Operational Amplifiers - Op Amps Low Voltage 1.8-5.5V 10mA; 1.1 slew rate
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ROHM(罗姆半导体) |
零件包装代码 | SOIC |
包装说明 | SOP-8 |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 9 weeks |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
标称共模抑制比 | 60 dB |
频率补偿 | YES |
最大输入失调电压 | 10000 µV |
JESD-30 代码 | R-PDSO-G8 |
长度 | 5 mm |
低-偏置 | YES |
低-失调 | NO |
微功率 | YES |
功能数量 | 2 |
端子数量 | 8 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LSOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-0.9/+-2.75/1.8/5.5 V |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
标称压摆率 | 1.1 V/us |
最大压摆率 | 1.2 mA |
供电电压上限 | 7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
标称均一增益带宽 | 2000 kHz |
最小电压增益 | 3160 |
宽度 | 4.4 mm |
Base Number Matches | 1 |
BU7262SF-E2 | BU7262FVM-TR | BU7262NUX-TR | BU7262F-E2 | BU7261SG-TR | BU7264SFV-E2 | BU7262SNUX-TR | BU7264FV-E2 | |
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描述 | Operational Amplifiers - Op Amps Low Voltage 1.8-5.5V 10mA; 1.1 slew rate | Operational Amplifiers - Op Amps Low Voltage 1.8-5.5V 10mA; 1.1 slew rate | Operational Amplifiers - Op Amps FULL SWING OP AMP LO VOLT CMOS | Operational Amplifiers - Op Amps Low Voltage 1.8-5.5V 10mA; 1.1 slew rate | Operational Amplifiers - Op Amps Low Voltage 1.8-5.5V 10mA; 1.1 slew rate | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Input-Output Full Swing | Operational Amplifiers - Op Amps OP Amp Dual GP 5.5V +/-2.75V | Operational Amplifiers - Op Amps ICs, Amplifiers & Linear, Operational Amplifiers, High Speed, Input-Output Full Swing |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 |
厂商名称 | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
零件包装代码 | SOIC | MSOP | SON | SOIC | SSOP | - | SON | - |
包装说明 | SOP-8 | VSSOP, TSSOP8,.16 | HVSON, SOLCC8,.11,20 | SOP-8 | SSOP-5 | - | HVSON, SOLCC8,.11,20 | LSSOP, |
针数 | 8 | 8 | 8 | 8 | 5 | - | 8 | - |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | - | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
Factory Lead Time | 9 weeks | 9 weeks | 9 weeks | 9 weeks | 9 weeks | - | 9 weeks | 9 weeks |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | - |
标称共模抑制比 | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB | - | 60 dB | 60 dB |
频率补偿 | YES | YES | YES | YES | YES | - | YES | - |
最大输入失调电压 | 10000 µV | 10000 µV | 10000 µV | 10000 µV | 10000 µV | - | 10000 µV | 10000 µV |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G5 | - | R-PDSO-N8 | R-PDSO-G14 |
长度 | 5 mm | 2.9 mm | 3 mm | 5 mm | 2.9 mm | - | 3 mm | 5 mm |
低-偏置 | YES | YES | YES | YES | YES | - | YES | - |
低-失调 | NO | NO | NO | NO | NO | - | NO | - |
微功率 | YES | YES | YES | YES | YES | - | YES | - |
功能数量 | 2 | 2 | 2 | 2 | 1 | - | 2 | 4 |
端子数量 | 8 | 8 | 8 | 8 | 5 | - | 8 | 14 |
最高工作温度 | 105 °C | 85 °C | 85 °C | 85 °C | 105 °C | - | 105 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LSOP | VSSOP | HVSON | LSOP | LSSOP | - | HVSON | LSSOP |
封装等效代码 | SOP8,.25 | TSSOP8,.16 | SOLCC8,.11,20 | SOP8,.25 | TSOP5/6,.11,37 | - | SOLCC8,.11,20 | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
电源 | +-0.9/+-2.75/1.8/5.5 V | +-0.9/+-2.75/1.8/5.5 V | +-0.9/+-2.75/1.8/5.5 V | +-0.9/+-2.75/1.8/5.5 V | +-0.9/+-2.75/1.8/5.5 V | - | +-0.9/+-2.75/1.8/5.5 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
座面最大高度 | 1.6 mm | 0.9 mm | 0.6 mm | 1.6 mm | 1.25 mm | - | 0.6 mm | 1.35 mm |
标称压摆率 | 1.1 V/us | 1.1 V/us | 1.1 V/us | 1.1 V/us | 1.1 V/us | - | 1.1 V/us | 1.1 V/us |
最大压摆率 | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 0.6 mA | - | 1.2 mA | - |
供电电压上限 | 7 V | 7 V | 7 V | 7 V | 7 V | - | 7 V | 7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | - | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | - | NO LEAD | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 0.5 mm | 1.27 mm | 0.95 mm | - | 0.5 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
标称均一增益带宽 | 2000 kHz | 2000 kHz | 2000 kHz | 2000 kHz | 2000 kHz | - | 2000 kHz | 2000 kHz |
最小电压增益 | 3160 | 3160 | 3160 | 3160 | 3160 | - | 3160 | - |
宽度 | 4.4 mm | 2.8 mm | 2 mm | 4.4 mm | 1.6 mm | - | 2 mm | 4.4 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
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