
M
Q
1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
_
0
_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
_
0
_
0.028
0.035
−−−
0.031
e
b
0.13 (0.005)
M
A
1
0.10 (0.004)
−A−
16
9
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620−10
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
−−−
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
−−−
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
−B−
1
8
C
L
−T−
SEATING
PLANE
N
E
F
D
G
16 PL
K
M
J
16 PL
0.25 (0.010)
M
M
T B
S
0.25 (0.010)
T A
S
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4
MC10H100
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
9
−A−
16
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
−T−
H
K
G
D
16 PL
SEATING
PLANE
J
T A
M
M
0.25 (0.010)
M
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone:
480−829−7710 or 800−344−3860 Toll Free USA/Canada
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480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email:
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USA/Canada
Japan:
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